SFH4180BS OSRAM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
- PDF pages: 22
Technical content
1 | Version 1.0 | 2024-08-13 www.osram-os.com SFH 4180BS Datasheet Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved
2 | Version 1.0 | 2024-08-13 OSLON® P1616 SFH 4180BS
Applications
- Access Control & Security - Authentication - Eye, face and hand tracking - Factory Automation - Home & Building Automation - Medical Lighting
Features
- Package: clear silicone - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM) - IR lightsource with high efficiency - Double stack emitter
3 | Version 1.0 | 2024-08-13
Ordering Information
Type Total radiant flux 1)2) Total radiant flux 1) Ordering Code typ. IF = 1 A; tp = 10 ms IF = 1 A; tp = 10 ms Φe Φe SFH 4180BS-FA2FB2-11 1250 ... 1800 mW 1,485 mW Q65113A4988 SFH 4180BS-FA2FB2-1113 1250 ... 1800 mW 1,485 mW Q65113A8781 SFH 4180BS-FA2FB2-13 1250 ... 1800 mW 1,485 mW Q65113A8780
4 | Version 1.0 | 2024-08-13 Maximum Ratings TA = 25 °C Parameter Symbol Values Operating temperature Top min. max. -40 °C 105 °C Storage temperature Tstg min. max. -40 °C 105 °C Junction temperature Tj max. 145 °C Forward current IF min. max. 10 mA 1000 mA Forward current pulsed tp ≤ 700 µs; D ≤ 0.005 IF pulse max. 2 A Reverse voltage 3) VR max. 5 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM) VESD max. 2 kV Note: The maximum forward current dimming range shall not be larger than 10.
5 | Version 1.0 | 2024-08-13 Characteristics IF = 1000 mA; tp = 10 ms; TA = 25 °C Parameter Symbol Values Centroid wavelength 4) λcentroid min. max. 912 nm 950 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 37 nm Half angle φ typ. 65 ° Dimensions of chip area L x W typ. 0.73 x 0.73 mm x mm Rise time (10% / 90%) IF = 1 A; RL = 5 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 1 A; RL = 5 Ω tf typ. 11.5 ns Forward voltage 5) VF typ. max. 2.8 V 3.2 V Forward voltage 5) IF = 2 A; tp = 100 µs VF typ. max. 3.0 V 3.7 V Reverse current 3) VR = 5 V IR typ. max. 0.01 µA 10 µA Radiant intensity 6) IF = 1A, tp = 100 µs Ie typ. 325 mW/sr Thermal resistance junction solder point electrical 7) with efficiency ηe = 53 % RthJS elec. typ. max.
6.2 K / W
7.4 K / W
6 | Version 1.0 | 2024-08-13 Brightness Groups Group Total radiant flux 1)2) Total radiant flux 1)2) IF = 1 A; tp = 10 ms IF = 1 A; tp = 10 ms min. max. Φe Φe FA2 1250 mW 1400 mW FB1 1400 mW 1600 mW FB2 1600 mW 1800 mW Centroid Wavelength Group Centroid wavelength 4) Centroid wavelength 4) IF = 1 A; tp = 10 ms IF = 1 A; tp = 10 ms min. max. λcentroid λcentroid 11 912 nm 925 nm 12 925 nm 930 nm 13 930 nm 950 nm
7 | Version 1.0 | 2024-08-13 Relative Spectral Emission 8), 9) Centroid wavelength 920 nm 850 900 950 1000 λ [ 100 Relative Spectral Emission 8), 9) Centroid wavelength 940 nm 850 900 950 1000 λ [ 0.0 0.2 0.4 0.6 0.8 1.0
8 | Version 1.0 | 2024-08-13 Radiation Characteristics 8), 9) Ie,rel = f (φ) -90° -80° -70° -60° -50° -40° -30° -20° φ [ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 :0 °
9 | Version 1.0 | 2024-08-13 Forward current 8), 9) IF = f (VF); single pulse; tp = 100 µs 2.4 2.6 2.8 3.0 0.01 0.05 0.1 0.5 Relative Total Radiant Flux 8), 9) Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs 0.01 0.05 0.1 0.5 1 0.01 0.05 0.1 0.5 Φ Φ
10 | Version 1.0 | 2024-08-13 Forward Voltage 8) VF = f(TS); IF = 1A; tp = 100µs -40 -20 0 20 40 60 80 100 120 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 Relative Total Radiant Flux 8) Φrel = f(TS); IF = 1A; tp = 100µs -40 -20 0 20 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 Φ Φ Centroid Wavelength 8) λcentroid = f(TS); IF = 1A; tp = 100µs -40 -20 0 20 40 60 80 100 120 -10 20/g39/g79
11 | Version 1.0 | 2024-08-13 Max. Permissible Forward Current IF = f (TS) 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TS = 85°C 10-5 10-4 10-3 0.01 0.1 1 10 0.0 0.5 1.0 1.5 2.0 :D =1 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005
12 | Version 1.0 | 2024-08-13 Dimensional Drawing 10) Further Information: Approximate Weight: 6.0 mg Package marking: Cathode
13 | Version 1.0 | 2024-08-13 Recommended Solder Pad 10)
14 | Version 1.0 | 2024-08-13 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
15 | Version 1.0 | 2024-08-13 Taping 10)
16 | Version 1.0 | 2024-08-13 Tape and Reel 11) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000
17 | Version 1.0 | 2024-08-13 Barcode-Product-Label (BPL) Dry Packing Process and Materials OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
18 | Version 1.0 | 2024-08-13 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into exempt risk group - Exempt. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. Handling: Solvents, water, liquids, non-conductive plastics and glues are not allowed near the device, because sol- vents and other liquids could emerge and damage the product. For further application related information please visit https://ams-osram.com/support/application-notes
19 | Version 1.0 | 2024-08-13 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.
20 | Version 1.0 | 2024-08-13 Glossary 1) Total radiant flux: Measured with integrating sphere. 2) Brightness: The brightness values are measured with a tolerance of ±11%. 3) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 4) Wavelength: The wavelengths are measured with a tolerance of ±1 nm. 5) Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V. 6) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 7) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 8) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 9) Testing temperature: TA = 25°C (unless otherwise specified) 10) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 11) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
21 | Version 1.0 | 2024-08-13
Revision History
1.0 2024-08-13 Electro - Optical Characteristics (Diagrams) Characteristics
22 | Version 1.0 | 2024-08-13 Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved