SFH-3219 OSRAM

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

Silicon NPN Phototransistor Version 1.4 / OS-IN-2015-033 SFH 3219

Ordering Information

Features: Spectral range of sensitivity: (typ) 450 ... 1150 nm

  • Package: TOPLED with Lens
  • Special: Suitable for all soldering methods
  • High linearity
  • Same package as SFH 4249, SFH 4259

Applications

Miniature photointerrupters

  • Industrial electronics
  • For control and drive circuits
  • Sensor Technology Type: Photocurrent Ordering Code IPCE [µA] λ = 950 nm, E e = 0.1 mW/cm 2, VCE = 5 V SFH 3219 ≥ 63 Q65110A2651

Version 1.4 / OS-IN-2015-033 SFH 3219 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -40 ... 100 °C Collector-emitter voltage V CE 35 V Collector current IC 15 mA Collector surge current (τ < 10 µs) ICS 75 mA Total Power dissipation P tot 165 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Thermal resistance for mounting on pcb R thJA 450 K/W Parameter Symbol Values Unit Wavelength of max. sensitivity (typ) λ S max 990 nm Spectral range of sensitivity (typ) λ 10% (typ) 450 ... 1150 nm Radiant sensitive area (typ) A 0.038 mm 2 Dimensions of chip area (typ) L x W (typ) 0.45 x 0.45 mm x mm Half angle (typ) ϕ ± 25 ° Capacitance (VCE = 0 V, f = 1 MHz, E = 0) (typ) C CE 5 pF Photocurrent (λ = 950 nm, E e = 0.1 mW/cm 2, V CE = 5 V) IPCE ≥ 63 µA Dark current (VCE = 20 V, E = 0) (typ (max)) ICE0 1 (≤ 50) nA Rise and fall time (IC = 1 mA, V CC = 5 V, R L = 1 kΩ) (typ) t r, t f 7 µs Collector-emitter saturation voltage (IC = 20 μA, E e = 0.1 mW/cm 2) (typ) V CEsat 150 mV

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 3 Relative Spectral Sensitivity 1) page 13 Srel = f(λ) Photocurrent 1) page 13 IPCE = f(V CE ), E e = Parameter Photocurrent 1) page 13 IPCE / I PCE (25°C) = f(T A), V CE = 5 V Dark Current 1) page 13 ICEO = f(V CE ), E = 0 OHF00207 400 Srel λ nm 500 600 700 800 900 1100 100 V OHF00007 CE PCEΙ 010 10 -2 10 -1 mA V5 10 15 20 25 30 35 0.1 2cm mW 0.2 2cm mW 0.4 2cm mW T OHF01524 A -25 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 25 50 75 100 ΙPCE PCEΙ 25 C V OHF01527 CE CEOΙ -310 10 -2 10 -1 10 0 10 1 0 5 10 15 20 25 30 35 V nA

Version 1.4 / OS-IN-2015-033 SFH 3219 Dark Current 1) page 13 ICE0 = f(T A), E = 0, V CE = 20 V Collector-Emitter Capacitance 1) page 13 CCE = f(V CE ), f = 1 MHz, E = 0 Power Consumption Ptot = f(T A) T OHF01530 A CEOΙ -110 10 0 10 1 10 2 10 3 -25 nA 0 25 50 75 100˚C V OHF01528 CE -210 CEC 10 -1 10 0 10 1 10 2 V 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 5.0 pF OHF00871 totP 120 160 mW 200 20 40 60 80 ˚C 100 TA

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 5 Directional Characteristics 1) page 13 Srel = f(ϕ) 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

Version 1.4 / OS-IN-2015-033 SFH 3219 Package Outline Dimensions in mm (inch). 3.5 (0.138) max. ø2.55 (0.100) 0.13 (0.005) 0.18 (0.007) 0.1 (0.004) (typ.)marking Package 1.1 (0.043) 0.5 (0.020) 2.6 (0.102) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) GEOY6956 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 2.1 (0.083) ø2.60 (0.102)

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 7 Pinning Pin Description 1 emitter 2 collector Package TOPLED with Lens Approximate Weight: 37 mg Recommended Solder Pad Dimensions in mm.

Version 1.4 / OS-IN-2015-033 SFH 3219 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD -020D.01 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profil-Charakteristik Profile Feature Ramp-up Rate to Preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 250 3 4 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down Rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up Rate to Peak*) TSmax to T P Liquidus Temperature Peak Temperature Time above Liquidus temperature Symbol Symbol Einheit Unit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 9 Taping Dimensions in mm. Tape and Reel 12 mm tape with 2000 pcs. on ∅ 330 mm reel W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D

Version 1.4 / OS-IN-2015-033 SFH 3219 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 8 ± 0.1 A W Nmin W1 W2max 330 12 60 12.4 + 2 18.4 OHA04563 (G) GROUP: 1234567890(1T) LOT NO: (9D) D/C: 1234 (X) PROD NO:123456789 (6P) BATCH NO:1234567890 LX XXXX RoHS Compliant BIN1: XX-XX-X-XXX-X ML X Temp ST XXX °C X Pack: RXX DEMY XXX X_X123_1234.1234 X 9999(Q)QTY: Semiconductors OSRAM Opto XX-XX-X-X EXAMPLE X_X123_1234.1234 XX_X123_1234.1234 X EXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLE Pack: RXX XXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-X EXAMPLE Pack: RXXPack: RXX DEMY DEMY EXAMPLE 12341234 EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE 12341234 EXAMPLE Pack: RXXPack: RXX DEMY EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:(9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:1234 EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE12345678901234567890EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890 SemiconductorsSemiconductors EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890EXAMPLE SemiconductorsSemiconductors OSRAM OptoOSRAM Opto EXAMPLEEXAMPLE1234567890 X_X123_1234.1234 X Pack: RXX DEMY X_X123_1234.1234 X (9D) D/C:1234(9D) D/C: 1234567890(6P) BATCH NO:1234567890 OSRAM Opto XXX X_X123_1234.1234 X XX-XX-X-X Pack: RXX DEMY Semiconductors OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 11 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 349 ± 5 349 ± 5 33 ± 5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label

Version 1.4 / OS-IN-2015-033 SFH 3219 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.

Version 1.4 / OS-IN-2015-033 SFH 3219 2016-01-31 13 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

Version 1.4 / OS-IN-2015-033 SFH 3219 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.