SFH3500

SFH3500 OSRAM

Document overview

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Technical content

Features

 Spectral Range of Sensitivity:  450 nm ...1060 nm  Package: SMR® (Surface Mount Radial), Epoxy  Feature of the device: high photosensitivity  Package Match: IR emitter SFH 4500,SFH 4515

Applications

 A variety of manufacturing and monitoring  For control and drive circuits  Photointerrupters

Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 85 °C Kollektor-Emitterspannung Collector-emitter voltage VCE VCE (t < 2 min) V V Kollektorstrom Collector current IC 50 mA Kollektorspitzenstrom, τ < 10 μs Collector surge current ICS 100 mA Emitter-Kollektorspannung Emitter-collector voltage VEC 7 V Verlustleistung, TA = 25 °C Total power dissipation Ptot 150 mW Wärmewiderstand Thermal resistance RthJA 400 K/W

2007-04-03 3 OPTO SEMICONDUCTORS Kennwerte (TA = 25 °C, λ = 950 nm) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity λS max 830 nm Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax λ 450 … 1060 nm Bestrahlungsempfindliche Fläche Radiant sensitive area A 0.55 mm2 Abmessungen der Chip-Fläche Dimension of chip area L × B L × W 1.00 × 1.00 mm × mm Halbwinkel Half angle ϕ ± 13 Grad deg. Kapazität, VCE = 5 V, f = 1 MHz, E = 0 Capacitance CCE 10 pF Dunkelstrom, VCE = 20 Dark current ICEO 3 (< 200) nA

Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern gekennzeichnet. The phototransistors are grouped according to their spectral sensitivity and distinguished by arabian figures. Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit -4 -5 -6 Fotostrom Photocurrent Ee= 0.5 mW/cm2, λ = 950 nm, VCE = 5 V IPCE 4.0 … 8.0 6.3 … 12.5 10.0 … 20.0 mA Anstiegszeit/Abfallzeit Rise and fall time RL = 1 kΩ, VCC = 5 V, λ = 950 nm, IC = 1 mA tr, tf 17 20 24 μs Kollektor-Emitter- Sättigungsspannug Collector-emitter saturation voltage IC = IPCEmin 1) × 0.3, Ee = 0.5 mW/cm2 VCEsat 150 (< 200) 150 (< 200) 150 (< 200) mV 1) IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe. 1) IPCEmin is the min. photocurrent of the specified group.

Photocurrent IPCE = f (VCE), Ee = Parameter Photocurrent IPCE = f (Ee), VCE = 5 V Directional Characteristics Srel = f (ϕ) 0.1 mW/cm 0.25 mW/cm 0.5 mW/cm 1.0 mW/cm OHF00521 00 5 1 01 52 02 5 V 3 5 mA IPCE tot, maxP VCE OHF00346 10-3 -2 10 -110 110 -210 -110 010 110 210 IPCE E mW/cm2 mA Ptot e ϕ OHF00350 relS -90 100 -60 -30 0 30 60 90˚ Relative Spectral Sensitivity, Srel = f (λ) Capacitance CCE = f (VCE), f = 1 MHz, E = 0 Total Power Dissipation Ptot = f (TA) λ OHF02332 relS 400 100 500 600 700 800 900 nm 1100 OHF00349 CEC CEV 10-2 V pF -110 010 110 210 T OHF00958 A totP 0 20 40 60 80 ˚C 100 mW 100 120 140 160 Photocurrent IPCE /IPCE25° = f (TA), VCE = 5 V Dark Current ICEO = f (VCE), E = 0 Dark Current ICE0 = f (TA), VCE = 20 V, E = 0 D T OHF01524 A -25 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 25 50 75 100 Ι PCE PCEΙ 25 C V OHF02341 CE CEOΙ -210 10 -1 10 0 10 1 10 2 nA 10 20 30 40 50 70 V T OHF02342 A CEOΙ -110 10 0 10 1 10 2 10 3 nA 20 40 60 80 100 ˚C

Maßzeichnung Package Outlines Empfohlenes Lötpaddesign Recommended Solderpad Design Maße in mm (inch) / Dimensions in mm (inch) GEOY6968 3.9 (0.154) 4.5 (0.177) Cathode/ 7.1 (0.280) 7.7 (0.303) 2.54 (0.100) spacing 13.1 (0.516) 14.7 (0.579) 5.5 (0.217) 7.5 (0.295) 1.95 (0.077) 2.05 (0.081)R ((3.2) (0.126)) 5.4 (0.213) 6.0 (0.236) ((3.2) (0.126)) 2.7 (0.106) 2.4 (0.094) 4.4 (0.173) 4.8 (0.189) ((R2.8 (0.110)) 3.7 (0.146) 3.3 (0.130) 2.8 (0.110) 2.4 (0.094) 4.5 (0.177) 3.9 (0.154) Chip position Collector OHFY2449 5.3 (0.209) 1.3 (0.051) 2.54 (0.100) 7 (0.276) 3 (0.118) Lötpad Cu-Fläche > 20 mm Cu-area > 20 mm2 Paddesign for verbesserte Wärmeableitung improved heat dissipation Padgeometrie für Lötstopplack Solder resist Bauteil positioniert Component Location on Pad

2007-04-03 7 OPTO SEMICONDUCTORS Lötbedingungen Vorbehandlung nach JEDEC Level 3 Soldering Conditions Preconditioning acc. to JEDEC Level 3 Reflow Lötprofil für bleifreies Löten (nach J-STD-020C) Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C) Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLA0687 T t s 120 s max 100 150 200 250 300 Ramp Up 100 s max 50 100 150 200 250 300 Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C 30 s max 260 ˚C+0 ˚C -5 ˚C 245 ˚C ±5 ˚C 240 ˚C 255 ˚C 217 ˚C Maximum Solder Profile Recommended Solder Profile 235 ˚C-0 ˚C +5 ˚C Minimum Solder Profile 10 s min OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.