SFH421_02 OSRAM

Document overview

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Technical content

Features

 Very highly efficient GaAIAs-LED  Good Linearity (Ie = f [IF]) at high currents  DC (with modulation) or pulsed operations are possible  High reliability  High pulse handling capability  Suitable for surface mounting (SMT)  Available on tape and reel  SFH 421 same package as SFH 320 SFH 426 same package as SFH 325  SFH 426: Suitable only for IR-reflow soldering.

Applications

 Miniature photointerrupters  Industrial electronics  For drive and control circuits  Automotive technology  Sensor technology  Alarm and safety equipment  IR free air transmission

SFH 421, SFH 426 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40… + 100 °C Sperrspannung Reverse voltage VR 5V Durchlaßstrom Forward current IF 100 mA Stoßstrom, τ = 10 µs, D = 0 Surge current IFSM 2.5 A Verlustleistung Power dissipation Ptot 180 mW Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block RthJA RthJS 450 ≈ 200 K/W K/W

SFH 421, SFH 426 2002-03-14 3 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms λpeak 880 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A ∆λ 80 nm Abstrahlwinkel Half angle ϕ± 60 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm 2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L × B L × W 0.3× 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr, tf 0.5 µs Kapazität, Capacitance VR = 0 V, f = 1 MHz C o 15 pF Durchlaßspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs VF VF 1.5 (≤ 1.8) 3.0 (≤ 3.8) V V Sperrstrom, Reverse current VR = 5 V IR 0.01 (≤ 1) µA Gesamtstrahlungsfluß, Total radiant flux IF = 100 mA, tp = 20 ms Φ e 23 mW Temperaturkoeffizient von Ie bzw. Φ e, IF = 100 mA Temperature coefficient of Ie or Φ e, IF = 100 mA TC I – 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TC V – 2m V / K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TC λ + 0.25 nm/K

SFH 421, SFH 426 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie > 4 mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 48 mW/sr

SFH 421, SFH 426 2002-03-14 5 Relative Spectral Emission Irel = f (λ) Forward Current IF = f (VF) single pulse, tp = 20 µs Radiation Characteristics Sel = f (ϕ) 750 Ιrel OHR00877 800 850 900 950 nm 1000 100 λ OHR00881 FV -210 -110 010 110 01 2 3 4 5 6 V 8 AΙF 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚ Radiant Intensity Single pulse, tp = 20 µs Permissible Pulse Handling Capability IF = f (tp), TA = 25 °C duty cycle D = parameter Ιe Ιe 100 mA = f (IF) OHR00878 Ιe FΙ -210 -110 010 110 210 010 10 1 10 2 10 4mA eΙ (100mA) 310 ΙF OHR00886 210 310 410 mA -510 s FΙ T DC 0.005=D pt T tp pt 0.5 0.2 0.1 0.01 0.02 0.05 10-4 10-3 10-2 10-1 100 101 102 Max. Permissible Forward Current IF = f (TA) OHR00883 FΙ 100 120 20 40 60 80 100 120 mA TA R thjA= 450 K/W

SFH 421, SFH 426 Ma ßzeichnung Package Outlines Ma ße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). SFH 421 GPLY6724 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) Cathode marking 3.0 (0.118) 3.4 (0.134) (2.4) (0.095) 0.1 (0.004) (typ.) 4˚±1 SFH 426 GPLY6880 (R1) Cathode marking Cathode Anode (2.4 (0.094)) 2.8 (0.110) 2.4 (0.094) 4.2 (0.165) 3.8 (0.150) 0.9 (0.035) 1.1 (0.043) spacing 2.54 (0.100) (1.4 (0.055)) (0.3 (0.012)) 3.4 (0.134) 3.8 (0.150) 3.8 (0.150) 4.2 (0.165) (2.9 (0.114))

SFH 421, SFH 426 2002-03-14 7 Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us. Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. Löthinweise Soldering Conditions Bauform Types Tauch-, Schwall- und Schlepplötung Dip, Wave and Drag Soldering Reflowlötung Reflow Soldering Lötbad- temperatur Temperature of the Soldering Bath Maximal zulässige Lötzeit Max. Perm. Soldering Time Abstand Lötstelle – Geh äuse Distance between Solder Joint and Case Lötzonen- temperatur Temperature of Soldering Zone Maximale Durchlaufzeit Max. Transit Time TOPLED SIDELED 260 °C 260 °C 8 s 8 s 245 °C 245 °C 10 s 10 s