S1M LEIDITECH
Document overview
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Technical content
Features
Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Major Ratings and Characteristics Mechanical Date Case: JEDEC DO-214AC molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarit y : Laser band denotes cathode end I F(AV) 1.0 A V F 1.1 V T j max. 150 °C V RRM
50 V to 1000 V
I FSM 30 A I R 5 μA y Maximum Ratings & Thermal Characteristics A = 25 °C unless otherwise noted)
Electrical Characteristics
A = 25 °C unless otherwise noted) Note 2: Pulse test:300μs pulse width,1% duty cycle. V 1000 700 j S1M V RMS V DC I F(AV) I FSM V Symbol 107 UNIT V RRM 1000 Thermal resistance from junction to ambient (1) R θJL R θJA T J , T STG A A ℃/ W ℃/ W –55 to +150 Max Operating junction and storage temperature range Items Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Thermal resistance from junction to lead (1) Typical junction capacitance Test conditions -p F UNIT V F - 0.98 1.10I F =1 A (2) Type Items Instantaneous forward voltage Reverse current Symbol Min V R DC 4.0 V ,1MHz - 15.0 V μAT j =25℃ T j =125℃ I R C J Surface Mount Standard Rectifiers Rev : www.leiditech.com 01.06.2016 1/3 S1M V
A =25 ℃ unless otherwise noted) Rev : www.leiditech.com 01.06.2016 2/3 S1M
Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2016 3/3