SFH2430_18 OSRAM

Document overview

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Technical content

Silicon Photodiode with Vλ Characteristic Version 1.3 SFH 2430

Ordering Information

Features: Spectral sensitivity adapted to Human Eye Sensitivi ty (V λ)

  • Low temperature coefficient of spectral sensitivity
  • high linearity
  • DIL plastic package with high packing density
  • The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualific ation for Automotive Grade Discrete Semiconductors.

Applications

Ambient light sensor (Mobile phone, rain sensor, re gulation of air conditioning) Type: Photocurrent Spectral sensitivity Ordering Code IP [µA] S [nA/Ix] Ev = 1000 lx, Std. Light A, V R = 5 V VR = 5 V, standard light A, T = 2856 K SFH 2430 6.3 (≥ 5) 6.3 Q65110A2673

Version 1.3 SFH 2430 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -40 ... 100 °C Reverse voltage VR 6 V Total Power dissipation P tot 150 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Parameter Symbol Values Unit Spectral sensitivity (VR = 5 V, standard light A, T = 2856 K) (typ ) S 6.3 (≥ 5) nA/Ix Photocurrent (Ev = 1000 lx, Std. Light A, V R = 5 V) (typ (min)) I P 6.3 (≥ 5) µA Wavelength of max. sensitivity (typ) λ S max 570 nm Spectral range of sensitivity (typ) λ 10% (typ) 400 ... 900 nm Radiant sensitive area (typ) A 7.02 mm 2 Dimensions of radiant sensitive area (typ) L x W 2.65 x 2.65 mm x mm Half angle (typ) ϕ ± 60 ° Dark current (VR = 5 V) (typ (max)) I R 0.1 (≤ 5) nA Spectral sensitivity of the chip (λ = 550 nm) (typ) S λ typ 0.17 A / W Short-circuit current (Ev = 1000 lx, Std. Light A) (typ) I SC 6.1 µA Rise and fall time (VR = 5 V, R L = 50 kΩ, λ = 550 nm) (typ) t r, t f 200 µs Forward voltage (IF = 100 mA, E = 0) (typ) V F 1.2 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C 0 1000 pF

Version 1.3 SFH 2430 2018-02-23 3 Relative Spectral Sensitivity 1) page 11 Srel = f(λ) Photocurrent 1) page 11 IP/IP(25 °C) = f (TA) Ev = 1000 lx, VR = 5 V Power Consumption Ptot = f(T A) Dark Current 1) page 11 IR = f(V R), E = 0 4000 Srel 100 λ OHF02387 500 600 700 800 900 nm 1100 OHF05719 -40 ˚C AT 0.80 (25 ˚C)IP IP 0.85 0.90 0.95 1.00 1.05 1.15 -20 0 20 40 60 100 P OHF05583 tot TA 25 50 75 100 120 mW 160 100 temp. ambient temp. solder point AT ST TSAT 010-2 321 nA IR V 654 VR OHF02390

Version 1.3 SFH 2430 Capacitance 1) page 11 C = f(V R), f = 1 MHz, E = 0 Directional Characteristics 1) page 11 Srel = f(ϕ) -210 200 600 400 -1105 5 800 1200 C pF

10 V10

20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100

Version 1.3 SFH 2430 2018-02-23 5 Package Outline Dimensions in mm (inch). Package SMT DIL, Epoxy Approximate Weight: 44 mg 4.5 (0.177) 4.3 (0.169) 4.0 (0.157) 3.7 (0.146) 1.5 (0.059) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) Photosensitive area = ACathode lead GEOY6599 0.45 (0.018) 6.7 (0.264) 6.2 (0.244) 1.2 (0.047) 1.1 (0.043) Chip position 0...5˚ 0.2 (0.008) 0.1 (0.004) 1.1 (0.043) 0.9 (0.035) 1.4 (0.055) (0...0.004) 0...0.1 1.0 (0.039) 0.32 (0.013)

Version 1.3 SFH 2430 Recommended Solder Pad Dimensions in mm. Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD -020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L

Version 1.3 SFH 2430 2018-02-23 7 Taping Dimensions in mm. OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) TSmax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480

Version 1.3 SFH 2430 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Tape and Reel 12 mm tape with 1500 pcs. on ∅ 180 mm reel W P0 P1 P2 D0 E F or 8 ± 0.1 A W Nmin W1 W2max 180 12 60 12.4 + 2 18.4 W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D

Version 1.3 SFH 2430 2018-02-23 9 Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 195 ± 5 195 ± 5 30 ± 5 OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label

Version 1.3 SFH 2430 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.

Version 1.3 SFH 2430 2018-02-23 11 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

Version 1.3 SFH 2430 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.