SFH2400_16 OSRAM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 13
Technical content
Version 1.8 SFH 2400
Ordering Information
Features: Especially suitable for applications from 380 nm to 1100 nm
- Short switching time (typ. 5 ns)
- The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualific ation for Automotive Grade Discrete Semiconductors.
Applications
- Industrial electronics
- For control and drive circuits Type: Photocurrent Ordering Code IP [µA] VR = 5 V, standard light A, E v = 1000lx SFH 2400 10 (≥ 6) Q65110A2628
Version 1.8 SFH 2400 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C, Standard Light A, T = 2856 K) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -40 ... 100 °C Reverse voltage VR 20 V Reverse voltage (t < 2 min) VR 50 V Total Power dissipation P tot 120 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Thermal resistance for mounting on pcb R thJA 450 K/W Parameter Symbol Values Unit Photocurrent (Ev = 1000 lx, Std. Light A, V R = 5 V, T = 2856 K) (typ (min)) I P 10 (≥ 6) µA Photocurrent (VR = 5 V, λ = 870 nm, E e = 1 mW/cm 2) (typ (min)) I P 6.5 μA Wavelength of max. sensitivity (typ) λ S max 850 nm Spectral range of sensitivity (typ) λ 10% (typ) 380 ... 1100 nm Radiant sensitive area (typ) A 1.00 mm 2 Dimensions of radiant sensitive area (typ) L x W 1 x 1 mm x mm Half angle (typ) ϕ ± 60 ° Dark current (VR = 20 V) (typ (max)) I R 1 (≤ 5) nA Spectral sensitivity of the chip (λ = 870 nm) (typ) S λ typ 0.65 A / W Quantum yield of the chip (typ) η 0.93 Electro ns /Photon Open-circuit voltage (Ev = 1000 lx, Std. Light A) (typ (min)) V O 320 mV Short-circuit current (Ev = 1000 lx, Std. Light A) (typ) I SC 10 µA Rise and fall time (VR = 20 V, R L = 50 Ω, λ = 850 nm) (typ) t r, t f 0.005 µs Forward voltage (IF = 80 mA, E = 0) (typ) V F 1.3 V
Version 1.8 SFH 2400 2016-04-01 3 Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C 0 11 pF Temperature coefficient of V O (typ) TC V -2.6 mV / K Temperature coefficient of I SC (Std. Light A) (typ) TC I 0.18 % / K Noise equivalent power (VR = 20 V, λ = 870 nm) (typ) NEP 0.028 pW / Hz ½ Detection limit (typ) D * 3.6e12 cm x Hz ½ / W Relative Spectral Sensitivity 1) page 12 Srel = f(λ) Photocurrent / Open-Circuit Voltage 1) page 12 IP (V R = 5 V) / V O = f(E V) Parameter Symbol Values Unit λ OHF01129 relS 400 600 800 1000 1200 100 nm E OHF01025 V 010 PΙ -110 10 1 10 2 10 4 10 0 10 0 VO µ A mV ΙP VO 10 3 lx 110 210 10 3 10 2
Version 1.8 SFH 2400 Dark Current 1) page 12 IR = f(V R), E = 0 Capacitance 1) page 12 C = f(V R), f = 1 MHz, E = 0 Dark Current 1) page 12 IR = f(T A), V R = 10 V, E = 0 V OHF01026 R RΙ 410 310 210 pA
20 V 3010
˚C-50 RI µA 0 50 100 -510 10-4 -310 10-2 -110 010
Version 1.8 SFH 2400 2016-04-01 5 Directional Characteristics 1) page 12 Srel = f(ϕ) Package Outline Dimensions in mm (inch). OHF01402 40 30 20 10 20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100
Version 1.8 SFH 2400 Pinning Pin Description 1 cathode 2 n.c. 3 anode Package Smart DIL Approximate Weight: 12 mg Recommended Solder Pad
Version 1.8 SFH 2400 2016-04-01 7 Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD -020D.01 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) TSmax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480
Version 1.8 SFH 2400 Taping Dimensions in mm (inch). Tape and Reel 12 mm tape with 2000 pcs. on ∅ 180 mm reel W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.8 SFH 2400 2016-04-01 9 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 8 ± 0.1 A W Nmin W1 W2max 180 12 60 12.4 + 2 18.4 OHA04563 (G) GROUP: 1234567890(1T) LOT NO: (9D) D/C: 1234 (X) PROD NO:123456789 (6P) BATCH NO:1234567890 LX XXXX RoHS Compliant BIN1: XX-XX-X-XXX-X ML X Temp ST XXX °C X Pack: RXX DEMY XXX X_X123_1234.1234 X 9999(Q)QTY: Semiconductors OSRAM Opto XX-XX-X-X EXAMPLE X_X123_1234.1234 XX_X123_1234.1234 X EXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLE Pack: RXX XXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-X EXAMPLE Pack: RXXPack: RXX DEMY DEMY EXAMPLE 12341234 EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE 12341234 EXAMPLE Pack: RXXPack: RXX DEMY EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:(9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:1234 EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE12345678901234567890EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890 SemiconductorsSemiconductors EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890EXAMPLE SemiconductorsSemiconductors OSRAM OptoOSRAM Opto EXAMPLEEXAMPLE1234567890 X_X123_1234.1234 X Pack: RXX DEMY X_X123_1234.1234 X (9D) D/C:1234(9D) D/C: 1234567890(6P) BATCH NO:1234567890 OSRAM Opto XXX X_X123_1234.1234 X XX-XX-X-X Pack: RXX DEMY Semiconductors OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label
Version 1.8 SFH 2400 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 195 ± 5 195 ± 5 30 ± 5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:
260 C RT240 C R
220 C RML
Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label
Version 1.8 SFH 2400 2016-04-01 11 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
Version 1.8 SFH 2400 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
Version 1.8 SFH 2400 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.