SLA3304DT6 LEIDITECH

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

Applications

Mechanical Characteristics Absolute Maximum Ratings (Tamb=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppp 150 W ESD per IEC 61000−4−2 (Air) V ESD ±30 Kv ESD per IEC 61000−4−2 (Contact) ±30 Operating Temperature Range T J -55 to +125 Storage Temperature Range T STJ -55 to +150 LOW VOLTAGE TVS DIODE ARRAY FOR LVDS SIGNAL LINES PROTECTION SLA3304DT6 Cellular Handsets and Accessories Cordless Phones I C Bus Protection Portable instrumentation Personal Digital Assistant (PDA) Microcontroller Input Protection

150 Watts Peak Pulse Power per Line (tp=8/20µs)

Protects Four Bidirectional I/O Lines Low Clamping Voltage Working Voltages : 3.3V Low Leakage Current IEC61000-4-2 (ESD) ±30kV (air), ±30kV (contact) IEC61000-4-4 (EFT) 40A (5/50ηs) IEC61000-4-5 (LIGHTING) 30A (8/20μs) Molding Compound Flammability Rating : UL 94V-O Weight 16.0 Millgrams (Approximate) Quantity Per Reel : 3,000pcs Reel Size : 7 inch Lead Finish : Lead Free Rev : www.leiditech.com 01.06.2017 1/6

Electrical Characteristics

(TA=25°C unless otherwise specified) Part Number Device Marking V RWM (V) V BR (V) I T (mA) V C @1A Vc I R μA (Max) C (Pf) (Typ.) (Max) (@A) LA3 3.3 3.8 1 6 11.8 13 0.1 16 SLA3304DT6 SLA3304DT6 Rev : www.leiditech.com 01.06.2017 2/6

8 x 20μs Waveform Clamping Voltage vs. Peak Pulse Current (tp=8/20us) SLA3304DT6 Rev : www.leiditech.com 01.06.2017 3/6

Figure 4. Typic Capacitance vs. Reverse Voltage

Circuit Board Layout Recommendations Rev : www.leiditech.com 01.06.2017 5/6

Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Inches Millimeters Symbol Min. Nom. Max. Min. Nom. Max. A 0.035 - 0.057 0.90 - 1.45 0.000 0.006 0.00 0.15 b 0.010 0.020 0.25 0.50 c 0.003 - 0.009 0.08 - 0.22 D 0.110 0.114 0.122 2.80 2.90 3.10 E

0.110 BSC

2.80 BSC

e 0.037 BSC 0.95 BSC

0.075 BSC

1.90 BSC

(0.024) (0.60) aaa 0.004 0.10 bbb 0.008 0.20 ccc 0.008 0.20 Symbol Inches Millimeters C (0.098) (2.50) G 0.055 1.40 P 0.037 0.95 X 0.024 0.60 Y 0.043 1.10 Z 0.141 3.60 Soldering Footprint θ Rev : www.leiditech.com 01.06.2017 6/6 SLA3304DT6