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  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 9

Technical content

Features

 Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm  Typical Peak wavelength 950 nm  Available on tape and reel

Applications

 Miniature photointerrupters  Industrial electronics  For drive and control circuits  Sensor technology  Alarm and safety equipment  IR free air transmission Nicht für Neuentwicklungen im Automobilbereich / not for new designs in automotive applications

Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 100 mA Stoßstrom, τ = 10 μs, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 160 mW Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 5 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 5 mm 2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block RthJA RthJS 450 250 K/W K/W

Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A Δλ 55 nm Abstrahlwinkel Half angle ϕ ± 80 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L × B L × W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr, tf 0.5 μs Kapazität Capacitance VR = 0 V, f = 1 MHz Co 25 pF Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs VF VF 1.3 (≤ 1.5) 1.9 (≤ 2.5) V V Sperrstrom Reverse current VR = 5 V IR 0.01 (≤ 1) μA Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe 20 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA TCI – 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 2 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.3 nm/K

Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 1.0 2.5 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 μs Ie typ 22 mW/sr

Relative Spectral Emission Irel = f (λ) Forward Current IF = f (VF) single pulse, tp = 20 μs Radiation Characteristics Irel = f (ϕ) OHR01938 λ relΙ 880 920 960 1000 nm 1060 100 OHR01554 FV -210 -110 010 110 01 2 3 4 5 6 V 8 AΙ F OHF00614 100˚ 90˚ 80˚ 70˚ 60˚ 50˚ 0.2 0.4 0.6 0.8 1.0ϕ Radiant Intensity Single pulse, tp = 20 μs Permissible Pulse Handling Capability IF = f (tp), TA = 25 °C duty cycle D = parameter Ιe Ιe 100 mA = f (IF) OHR01551 10 -3 Ι F -210 10 -1 10 0 10 1 10 2 Ι e 100 mA eΙ -210 -110 010 110A A t OHR00860 p -510 10 2 Ι F 10 3 10 4 DC 0.2 0.5 0.1 0.005 0.01 0.02 0.05 t p T Ι F t p TD = mA -410 -310 -210 -110 010 110 210s D = Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W OHR00883 FΙ 100 120 20 40 60 80 100 120 mA TA RthjA = 450 K/W

Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Epoxydharz, diffus / Epoxy, diffuse Farbe / Colour Farblos / colourless Gehäusemarkierung/ Package marking Kathode / cathode GPLY7036 Package +0.05 (0.002) 7˚ max +0.02 (0.001) -0.05 (0.002) 0.65 (0.026) marking marking Package

Empfohlenes Lötpaddesign Reflow Löten Recommended Solder Pad Reflow Soldering Alternatives Lötpaddesign Reflow Löten Alternative Solder Pad Reflow Soldering Maße in mm (inch) / Dimensions in mm (inch). 0.8 (0.031) 0.8 (0.031) OHAPY606 0.8 (0.031) 0.8 (0.031) Copper solder pad OHPY3832 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 0.05 (0.002) 0.6 (0.024) Solder stencil aperture 0.05 (0.002) 0.7 (0.028) Copper solder pad

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 Reflow Lötprofil für bleifreies Löten (nach J-STD-020C) Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C) Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLA0687 T t s 120 s max 100 150 200 250 300 Ramp Up 100 s max 50 100 150 200 250 300 Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C 30 s max 260 ˚C+0 ˚C -5 ˚C 245 ˚C ±5 ˚C 240 ˚C 255 ˚C 217 ˚C Maximum Solder Profile Recommended Solder Profile 235 ˚C-0 ˚C +5 ˚C Minimum Solder Profile 10 s min OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.