SFH-4551 OSRAM

Document overview

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Technical content

High Power Infrared Emitter (850nm) in SMR® Package Version 1.5 SFH 4551

Ordering Information

Features: High Power Infrared LED

  • SMR® (Surface Mount Radial) package
  • Same package as photodiode SFH 2500 FA
  • Short switching times
  • UL version available ( ordering code & test conditi ons on request)

Applications

  • Discrete interrupters
  • Discrete optocouplers Notes Depending on the mode of operation, these devices e mit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which i ncorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Type: Radiant Intensity Ordering Code Ie [mW/sr] IF= 100 mA, t p= 20 ms SFH 4551 270 (≥ 100) Q65111A0506 SFH 4551-BWCW 160 ... 500 Q65112A4144 Note: Measured at a solid angle of Ω = 0.01 sr

Version 1.5 SFH 4551 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating temperature range T op -40 ... 85 °C Storage temperature range T stg -40 ... 85 °C Reverse voltage VR 5 V Forward current IF 100 mA Surge current (tp ≤ 100 µs, D = 0) IFSM 1 A Power consumption P tot 180 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 kV Thermal resistance junction - ambient 1) page 12 RthJA 300 K / W Parameter Symbol Values Unit Peak wavelength (IF = 100 mA, t p = 20 ms) (typ) λ peak 860 nm Centroid wavelength (IF = 100 mA, t p = 20 ms) (typ) λ centroid 850 nm Spectral bandwidth at 50% of I max (IF = 100 mA, t p = 20 ms) (typ) ∆λ 30 nm Half angle (typ) ϕ ± 10 ° Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x mm Rise and fall time of I e ( 10% and 90% of I e max ) (IF = 100 mA, R L = 50 Ω) (typ) t r, t f 12 ns Forward voltage (IF = 100 mA, t p = 20 ms) (typ (max)) V F 1.5 (≤ 1.8) V Forward voltage (IF = 1 A, t p = 100 µs) (typ (max)) V F 2.4 (≤ 3) V Reverse current (VR = 5 V) IR not designed for reverse operation µA Total radiant flux (IF=100 mA, t p=20 ms) (typ) Φ e 70 mW

Version 1.5 SFH 4551 2017-06-22 3 Grouping (TA = 25 °C) Temperature coefficient of I e or Φ e (IF = 100 mA, t p = 20 ms) (typ) TC I -0.5 % / K Temperature coefficient of V F (IF = 100 mA, t p = 20 ms) (typ) TC V -0.7 mV / K Temperature coefficient of wavelength (IF = 100 mA, t p = 20 ms) (typ) TC λ 0.3 nm / K Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF= 100 mA, t p= 20 ms IF= 100 mA, t p= 20 ms IF = 1 A, t p = 25 µs Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4551-AW 100 200 1200 SFH 4551-BW 160 320 1900 SFH 4551-CW 250 500 3000 Note: measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 2) page 12 Irel = f(λ), T A = 25°C Radiant Intensity 2) page 12 Ie / I e(100 mA) = f(I F), single pulse, t p = 25 µs, TA= 25°C Parameter Symbol Values Unit 700 nm OHF04132 100 950750 800 850 Irel λ OHL01715 10-3 mA 101 010 e e (100 mA) I I IF 010 110 210 3105 5

Version 1.5 SFH 4551 Max. Permissible Forward Current IF = f (T A), R thJA = 300 K/W Forward Current 2) page 12 IF = f(V F), single pulse, t p = 100 µs, T A= 25°C Permissible Pulse Handling Capability IF = f(t p), T A = 25 °C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(t p), T A = 85 °C, duty cycle D = parameter 00 ˚C T IF A OHF03814 10 20 30 40 50 60 70 80 100 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08

0.11 OHL01713

0.5 1 1.5 2 2.5 V 3 100 A FV -110 210-1-2-3-4-5 1010 1010 10 tp 10 10 s10 T tAIF D = IP T F Pt OHF05439 0.2 0.4 0.6 0.8 1.0 1.2 0.05 0.3 0.5 0.2 0.1 D 0.005 0.02 0.01 = 1010 0 -2-3-4-5 1010 10 FI A Pt =D T 210-1 10 tp 10 s 10 OHF03813 T tP IF 0.02 0.3 0.2 0.05 0.1 D = 0.005 0.01 0.5 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Version 1.5 SFH 4551 2017-06-22 5 Radiation Characteristics 2) page 12 Irel = f(ϕ), T A= 25°C Package Outline Dimensions in mm (inch). Package SMR OHL03768 100˚ 90˚ 80˚ 70˚ 60˚ 50˚ 0.2 0.4 0.6 0.8 1.0ϕ GEOY6960 3.9 (0.154) 4.5 (0.177) Cathode 7.1 (0.280) 7.7 (0.303) 2.54 (0.100) spacing 13.1 (0.516) 14.7 (0.579) 5.5 (0.217) 7.5 (0.295) 1.95 (0.077) 2.05 (0.081)R ((3.2) (0.126)) 5.4 (0.213) 6.0 (0.236) ((3.2) (0.126)) 2.7 (0.106) 2.4 (0.094) 4.4 (0.173) 4.8 (0.189) ((R2.8 (0.110)) 3.7 (0.146) 3.3 (0.130) 2.8 (0.110) 2.4 (0.094) Chip position 3.9 (0.154) 4.5 (0.177)

Version 1.5 SFH 4551 Approximate Weight: 0.2 g Recommended Solder Pad Dimensions in mm (inch). OHF02449 5.3 (0.209) 1.3 (0.051) 2.54 (0.100) 7 (0.276) 3 (0.118) Lötpad Cu-Fläche > 20 mm Cu-area > 20 mm Paddesign for verbesserte Wärmeableitung improved heat dissipation Padgeometrie für Lötstopplack Solder resist Bauteil positioniert Component Location on Pad

Version 1.5 SFH 4551 2017-06-22 7 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD -020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) TSmax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480

Version 1.5 SFH 4551 Taping Dimensions in mm (inch). Tape and Reel 24 mm tape with 1000 pcs. on ∅ 330 mm reel W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D

Version 1.5 SFH 4551 2017-06-22 9 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 12 ± 0.1 A W Nmin W1 W2max 330 24 60 / 100 24.4 + 2 30.4 OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label

Version 1.5 SFH 4551 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 349 ± 5 349 ± 5 38 ±5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label

Version 1.5 SFH 4551 2017-06-22 11 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.

Version 1.5 SFH 4551 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsiz e 20 mm 2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

Version 1.5 SFH 4551 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.