SFH-4200

SFH-4200 OSRAM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

Features

 High Power GaAs-LED (35mW)  High Efficiency at low currents  Homogeneous Radiation Pattern  Typical peak wavelength 950nm

Applications

 High data transmission rate up to 100 Mbaud (IR keyboard, Joystick, Multimedia)  Analog and digital Hi-Fi audio and video signal transmission  Alarm and safety equipment  IR spotlight for cameras

SFH 4200, SFH 4205 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 3 V Vorwärtsgleichstrom Forward current IF 100 mA Stoßstrom, tp = 100 µs, D = 0 Surge current IFSM 2.2 A Verlustleistung Power dissipation Ptot 180 mW Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm 2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block RthJA RthJS 450 200 K/W K/W

SFH 4200, SFH 4205 2008-01-14 3 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms ∆λ 40 nm Abstrahlwinkel Half angle ϕ ± 60 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimensions of the active chip area L × B L × W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, tp = 20 ms, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to10%, IF = 100 mA, tp = 20 ms, RL = 50 Ω tr, tf 10 ns Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs VF VF 1.5 (≤ 1.8) 3.2 (≤ 4.3) V V Sperrstrom Reverse current VR = 3 V IR 0.01 (≤ 10) µA Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe typ 35 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA TCI – 0.44 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 1.5 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.2 nm/K

SFH 4200, SFH 4205 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit -P -Q -R Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 6.3 12.5 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 40 60 80 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

SFH 4200, SFH 4205 2008-01-14 5 Relative Spectral Emission Irel = f (λ) Forward Current IF = f (VF) single pulse, tp = 20 µs OHF00777 nm800 Ι erel λ 0 850 900 950 1000 1100 100 OHF00784 10 -3 V mA Ι F VF 10 -2 10 -1 10 0 10 1 10 2 10 3 10 4 Radiant Intensity Single pulse, tp = 20 µs Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter Ie Ie 100 mA = f (IF) e e (100 mA) mA OHF00809 FΙ Ι Ι 10 4010 10 1 10 23 10 10 -3 10 -2 10 -1 10 2 OHF00040 10-5 FI T Pt Pt T pt FI 0.005 0.01 0.02 0.05 D 10-4 10-3 10-2 10-1 100 101 210s 0.1 0.2 0.5 -110 110 100 A Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W OHR00883 FΙ 100 120 20 40 60 80 100 120 mA TA RthjA = 450 K/W

SFH 4200, SFH 4205 Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). SFH 4200 GPLY6724 0.7 (0.028) 0.9 (0.035) 1.7 (0.067) 2.1 (0.083) 0.12 (0.005) 0.18 (0.007) 0.5 (0.020) 3.7 (0.146) 0.4 (0.016) 0.6 (0.024) 2.6 (0.102) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) Cathode marking 3.0 (0.118) 3.4 (0.134) (2.4) (0.095) 0.1 (0.004) (typ.) 4˚±1 A C SFH 4205 GPLY6880 (R1) Cathode marking Cathode Anode (2.4 (0.094)) 2.8 (0.110) 2.4 (0.094) 4.2 (0.165) 3.8 (0.150) 0.9 (0.035) 1.1 (0.043) spacing 2.54 (0.100) (1.4 (0.055)) (0.3 (0.012)) 3.4 (0.134) 3.8 (0.150) 3.8 (0.150) 4.2 (0.165) (2.9 (0.114)) AC

SFH 4200, SFH 4205 2008-01-14 7 Empfohlenes Lötpaddesign Reflow Löten Recommended Solder Pad Reflow Soldering Maße in mm (inch) / Dimensions in mm (inch). OHLPY970 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) Cu-area > 16 mm Cu-Fläche > 16 mm Solder resist Lötstopplack 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for SFH 4200 3.7 (0.146) 1.2 (0.047) 3.0 (0.118) Cu-area > 16 mm Cu-Fläche > 16 mm Paddesign for improved heat dissipation Wärmeableitung für verbesserte Padgeometrie Lötstopplack Solder resist OHLPY965 SFH 4205

SFH 4200, SFH 4205 Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 Reflow Lötprofil für bleifreies Löten (nach J-STD-020C) Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C) Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) OHLA0687 T t s 120 s max 100 150 200 250 300 Ramp Up 100 s max 50 100 150 200 250 300 Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C 30 s max 260 ˚C+0 ˚C -5 ˚C 245 ˚C±5 ˚C 240 ˚C 255 ˚C 217 ˚C Maximum Solder Profile Recommended Solder Profile 235 ˚C-0 ˚C +5 ˚C Minimum Solder Profile 10 s min min. condition for IR Reflow Soldering: solder point temperature ≥ 235 °C for at least 10 sec. OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

SFH 4200, SFH 4205 2008-01-14 9 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.