SFH4256 OSRAM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 13
Technical content
High Power Infrared Emitter (850 nm) Version 1.4 SFH 4256
Ordering Information
Features: High Power Infrared LED
- Short switching time
- The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualific ation for Automotive Grade Discrete Semiconductors.
Applications
Infrared Illumination for cameras
- IR data transmission
- Sensor technology Notes Depending on the mode of operation, these devices e mit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which i ncorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Type: Radiant Intensity Ordering Code Ie [mW/sr] IF = 70 mA, t p = 20 ms SFH 4256 13 (≥ 6.3) Q65111A3182 SFH 4256-R 10 ... 20 Q65111A9682 Note: Measured at a solid angle of Ω = 0.01 sr
Version 1.4 SFH 4256 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operation and storage temperature range T op ; T stg -40 ... 100 °C Reverse voltage VR 5 V Forward current IF 70 mA Surge current (tp = 100 µs, D = 0) IFSM 0.7 A Power consumption P tot 140 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 kV Thermal resistance junction - ambient 1) page 12 RthJA 500 K / W Thermal resistance junction - soldering point 2) page 12 RthJS 280 K / W Parameter Symbol Values Unit Peak wavelength (IF = 70 mA, t p = 20 ms) (typ) λ peak 860 nm Centroid wavelength (IF = 70 mA, t p = 20 ms) (typ) λ centroid 850 nm Spectral bandwidth at 50% of I max (IF = 70 mA, t p = 20 ms) (typ) ∆λ 30 nm Half angle (typ) ϕ ± 60 ° Dimensions of active chip area (typ) L x W 0.2 x 0.2 mm x mm Rise and fall time of I e ( 10% and 90% of I e max ) (IF = 70 mA, R L = 50 Ω) (typ) t r, t f 12 ns Forward voltage (IF = 70 mA, t p = 20 ms) (typ (max)) V F 1.6 (≤ 2) V Forward voltage (IF = 500 mA, t p = 100 µs) (typ (max)) V F 2.4 (≤ 3) V Reverse current (VR = 5 V) IR not designed for reverse operation µA Total radiant flux (IF=70 mA, t p=20 ms) (typ) Φ e 40 mW
Version 1.4 SFH 4256 2016-09-23 3 Grouping (TA = 25 °C) Temperature coefficient of I e or Φ e (IF = 70 mA, t p = 20 ms) (typ) TC I -0.5 % / K Temperature coefficient of V F (IF = 70 mA, t p = 20 ms) (typ) TC V -0.7 mV / K Temperature coefficient of wavelength (IF = 70 mA, t p = 20 ms) (typ) TC λ 0.3 nm / K Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF = 70 mA, t p = 20 ms IF = 70 mA, t p = 20 ms IF = 500 mA, t p = 25 µs Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4256-Q 6.3 12.5 55 SFH 4256-R 10 20 90 SFH 4256-S 16 32 140 Note: measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 3) page 12 Irel = f(λ), T A = 25°C Radiant Intensity 3) page 12 Ie / I e(70 mA) = f(I F), single pulse, t p = 25 µs, TA= 25°C Parameter Symbol Values Unit 700 nm OHF04132 100 950750 800 850 Irel λ OHF04406 IF mA10 5 10 5 10 10 3 110 -210 -310 e (70 mA)I eI 0 1 2
Version 1.4 SFH 4256 Max. Permissible Forward Current IF, max = f(T A), R thJA = 500 K / W Forward Current 3) page 12 IF = f(V F), single pulse, t p = 100 µs, T A= 25°C Permissible Pulse Handling Capability IF = f(t p), T A = 25 °C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(t p), T A = 85 °C, duty cycle D = parameter 00 ˚C T IF mA OHF03732 A 20 40 60 80 100 120 OHF03826 FI 10-4 0.5 1 1.5 2 2.5 V 3 100 A FV -110 10-2 F I A t p s OHF03733 T t T D P P t I F 0.05 0.005 0.01 0.02 D 0 -5 FI A tp s OHF03824 -410 -310 -210 -110 010 110 21010 T t TD = P Pt IF 0.05 0.5 0.1 0.3 0.005 0.01 0.02 D 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Version 1.4 SFH 4256 2016-09-23 5 Radiation Characteristics 3) page 12 Irel = f(ϕ), T A= 25°C Package Outline Dimensions in mm (inch). Package SIDELED 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚
Version 1.4 SFH 4256 Approximate Weight: 76 mg Recommended Solder Pad Dimensions in mm (inch).
Version 1.4 SFH 4256 2016-09-23 7 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD -020D.01 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profil-Charakteristik Profile Feature Ramp-up Rate to Preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 250 3 4 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down Rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up Rate to Peak*) TSmax to T P Liquidus Temperature Peak Temperature Time above Liquidus temperature Symbol Symbol Einheit Unit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480
Version 1.4 SFH 4256 Taping Dimensions in mm (inch). Tape and Reel 12 mm tape with 2000 pcs. on ∅ 330 mm reel OHAY2273 1.5 (0.059) 4 (0.157) 2 (0.079) 3.95 (0.156) 5.5 (0.217) 1.75 (0.069) 12 (0.472) Cathode/Collector Marking W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.4 SFH 4256 2016-09-23 9 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 8 ± 0.1 A W Nmin W1 W2max 330 12 60 12.4 + 2 18.4 OHA04563 (G) GROUP: 1234567890(1T) LOT NO: (9D) D/C: 1234 (X) PROD NO: 123456789 (6P) BATCH NO: 1234567890 LX XXXX RoHS Compliant BIN1: XX-XX-X-XXX-X ML X Temp ST XXX °C X Pack: RXX DEMY XXX X_X123_1234.1234 X 9999(Q)QTY: Semiconductors OSRAM Opto XX-XX-X-X EXAMPLE X_X123_1234.1234 XX_X123_1234.1234 X EXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLE Pack: RXX XXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-X EXAMPLE Pack: RXXPack: RXX DEMY DEMY EXAMPLE 12341234 EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE 12341234 EXAMPLE Pack: RXXPack: RXX DEMY EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:(9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C: 1234 EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE12345678901234567890EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO: 12345678901234567890 SemiconductorsSemiconductors EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO: 12345678901234567890EXAMPLE SemiconductorsSemiconductors OSRAM OptoOSRAM Opto EXAMPLEEXAMPLE1234567890 X_X123_1234.1234 X Pack: RXX DEMY X_X123_1234.1234 X (9D) D/C: 1234(9D) D/C: 1234567890(6P) BATCH NO: 1234567890 OSRAM Opto XXX X_X123_1234.1234 X XX-XX-X-X Pack: RXX DEMY Semiconductors OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label
Version 1.4 SFH 4256 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 349 ± 5 349 ± 5 33 ± 5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:
260 C RT240 C R
220 C RML
Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label
Version 1.4 SFH 4256 2016-09-23 11 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
Version 1.4 SFH 4256 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsiz e 16 mm 2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
Version 1.4 SFH 4256 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.