S6700

S6700 TI

Document overview

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Technical content

Page 1

R A D I O F R E Q U E N C Y I D E N T I F I C A T I O N S Y S T E M S

The S6700 Multi Protocol Transceiver IC enables a broad range of 13.56MHz RFID interrogator designs for portable and stationary readers. This low power consumption device supports multiple RF communication protocols, minimizes onboard power requirements and reduces parts count in a final reader product.

Recommended application schematic

Pin description Symbol Description Pin 1 VDD_TX Transmitter power supply 2 TX_OUT Output transistor drain connection 3 R_MOD External resistor to set 10% modulation depth mode 4 VSS_TC Transmitter section ground 5 XTAL1 Pin 1 of Xtal resonator 6 XTAL2 Pin 2 of Xtal resonator, external clock input 7 VSS_DIG Digital section ground 8 XTAL_CLK Buffered output of Xtal oscillator 9 Not used Grounded for normal operation 10 Not used Grounded for normal operation 11 DOUT Data output for serial link 12 VDD_DIG Digital section power supply 13 DIN Data input for serial link 14 M_ERR Manchester Protocol error flag 15 SCLOCK Serial link clock 16 Not used Leave open for normal operation 17 VDD_RX Receiver section power supply

18 Not used Leave open for normal operation 19 VSS_RX Receiver section ground 20 RX_IN Receiver input

For more information, contact the sales office or distributor nearest you. This contact information can be found

http://www.ti-rfid.com

on our web site at:

Texas Instruments reserves the right to change its products and services at any time without notice. TI provides customer assistance in various technical areas, but does not have full access to data concerning the uses and applications of customers products. Therefore, TI assumes no responsibility for customer product design or for infringement of patents and/or the rights of third parties, which may result from assistance provided by TI.

© Copyright 2002 Texas Instruments Incorporated.

11-07-22-001 09/02 SCBS856

Page 2

www.ti.com

PACKAGING INFORMATION

Status (1) Package Package

Orderable Device

Type Drawing

RI-R6C-001A-03

ACTIVE TSSOP DBT

(1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.

PACKAGE OPTION ADDENDUM

1-Jul-2008

Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Qty 20 1500

TBD

Call TI Call TI

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

Page 3

IMPORTANT NOTICE

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