S3A LEIDITECH
Document overview
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Major Ratings and Characteristics Mechanical Date Case: JEDEC DO-214AA molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D I F(AV) V F 3.0 A V RRM
50 V to 1000 V
I FSM 100 A I R 5 μA 1.1 V Polarity: Laser band denotes cathode end Maximum Ratings & Thermal Characteristics A = 25 °C unless otherwise noted)
Electrical Characteristics
A = 25 °C unless otherwise noted) Note 2: Pulse test:300μs pulse width,1% duty cycle. pFTypical junction capacitance 4.0 V ,1MHz C J - 60.0 - Test conditions Instantaneous forward voltage I F =3 A (2) Reverse current V R DC Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load I FSM 100 T j max. 150 °C Items Symbol S3A S3B S3D S3G S3J S3K S3M UNIT Maximum repetitive peak reverse voltage V RRM 50 100 200 400 600 800 1000 V Maximum RMS voltage V RMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage V DC 50 100 200 400 600 800 1000 V Maximum average forward rectified current I F(AV) A Thermal resistance from junction to lead (1) R θJL 25 ℃/ W Operating junction and storage temperature range T J , T STG –55 to +150 ℃ Max UNIT V F - 0.98 1.10 V Items 50 μAT j =25℃ T j =125℃ I R Symbol Min Type Surface Mount Standard Rectifiers Rev : www.leiditech.com 01.06.2018 1/3
A =25 ℃ unless otherwise noted) S3A~S3M Rev : www.leiditech.com 01.06.2018 2/3
S3A~S3M Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 3/3