SBYV26C VISHAY
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formerly General Semiconductor Document Number 88735 www.vishay.com 11-Feb-02 1 New Product Glass Passivated Ultrafast Rectifier Reverse Voltage600V Forward Current1.0A 0.107 (2.7) 0.080 (2.0) 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 1.0 (25.4) MIN. 0.205 (5.2) 0.160 (4.1) DIA. Maximum Ratings and Thermal Characteristics(TA = 25°C unless otherwise noted) Parameter Symbol Value Unit Maximum repetitive peak reverse voltage V RRM 600 V Maximum RMS voltage V RMS 420 V Maximum DC blocking voltage V DC 600 V Maximum average forward rectified current 0.375" (9.5mm) lead length at TL = 85°C (See Fig. 1) IF(AV) 1.0 A Peak forward surge current 10ms single half sine-wave superimposed on rated load IFSM 30 A Non repetitive peak reverse energy (Note 1) ERSM 5m J Typical thermal resistance (Note 2,3) R Θ JA 70 R Θ JL 16 °C/W Operating junction and storage temperature range T J, TSTG –65 to +175 °C Electrical Characteristics (TA = 25°C unless otherwise noted) Minimum avalanche breakdown voltage at 100µAV BR 600 V Maximum instantaneous T J = 25°C VF 2.5 Vforward voltage at 1.0A T J = 175°C 1.3 Maximum DC reverse current T A = 25°C IR 5.0 µAat rated DC blocking voltage TA = 165°C 150 Max. reverse recovery time at IF = 0.5A, IR = 1.0A, Irr = 0.25A t rr 30 ns Maximum junction capacitance at 4.0V, 1MHz C J 45 pF Maximum reverse recovery current slope dir/dt 7 A/ µsat IF = 1A, VR = 30V, dif/dt = –1A/µs Notes:(1) Peak reverse energy measured with 8/20µs surge (3) Thermal resistance from junction to lead at 0.375”(9.5mm) lead length with both leads attached to heatsink DO-204AL (DO-41) Features High temperature metallurgically bonded construction Cavity-free glass passivated junction Ultrafast recovery time for high efficiency Low forward voltage, high current capability Capable of meeting environmental standards of MIL-S-19500 Hermetically sealed package Low leakage current High surge current capability Specified reverse surge capability High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length,5 lbs. (2.3kg) tension Mechanical Data Case: JEDEC DO-204AL, molded plastic over glass body Terminals:Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity:Color band denotes cathode end Mounting Position:Any Weight:0.012 oz., 0.3 g Patented* *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, and brazed-lead assembly by Patent No. 3,930,306Dimensions in inches and (millimeters)
formerly General Semiconductor www.vishay.com Document Number 88735 2 11-Feb-02 Ratings and Characteristic Curves(TA = 25°C unless otherwise noted) 100 1 100 10 Fig. 2 – Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles at 50 HZ 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 175 Fig. 1 – Maximum Forward Current Derating Curve Average Forward Rectified Current (A) Temperature (°C) Instantaneous Forward Voltage (V) 02 0 6 0 40 100 80 Fig. 4 – Typical Reverse Leakage Characteristics Instantaneous Reverse Leakage Current (µA) Percent of Rated Peak Reverse Voltage (%) 0.4 0.2 Mounted on P .C.B. Lead mounted on heatsink 0.01 0.1 100 Instantaneous Forward Current (A) TJ = 25°C TJ = 125°C TJ = 165°C t, Pulse Duration (sec.) Transient Thermal Impedance (°C/W) 0.01 0.1 1 10 100 100 0.01 0.001 0.1 100 Fig. 6 – Typical Transient Thermal Impedance TJ = TJ max. 10ms Single Half Sine-Wave Pulse Width = 300µs 1% Duty Cycle Fig. 3 – Typical Instantaneous Forward Characteristics Reverse Voltage (V) Junction Capacitance (pF) 0.1 1 10 100 100 Fig. 5 – Typical Junction Capacitance TJ = 25°C f = 1.0 MHZ Vsig = 50mVp-p TJ = 25°C TJ = 125°C TJ = 165°C TL TA