SK52B-L LEIDITECH
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- High Current Capability
- For Surface Mount Applications
- Higher Temp Soldering : 260 for 10 Seconds At Terminals
- Available on Tape and Reel Maximum Ratings MCC Catalog Number Device Marking Maximum Reccurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage SK52B-L SK52B 20V 14V 20V SK53B-L SK53B 30V 21V 30V SK54B-L SK54B 40V 28V 40V SK55B-L SK55B 50V 35V 50V SK56B-L SK56B 60V 42V 60V SK58B-L SK58B 80V 56V 80V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current I F(AV) 5.0A T A = 120°C Peak Forward Surge Current I FSM 100A 8.3ms, half sine Maximum Instantaneous Forward Voltage V F .55V .75V I FM = 5.0A; T J = 25°C Maximum DC Reverse Current At Rated DC Blocking Voltage I R 1.0mA 20mA T J = 25°C T J = 100°C Typical Junction Capacitance C J 200pF Measured at 1.0MHz, V R =4.0V *Pulse test: Pulse width 200 µsec, Duty cycle 2% SK58B-L~510B-L .85V SK52B-L~54B-L SK55B-L~56B-L DO-214AA (SMB) (LEAD FRAME)
- Operating Temperature: -55 O C to +150 O C
- Storage Temperature: -55 O C to +150 O C
- Maximum Thermal Resistance; 16 O C/W Junction To Lead 55°C/W Junction To Ambient SK510B-L SK510B 100V 70V 100V A B D C E F G H DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .160 .185 4.06 4.70 B .130 .155 3.30 3.94 C .006 .012 0.15 0.31 E .200 .220 5.08 5.59 F .079 .096 2.00 2.44 G .075 .087 1.91 2.21 H .002 .008 0.05 0.203 0.050” 0.106" 0.083” SUGGESTED SOLDER PAD LAYOUT
- Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
- Epoxy meets UL 94 V-0 flammability rating
- Moisture Sensitivity Level 1 Rev : www.leiditech.com 01.06.2015 1/3