Download PDFS553-2940-05 BEL
Document overview
- PDF pages: 2
Technical content
Page 1
- Designed for use with Level One LXT914/918/944 or Texas Instruments' Quad PHY TNETE 2004 10Base-T transceiver chipsets
- Quad, 4-port design offers optimal space, performance and cost efficiency
ELECTRICALS AT 25ºC
Insertion Loss
OCL
(dB) Max
Inductance
Part No.
1-10MHz
(µH) Min
S553-2940-05
-1.0
100
S553-2940-06
-1.0
100
S553-5999-38
-1.0
100
SCHEMATICS
A
B
- Family of designs offered with common footprint and pinout to accommodate customized EMI requirements
- Low profile surface mount packages, rated to 225ºC peak IR reflow temperature
- 2000 Vrms isolation
Return Loss
Crosstalk
CM-CM Rej
(dB) Min
(dB) Min
(dB) Min
1MHz-10MHz
1MHz-10MHz
10-30MHz 100MHz
Schematic
-18
-40
N/A N/A
A
-18
-40
-40 -30
B
-18
-40
-40 -30
C
C
MECHANICAL
Specifications subject to change without notice.
Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Page 2
APPLICATION CIRCUIT
APPLICATION NOTES
- Bel has developed a variety of quad, 4-port part types for use with Level One and Texas Instrument quad, 4-port PHY devices that incorporate digital filtering techniques within the silicon itself. Bel's "filterless magnetics" are optimized for this specific application and create a very cost efficient design solution. Each Bel part type contains 4 channels of transmit and receive transformers to provide for wave shaping, high voltage isolation and EMI noise suppression.
- Bel has designed these parts as a family of parts with common footprint and pinouts to enable the designer to customize the use of common mode choke for optimum system performance.
- In multi-port system applications, good PCB layout and proper grounding techniques are very critical to achieve FCC class A and B equipment approvals. Bel recommendations are available and can be provided by contacting our engineering department or your local sales representative.
- Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements.
Corporate Office Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302-4496 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com Internet: http://www.belfuse.com
European Office Bel Fuse Europe Ltd. Preston Technology Management Centre Marsh Lane, Preston PR1 8UD Lancashire, U.K. Tel: 44-1772-556601 Fax: 44-1772-888366