S1210MM ETC1
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TAG SEMICONDUCTORS LTD . $1210BM — 5 Zi : _ .$1210MM SCR’S i, . . 12A 200-600V 10-25mA j ? The $1210 series silicon controlled : rectifiers are high performance glass G passivated PNPN devices. These parts are intended for hybrid applications. A c MICRO MINI a Absolute Maximum Ratings a= 25°C unless otherwise noted : Parameter Part Nr. Symbol Min. Max. Unit _Test Conditions Repetitive Peak $1210BM 200 Vv = Off State Voltage g1210DM [yr] nao Vv [Roca tka to 125 “| siziomm ~ "RM 600 v cK On-State Current lriRMs) 12 A All Conduction Angles Tc = 85 °C Average On-State Current Hayy 76 A Half Cycle, O= 180° Tc= 85°C Nonrept. On-State Current itsm 132 A Half Cycle, 60 Hz Nonrept. On-State Current itsm 120 A Half Cycle, 50 Hz Fusing Current Pt 72 A2s_ t=10 ms, Half Cycle Peak Gate Current Iom 4 A 10s max. Peak Gate Dissipation Pom 10 WwW 10ps max. ot Gate Dissipation Pagiav) 1 Ww 20 ms max. Operating Temperature TF —40 125 °C Storage Temperature Tstg —40 150 °C Case Temperature Te °C Temperature measured on the substrate - immediately adjacent to the Chip nO Electrical Characteristics Ta= 25°C unless otherwise noted . . Parameter Symbol Min. Max. Unit Test Conditions Off-State Leakage Current lpRM/IRRM 15 MA @Vprmt Varm. Rek=1KQ, T= 125°C Off-State Leakage Current Ipru/IRRM 5.0 pA @VprM + Varo. Rok =1KQ, Tj= 25°C On-State Voltage Vr 180 V at 7 =24A, Tj= 25°C On-State Threshold Voltage V(To) TOV. ‘Tj=125°C On-State Slope Resistance rT 36 mQ = Tj=125°C Gate Trigger Current let 10 25 mA Vp=7V Gate Trigger Voltage Vet : 20 V Vp=7V . Holding Current ly 38 mA = RgK=1KQ - Latching Current It 75 mA Rex =1KQ ” : Critical Rate of Voltage Rise dv/dt 200 Vins Vp =.67xVorm Rek =1KQ Tj= 125 °C Critical Rate of Current Rise di/dt 400 A/ys 1g=126 mA dig/dt=1.25 A/ps Tj=125°C Gate Controlled Delay Time ‘tga 600 ns Ig = 125 mA dig/dt=1.25 A/ps Commutated Turn-Off Time tg 50 ps To= 85°C Vp =.67xVpRM . Vr= 35 V lr=I7(AV) Thermal Resistance junc. tocase Rojc 1 K/W 50 micron solder on backside of Chip ere Parts are 100% tested in Chip form with visual inspection after assembly. : Per MiL-STD-105-D, parts will pass AQL 4.0 income inspection. es
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