SFH-4550

SFH-4550 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

Infrared Emitter (850 nm) Version 1.6 SFH 4550

Ordering Information

Features: High Power Infrared LED

• Narrow emission angle ± 3°
• Very high radiant intensity
• UL version available ( details & test conditions on request)

Applications

Infrared Illumination for cameras

• Data transmission
• Sensor technology
• Smoke detectors Notes Depending on the mode of operation, these devices e mit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which i ncorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Type: Radiant Intensity Ordering Code Ie [mW/sr] IF= 100 mA, t p= 20 ms SFH 4550 1100 (≥ 630) Q65110A1772 SFH 4550 E9548 (UL) 1100 (≥ 630) Q65110A8097 SFH 4550-EWFW 630 ... 2000 Q65110A7758 Note: Measured at a solid angle of Ω = 0.001 sr

Version 1.6 SFH 4550 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating temperature range T op -40 ... 100 °C Storage temperature range T stg -40 ... 100 °C Reverse voltage VR 5 V Forward current IF 100 mA Surge current (tp ≤ 100 µs, D = 0) IFSM 1 A Power consumption P tot 180 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 kV Thermal resistance junction - ambient 1) page 8 RthJA 450 K / W Parameter Symbol Values Unit Peak wavelength (IF = 100 mA, t p = 20 ms) (typ) λ peak 860 nm Centroid wavelength (IF = 100 mA, t p = 20 ms) (typ) λ centroid 850 nm Spectral bandwidth at 50% of I max (IF = 100 mA, t p = 20 ms) (typ) ∆λ 30 nm Half angle (typ) ϕ ± 3 ° Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x mm Rise and fall time of I e ( 10% and 90% of I e max ) (IF = 100 mA, R L = 50 Ω) (typ) t r, t f 12 ns Forward voltage (IF = 100 mA, t p = 20 ms) (typ (max)) V F 1.5 (≤ 1.8) V Forward voltage (IF = 1 A, t p = 100 µs) (typ (max)) V F 2.4 (≤ 3) V Reverse current (VR = 5 V) IR not designed for reverse operation µA Total radiant flux (IF=100 mA, t p=20 ms) (typ) Φ e 70 mW

Version 1.6 SFH 4550 2017-06-22 3 Grouping (TA = 25 °C) Temperature coefficient of I e or Φ e (IF = 100 mA, t p = 20 ms) (typ) TC I -0.5 % / K Temperature coefficient of V F (IF = 100 mA, t p = 20 ms) (typ) TC V -0.7 mV / K Temperature coefficient of wavelength (IF = 100 mA, t p = 20 ms) (typ) TC λ 0.3 nm / K Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF= 100 mA, t p= 20 ms IF= 100 mA, t p= 20 ms IF = 1 A, t p = 25 µs Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4550-EW 630 1250 7500 SFH 4550-FW 1000 2000 12000 SFH 4550-GW 1600 3200 19000 Note: Measured at a solid angle of Ω = 0.001 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 2) page 8 Irel = f(λ), T A = 25°C Radiant Intensity 2) page 8 Ie / I e(100 mA) = f(I F), single pulse, t p = 25 µs, TA= 25°C Parameter Symbol Values Unit 700 nm OHF04132 100 950750 800 850 Irel λ OHL01715 10-3 mA 101 010 e e (100 mA) I I IF 010 110 210 3105 5

Version 1.6 SFH 4550 Max. Permissible Forward Current IF, max = f(T A), R thJA = 450 K / W Forward Current 2) page 8 IF = f(V F), single pulse, t p = 100 µs, T A= 25°C Permissible Pulse Handling Capability IF = f(t p), T A = 25 °C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(t p), T A = 85 °C, duty cycle D = parameter T OHR00880 FΙ 0 20 40 60 80 100˚C mA 100 125 OHL01713 FI 10-4 0.5 1 1.5 2 2.5 V 3 100 A FV -110 0.05 210-1-2-3-4-5 1010 1010 10 tp 10 10 s10 0.1 0.005 0.02 0.01 D = T tAIF D = IP T F Pt OHF05438 0.2 0.5 0.033 0.2 0.4 0.6 0.8 1.0 1.2 210-1-2-3-4-5 1010 1010 10 tp 10 10 s10 T tAIF D = IP T F Pt OHF05587 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.5 0.01 0.05 0.1 0.2 0.02 0.005 D =

Version 1.6 SFH 4550 2017-06-22 5 Radiation Characteristics 2) page 8 Irel = f(ϕ), T A= 25°C Package Outline Dimensions in mm (inch). Package 5mm Radial (T 1 ¾), Epoxy 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚ 5.7 (0.224) 5.1 (0.201) 1.8 (0.071) 1.2 (0.047) Chip position GEXY6271 Cathode 5.9 (0.232) 5.5 (0.217) 0.6 (0.024) 0.4 (0.016) 0.6 (0.024) 0.4 (0.016) spacing 2.54 (0.100) 0.8 (0.031) 0.5 (0.020) 29 (1.142) 27 (1.063) 9.0 (0.354) 8.2 (0.323) 7.5 (0.295) 7.8 (0.307) Area not flat ø4.8 (0.189) ø5.1 (0.201)

Version 1.6 SFH 4550 Approximate Weight: 0.3 g Note Packing information is available on the internet (o nline product catalog). Recommended Solder Pad Dimensions in mm. Note: pad 1: cathode

Version 1.6 SFH 4550 2017-06-22 7 TTW Soldering IEC-61760-1 TTW Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered. 00 s OHA04645 100 150 200 250 300 t T 235 ˚C - 260 ˚C First wave 20 40 60 80 100 120 140 160 180 200 220 240 Second wave 10 s max., max. contact time 5 s per wave Preheating 100 ˚C 120 ˚C 130 ˚C Typical Cooling ca. 3.5 K/s typical ca. 2 K/s ca. 5 K/s Continuous line: typical process Dotted line: process limits < 150 K

Version 1.6 SFH 4550 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsiz e 16 mm 2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

Version 1.6 SFH 4550 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.