SFH5400

SFH5400 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 7

Technical content

Features

 Suitable for applications from 500 nm to 900 nm  Photodiode with built-in Schmitt trigger  SMT package  TTL and CMOS compatible  Output: push-pull

Applications

 Optoelectronic switch  Interrupter  Pulse former  Photoelectric counter

Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 85 °C Versorgungsspannung Supply voltage VCC – 0.5 … 15 V Ausgangsspannung Output voltage VO – 0.5 … 15 V Ausgangsstrom Output current Iq – 25 … 40 mA Ausgangsleistung TA = 25 °C Total output power Pq 100 mW Kennwerte Characteristics TA = – 40 … 85 °C, VCC = 4.5 … 15 V, Ee = 3.2 … 10 mW/cm 2 TA = 25 °C, VCC = 5 V, Ee = 6.5 mW/cm2 for typical values Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit typ. Limit Schwelle Bestrahlungsstärke Threshold radiant intensity (Ausgang L → H) (Output L → H) λ = 660 nm EeSchw 1.3 – mW/cm2 Min. Bestrahlungsstärke, Ausgang H Min. radiant intensity, Output H λ = 660 nm EeHmin – < 3.2 mW/cm2 Max. Bestrahlungsstärke, Ausgang L Max. radiant intensity, Output L λ = 660 nm EeLmax – > 0.16 mWcm2 Hysterese Hysteresis ∆Ee > 0.2 – mW/cm2 Ausgangsspannung L Output voltage L IOL = 6.4 mA VOL 0.15 < 0.5 V

IOH = – 2.6 mA VOH VCC – 1.8 > 2.4 V Ausgangsleckstrom (VO > VCC = 4.5 V) Output leakage current (VO > VCC = 4.5 V) VO = 5.5 V VO = 15 V IOHH 0.2 0.25 < 100 < 500 µA Kurzschlußstrom L Short-circuit current L tp < 10 ms, Ee = 0; VCC = VO = 5.5 V VCC = VO = 15 V IOSL > 25 > 40 mA Kurzschlußstrom H Short-circuit current H tp < 10 ms, V0 = GND; VCC = 5.5 V VCC = 15 V IOSH – 22 – 45 < – 10 < – 25 mA Versorgungsstrom L Supply current L Ee = 0; VCC = 5.5 V VCC = 15 V ICCL 3.5 < 6 < 7.5 mA Versorgungsstrom Supply current L VCC = 5.5 V VCC = 15 V ICCH 3.4 3.8 < 5 < 6 mA Ausgangsverzögerungszeit1) Ausgang H → L Output delay time1) Output H → L tPHL 200 – ns Ausgangsverzögerungszeit1) Ausgang L → H Output delay time1) Output L → H tPLH 200 – ns Kennwerte Characteristics (cont’d) TA = – 40 … 85 °C, VCC = 4.5 … 15 V, Ee = 3.2 … 10 mW/cm 2 TA = 25 °C, VCC = 5 V, Ee = 6.5 mW/cm2 for typical values Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit typ. Limit

Anstiegszeit Ausgang (10% → 90%) Rise time output (10% → 90%) tr 30 – ns Abfallzeit Ausgang (90% → 10%) Fall time output (90% → 10%) tf 10 – ns 1) Gemessen von 50% Punkt der ansteigenden Flanke Eingangspuls bis zu 1,3 V Punkt der ansteigenden Flanke Ausgangspuls (tPLH), bzw. von 50% Punkt der abfallenden Flanke Eingangspuls bis zu 1,3 V Punkt der abfallenden Flanke Ausgangspuls (tPHL). 1) Measured from 50% of the rising edge of the input pulse to 1.3 V of the rising edge of the output pulse (tPLH) or from 50% of the descending edge input pulse to 1.3 V of the descending output pulse edge ( tPHL), respectively. Funktionsbereich Functional Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 85 °C Versorgungsspannung Supply voltage VCC 4.5 … 15 V Kennwerte Characteristics (cont’d) TA = – 40 … 85 °C, VCC = 4.5 … 15 V, Ee = 3.2 … 10 mW/cm 2 TA = 25 °C, VCC = 5 V, Ee = 6.5 mW/cm2 for typical values Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit typ. Limit OHF00358 GND OUT VCC Amplifier Trigger Schmitt Shield

VO = f (VCC, IC) Output Characteristics Voh = f (Ioh), VCC = 5 V V OHF00351 CC OV 0 51 0 15 V V I ch =m A0 2.6 mAI =ch I OHF00354 oh 3.20 ohV 0.01 0.10 1 10 3.25 3.30 3.35 3.40 3.45 3.50 V 3.60 mA 3.55 Rel. Threshold Ee/Ee(VCC = 5 V) V OHF00352 CC 0.96 eE 0 5 10 15V 0.97 0.98 0.99 1.00 1.01 1.02 Ee (VCC = 5 V) Switching Threshold λ OHF00353 Threshold 400 500 600 700 mm 900 0.2 0.4 0.6 0.8 1.0 1.2 1.4 mW/cm 1.8 H 1.6 <_L LH _<

Maßzeichnung Package Outlines Maße in mm, wenn nicht anders angegeben / Dimensions in mm, unless otherwise specified. Empfohlenes Lötpaddesign Recommended Solderpad Design GEO06966 4.5 4.3 2.54 mm 4.0 3.7 1.1 0.9 Photosensitive area 0.5 x 0.5 OUT 6.7 6.2 1.1 1.2 0...5˚ 1.1 0.9 0.3 Chip position spacing GND VCC 0...0.1 0...0.1 OHF02528 Paddesign for improved heat dissipation verbesserte Wärmeableitung Padgeometrie für 41.8 1.8 1.5 Component location on pad Bauteil positioniert 2.54 1.5

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B) Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. OHLA0687 T t s 120 s max 100 150 200 250 300 Ramp Up 100 s max 50 100 150 200 250 300 Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C 30 s max 260 ˚C+0 ˚C -5 ˚C 245 ˚C±5 ˚C 240 ˚C 255 ˚C 217 ˚C Maximum Solder Profile Recommended Solder Profile 235 ˚C-0 ˚C +5 ˚C Minimum Solder Profile 10 s min min. condition for IR Reflow Soldering: solder point temperature ≥ 235 °C for at least 10 sec.