SFH2332 OSRAM

Document overview

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Technical content

Features

 Especially suitable for applications from 350nm to 780nm  Fast switching time within the specified wavelength  Fast switching time at low reverse voltage (<5V)  Ultra short decay time („slow tail“)  3 mm LED plastic package

Applications

 Optical Disc Drives (CD, DVD, BluRay)  Photointerrupters  Industrial electronics  For control and drive circuits  Range Finder

Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 15 V Sperrspannung, t < 120 s Reverse voltage VR 20 V Verlustleistung Total power dissipation Ptot 150 mW Elektrostatische Entladung Electrostatic Discharge Human Body Model according to EOS/ESD-5.1-1993 ESD 2 kV Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit min typ max Spektrale Fotoempfindlichkeit des Chips Spectral sensitivity of the chip λ = 405nm λ = 650nm λ = 780nm Sλ 0.26 0.49 0.54 A/W Fotostrom, VR = 5 V, Ee = 0.5 mW/cm2 Photocurrent λ = 405nm λ = 650nm λ = 780nm IP 4.5 7.6 8.5 μA Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity λS max 780 nm Spektraler Bereich der Fotoempfindlichkeit Spectral range of sensitivity, S = 10% of Smax λ 350 1050 nm Abmessung der bestrahlungsempfindlichen Fläche Dimensions of radiant sensitive area L × B L × W 0.6 × 0.6 mm × mm Abstand Chipoberfläche zu Gehäuseoberfläche Distance chip front to case surface H 2.4 … 2.8 mm

ϕ ± 17 Grad deg. Dunkelstrom, VR = 5V Dark current IR 0.05 5 nA Anstiegs- und Abfallzeit des Fotostromes Rise and fall time of the photocurrent, 10% - 90% VR = 5V; RL = 50 Ω; Ip = 1 mA; λ = 405nm λ = 650nm λ = 780 nm; tr, tf 1.5 1.6 1.8 ns Kapazität, f = 1 MHz, E = 0, VR = 0 V; Capacitance C0 4.5 5 pF Temperaturkoeffizient von Sλ Temperature coefficient of Sλ λ = 405 nm λ = 650 nm λ = 780 nm TCI -0.06 0.00 0.01 %/K %/K %/K Rauschäquivalente Strahlungsleistung1) Noise equivalent power, λ = 650 nm NEP 8.2×10-15 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit min typ max W Hz NEP 17,9 15–×10 IR Sλ

Relative Spectral Sensitivity Srel = f (λ) Dark Current IR = f (VR), E = 0 Directional Characteristics Srel = f (ϕ) 400 nm OHF03041 100 λ 500 600 700 800 900 1100 relS V OHF03043 R RI -210 10-1 100 V nA 5 10 1510-3 Capacitance C = f (VR), E = 0 Total Power Dissipation Ptot = f (TA) OHF03042 RV -310 -210 -110 010 110 210V pF 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 5.0 C Switching Time tr,tf = f (VR) OHF03917 VR rt ns 0V0 , ft 2 4 6 8 10 12 16

Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). Empfohlenes Lötpaddesign Wellenlöten (TTW) Recommended Solder Pad TTW Soldering Maße in mm (inch) / Dimensions in mm (inch). 0.6 (0.024) 0.4 (0.016) 4.0 (0.157) 3.6 (0.142) ø3.1 (0.122) ø2.9 (0.114) 4.1 (0.161) 3.9 (0.154) 5.2 (0.205) 4.5 (0.177) 3.5 (0.138) 6.3 (0.248) 5.9 (0.232) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) 2.54 (0.100) spacing 0.7 (0.028) 0.4 (0.016) Chip position Collector (Transistor) Area not flat GEOY6653 0.4 (0.016) 0.8 (0.031) Cathode (Diode) 4 (0.157) OHLPY985 4.8 (0.189) cathode soldering area area to improve power dissipation

Lötbedingungen Soldering Conditions Wellenlöten TTW (nach CECC 00802) TTW Soldering (acc. to CECC 00802) Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves