SFH484_10 OSRAM

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Features

 Very highly efficient GaAlAs-LED  High reliability  UL version available  Spectral match with silicon photodetectors  Available on tape and reel (in Ammopack)  Available in bins S F H 484: Same package as LD 274 S F H 485: Same package as SFH 300, SFH 203

Applications

 IR remote controls  Smoke detectors  Sensor technology  Discrete interrupters

SFH 484, SFH 485 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Durchlaßstrom Forward current IF 100 mA Stoßstrom, tp = 10 μs, D = 0 Surge current IFSM 2.5 A Verlustleistung Power dissipation Ptot 200 mW Wärmewiderstand, freie Beinchenlänge max. 10 mm Thermal resistance, lead length between package bottom and PC-board max. 10 mm RthJA 375 K/W

SFH 484, SFH 485 2010-11-29 3 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA λpeak 880 nm Spektrale Bandbreite bei 50% von Irel Spectral bandwidth at 50% of Irel IF = 100 mA Δλ 80 nm Abstrahlwinkel Half angle SFH 484 SFH 485 ϕ ϕ ± 8 ± 20 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L × B L × W 0.3 × 0.3 mm² Abstand Chipoberfläche bis Linsenscheitel Distance chip front to lens top SFH 484 SFH 485 H H 5.1 … 5.7 4.2 … 4.8 mm mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr, tf 0.6/0.5 μs Kapazität Capacitance VR = 0 V, f = 1 MHz Co 15 pF Durchlaßspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs VF VF 1.50 (≤ 1.8) 3.00 (≤ 3.8) V V Sperrstrom, Reverse current VR = 5 V IR 0.01 (≤ 1) μA Gesamtstrahlungsfluß, Total radiant flux IF = 100 mA, tp = 20 ms Φe 25 mW

SFH 484, SFH 485 Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA TCI – 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 2 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ 0.25 nm/K Gruppierung der Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.001 sr bei SFH 484 bzw. Ω = 0.01 sr bei SFH 485 Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.001 sr at SFH 484 or Ω = 0.01 sr at SFH 485 Bezeichnung Parameter Symbol Wert Value Einheit Unit SFH 484 SFH 484-1 SFH 484-2 SFH 485 SFH 485-2 Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 100 160 100 mW/sr mW/sr Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit

SFH 484, SFH 485 2010-11-29 5 Radiation Characteristics, SFH 484 Ιrel = f (ϕ) Radiation Characteristics SFH 485 Ιrel = f (ϕ) OHR01891 02 0 40 60 80 100 1200.40.60.81.0 100 010203040 0.2 0.4 0.6 0.8 1.0ϕ OHR01892 02 0 40 60 80 100 1200.40.60.81.0 100 010203040 0.2 0.4 0.6 0.8 1.0ϕ

SFH 484, SFH 485 2010-11-29 6 Relative Spectral Emission Irel = f (λ) Forward Current IF = f (VF), single pulse, tp = 20 μs 750 Ι rel OHR00877 800 850 900 950 nm 1000 100 λ OHR00881 FV -210 -110 010 110 01 2 3 4 5 6 V 8 AΙ F Radiant Intensity Single pulse, tp = 20 μs Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter Ie Ie 100 mA = f (IF) OHR00878 Ι e FΙ -210 -110 010 110 210 010 10 1 10 2 10 4mA eΙ (100mA) 310 Ι F OHR00886 210 310 410 mA -510 s FΙ T DC 0.005=D pt T t p pt 0.5 0.2 0.1 0.01 0.02 0.05 10-4 10-3 10-2 10-1 100 101 102 Max. Permissible Forward Current IF = f (TA) Forward Current vs. Lead Length between the Package Bottom and the PC-Board IF = f (l), TA = 25 °×C T OHR00880 FΙ 0 20 40 60 80 100˚C mA 100 125 OHR00949 FΙ 0 5 10 15 20 25 mm 30 100 mA 120

SFH 484, SFH 485 2010-11-29 7 Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). 5.7 (0.224) 5.1 (0.201) 1.8 (0.071) 1.2 (0.047) Chip position GEXY6271 Cathode 5.9 (0.232) 5.5 (0.217) 0.6 (0.024) 0.4 (0.016) 0.6 (0.024) 0.4 (0.016) spacing 2.54 (0.100) 0.8 (0.031) 0.5 (0.020) 29 (1.142) 27 (1.063) 9.0 (0.354) 8.2 (0.323) 7.5 (0.295) 7.8 (0.307) Area not flat ø4.8 (0.189) ø5.1 (0.201) SFH 484 ø5.1 (0.201) ø4.8 (0.189) 7.8 (0.307) 7.5 (0.295) 9.0 (0.354) 8.2 (0.323) 4.8 (0.189) 4.2 (0.165) 1.5 (0.059) Chip position GEXY6305 Cathode spacing 2.54 (0.100) 0.4 (0.016) 0.6 (0.024) 27 (1.063) 29 (1.142) 0.5 (0.020) 0.8 (0.031) Area not flat 0.4 (0.016) 0.6 (0.024) 5.5 (0.217) 5.9 (0.232) SFH 485

SFH 484, SFH 485 Empfohlenes Lötpaddesign Wellenlöten (TTW) Recommended Solder Pad TTW Soldering Maße in mm (inch) / Dimensions in mm (inch). 4 (0.157) OHLPY985 4.8 (0.189)

SFH 484, SFH 485 2010-11-29 9 Lötbedingungen Soldering Conditions Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

Click to View Pricing, Inventory, Delivery & Lifecycle Information: Osram Opto Semiconductor: SFH 484-2 E7517 SFH 484 SFH 484-2 SFH 485 SFH 485-2