SFH-2716 OSRAM

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Silicon PN Photodiode with V λ Characteristics Version 1.1 SFH 2716

Ordering Information

Features: Very small SMT package

  • SMT package 0805, colorless clear resin, 2 mm x 1.2 5 mm x 0.8 mm
  • Special: Adapted to human eye sensitivity (V λ)
  • Spectral range of sensitivity: (typ) 350 ... 1000 nm

Applications

For control and drive circuits

  • Ambient light detector
  • Exposure meter for daylight and artificial light
  • Sensor for backlight-dimming Type: Photocurrent Ordering Code IP [µA] VCE = 5 V, white LED 1000 lx SFH 2716 0.57 (≥0.4) Q65112A0955

Version 1.1 SFH 2716 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -40 ... 100 °C Reverse voltage VR 16 V ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Parameter Symbol Values Unit Photocurrent (VCE = 5 V, white LED 1000 lx) (typ (min)) I P 0.57 (≥0.4) µA Wavelength of max. sensitivity (typ) λ S max 620 nm Spectral range of sensitivity (typ) λ 10% (typ) 350 ... 1000 nm Radiant sensitive area (typ) A 0.35 mm 2 Dimensions of radiant sensitive area (typ) L x W 0.59 x 0.59 mm x mm Half angle (typ) ϕ ± 60 ° Dark current (VR = 5 V) (typ (max)) I R 0.01 (≤ 5) nA Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C 0 23 pF

Version 1.1 SFH 2716 2017-11-08 3 Relative Spectral Sensitivity 1) page 11 Srel = f(λ) Dark Current 1) page 11 IR = f(V R), E = 0 Capacitance 1) page 11 C = f(V R), f = 1 MHz, E = 0 S F H 2 7 1 6 400 600 800 1000 λ [n m ] 100S r e l [% ] S F H 2 7 1 6 2 4 6 8 10 12 14 16 V R [V ] I R [p A ] S F H 2 7 1 6 10-3 0.01 0.1 1 V R [V ] C [p F ]

Version 1.1 SFH 2716 Directional Characteristics 1) page 11 Srel = f(ϕ) Package Outline Dimensions in mm (inch). OHF01402 40 30 20 10 20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100

Version 1.1 SFH 2716 2017-11-08 5 Pinning Pin Description

1 Anode

2 Cathode

Approximate Weight: 4 mg Recommended Solder Pad Dimensions in mm. OHFP2578 3.2 1.25 Component location on pad Bauteil positioniert

Version 1.1 SFH 2716 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD -020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) TSmax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480

Version 1.1 SFH 2716 2017-11-08 7 Taping Dimensions in mm (inch). Tape and Reel 8 mm tape with 3000 pcs. on ∅ 180 mm reel W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D

Version 1.1 SFH 2716 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 4 ± 0.1 A W Nmin W1 W2max 180 8 60 8.4 + 2 14.4 OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label

Version 1.1 SFH 2716 2017-11-08 9 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 200 ± 5 195 ± 5 30 ± 5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT240 C R

220 C RML

Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label

Version 1.1 SFH 2716 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.

Version 1.1 SFH 2716 2017-11-08 11 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

Version 1.1 SFH 2716 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.