SFH-2701 OSRAM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 13
Technical content
Version 1.2 SFH 2701
Ordering Information
Features: Especially suitable for applications from 400 nm to 1050 nm
- Fast switching time within the specified wavelength
- Fast switching time at low reverse voltage (<5V)
- Ultra short decay time ("slow tail")
- IEC Standard 3216 Chipled package
Applications
Optical disc drives (CD, DVD)
- Photointerrupters
- Industrial electronics
- For control and drive circuits Type: Photocurrent Ordering Code IP [µA] λ = 650 nm, E e = 0.5 mW/cm 2, V R = 5 V SFH 2701 1.2 (≥0.8) Q65110A2960
Version 1.2 SFH 2701 Maximum Ratings (TA = 25 °C) Characteristics (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -40 ... 85 °C Reverse voltage VR 15 V Reverse voltage (t < 120 s) VR 20 V ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Parameter Symbol Values Unit Spectral sensitivity (λ = 650 nm) (typ) S λ typ 0.45 A / W Spectral sensitivity (λ = 780 nm) (typ) S λ typ 0.5 A / W Photocurrent (λ = 650 nm, E e = 0.5 mW/cm 2 ,VR = 5 V) (typ (min)) I P 1.2 (≥0.8) µA Photocurrent (λ = 780nm, E e = 0.5 mW/cm 2 ,VR = 5 V) (typ) I P 1.4 μA Wavelength of max. sensitivity (typ) λ S max 820 nm Spectral range of sensitivity (typ) λ 10% (typ) 400 ... 1050 nm Radiant sensitive area (typ) A 0.36 mm 2 Dimensions of radiant sensitive area (typ) L x W 0.6 x 0.6 mm x mm Distance from chip front to case surface (typ) H 0.3 mm Half angle (typ) ϕ ± 60 ° Dark current (VR = 5 V) (typ (max)) I R 0.05 (≤ 5) nA Rise and fall time (VR = 5 V, R L = 50 Ω, λ = 650 nm, I p = 1 mA) (typ) t r, t f 1.8 ns Rise and fall time (VR = 5 V, R L = 50 Ω, λ = 780 nm, I P = 1 mA) (typ) t r, t f 2 ns Forward voltage (typ) V F 0.8 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C 0 3 (≤ 5) pF
Version 1.2 SFH 2701 2015-12-07 3 Temperature coefficient of S λ_650nm (typ) TC I -0.03 % / K Temperature coefficient of S λ_780nm (typ) TC I -0.01 % / K Noise equivalent power (NEP = 17.9 x 10 -15 x (I R)1/2 /S λ) (VR = 5 V, λ = 650 nm) (typ) NEP 0.009 pW / Hz ½ Relative Spectral Sensitivity 1) page 12 Srel = f(λ) Dark Current 1) page 12 IR = f(V R), E = 0 Parameter Symbol Values Unit OHF00815 λ relS 400 500 600 700 800 900 nm 1100 100 OHF03904 VR RI nA 0 V0 0.02 0.04 0.06 0.08 0.12 5 10 15 20
Version 1.2 SFH 2701 Capacitance 1) page 12 C = f(V R), f = 1 MHz, E = 0 Switching Time 1) page 12 tr, t f = f(V R), R L = 50 Ω, λ = 650 nm, I p = 200 µA Dark Current 1) page 12 IR = f(T A), VR = 5V, E = 0 OHF03901 RV -310 -210 -110 010 110 210V pF C
4 OHF03917
, ft 2 4 6 8 10 12 16 OHF03831 RI 10-2 35 45 55 65 75 ˚C 85 102 nA AT 110
Version 1.2 SFH 2701 2015-12-07 5 Directional Characteristics 1) page 12 Srel = f(ϕ) Package Outline Dimensions in mm (inch). OHF01402 40 30 20 10 20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100 1.25 (0.049) 0.92 (0.036) 0.5 (0.020) 0.9 (0.035) 0.7 (0.028) 0.4 (0.016) 1.35 (0.053) 1.65 (0.065) 3.05 (0.120) 3.35 (0.132) 1.85 (0.073) 2.15 (0.085) Center of GPLY7034 active area ø0.7 (0.028) ø0.9 (0.035) Cathode mark
Version 1.2 SFH 2701 Pinning Pin Description
1 Cathode
2 Anode
Chipled (EIA 1206) Approximate Weight: 7.6 mg Recommended Solder Pad Dimensions in mm. OHF03896 4.7 1.5 1.5
Version 1.2 SFH 2701 2015-12-07 7 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD -020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 100 12060 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T P Time within 5 °C of the specified peak temperature TP - 5 K Ramp-down rate* TP to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/ Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up rate to peak*) TSmax to T P Liquidus temperature Peak temperature Time above liquidus temperature Symbol Symbol Unit Einheit Pb-Free (SnAgCu) Assembly Minimum MaximumRecommendation K/s K/s s s s s 480
Version 1.2 SFH 2701 Taping Dimensions in mm (inch). Tape and Reel 8 mm tape with 3000 pcs. on ∅ 180 mm reel W F E Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.2 SFH 2701 2015-12-07 9 Tape dimensions [mm] Tape dimensions in mm Reel dimensions [mm] Reel dimensions in mm Barcode-Product-Label (BPL) Dry Packing Process and Materials Note: Moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. Regarding dry pack you will find further informatio n in the internet. Here you will also find the norm ative references like JEDEC. W P0 P1 P2 D0 E F or 4 ± 0.1 A W Nmin W1 W2max 180 8 60 8.4 + 2 14.4 OHA04563 (G) GROUP: 1234567890(1T) LOT NO: (9D) D/C: 1234 (X) PROD NO:123456789 (6P) BATCH NO:1234567890 LX XXXX RoHS Compliant BIN1: XX-XX-X-XXX-X ML X Temp ST XXX °C X Pack: RXX DEMY XXX X_X123_1234.1234 X 9999(Q)QTY: Semiconductors OSRAM Opto XX-XX-X-X EXAMPLE X_X123_1234.1234 XX_X123_1234.1234 X EXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE XXXXXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-XXX-XX-X-X EXAMPLE Pack: RXX XXX X_X123_1234.1234 XX_X123_1234.1234 X XX-XX-X-X EXAMPLE Pack: RXXPack: RXX DEMY DEMY EXAMPLE 12341234 EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE 12341234 EXAMPLE Pack: RXXPack: RXX DEMY EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:(9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C:1234 EXAMPLEEXAMPLEEXAMPLEEXAMPLE (9D) D/C: EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE12345678901234567890EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890 SemiconductorsSemiconductors EXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLEEXAMPLE(6P) BATCH NO:(6P) BATCH NO:12345678901234567890EXAMPLE SemiconductorsSemiconductors OSRAM OptoOSRAM Opto EXAMPLEEXAMPLE1234567890 X_X123_1234.1234 X Pack: RXX DEMY X_X123_1234.1234 X (9D) D/C:1234(9D) D/C: 1234567890(6P) BATCH NO:1234567890 OSRAM Opto XXX X_X123_1234.1234 X XX-XX-X-X Pack: RXX DEMY Semiconductors OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparatorcheck dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label
Version 1.2 SFH 2701 Transportation Packing and Materials Dimensions of transportation box in mm Width Length Height 200 ± 5 195 ± 5 30 ± 5 OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 2 4 5 (Q)QTY: 2000 0144 (G) GROUP:
260 C RT240 C R
220 C RML
Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR:R077Additional TEXT P-1+Q-1Multi TOPLED Muster OSRAM OptoSemiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 1 1(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP: Bin3:Bin2: Q-1-20Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). Moisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) Mounted within b) Stored at body temp. 3. Devices require baking, before mounting, if: Bag seal date Moisture Level 1 Moisture Level 2 Moisture Level 2a 4. If baking is required, b) 2a or 2b is not met. Date and time opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor time see below If blank, see bar code label Floor time > 1 Year Floor time 1 Year Floor time 4 Weeks 10% RH._< Moisture Level 4 Moisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag containsCAUTION Floor time 72 Hours Floor time 48 Hours Floor time 24 Hours 30 ˚C/60% RH._< LEVEL If blank, seebar code label Barcode label
Version 1.2 SFH 2701 2015-12-07 11 Disclaimer Language english will prevail in case of any discre pancies or deviations between the two language word ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics . Terms of delivery and rights to change design reser ved. Due to technical requirements components may c ontain dangerous substances. For information on the types in question please con tact our Sales Organization. If printed or downloaded, please find the latest ve rsion in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport . For packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of OSRAM OS. *) A critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) Life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. If they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
Version 1.2 SFH 2701 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
Version 1.2 SFH 2701 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.