px1002_fhp3.fm
Document overview
- Manufacturer or author: FRANK
- PDF pages: 5
Technical content
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Electrical Characteristics
Characteristic Sym Notes Min Typ Max Units Nominal Center Frequency fC 1
86.850 MHz
Passband Insertion Loss at fc IL 3 4.0 dB 3 dB Passband BW3 1, 2 ±12 ±25 kHz Amplitude Ripple over fc ±15 kHz 1.0 dBP-P Group Delay Variation over fc ±10 kHz GDV 6.0 µsP-P Third-Order Intermod. for -20 dBm tones at fc ±60 & 120 kHz -95 dBm Rejection fc ±60 kHz 1, 2, 3 11 16 dBfc -880 kHz to fc -940 kHz 65 Ultimate 65 Operating Temperature Range TA 1- 2 0 + 7 0 ° C Impedance Matching to 50 unbalanced External L-C Case Style SM13365-12 13.3 X 6.5 mm Nominal Footprint Lid Symbolization (YY=year, WW=week) See note 4 RFM PX1002 YYWW Standard 7” Reel Quantity 500 units Standard 13” Reel Quantity 1000 units SM13365-12
- Designed for TDMA IS-54 Receiver IF Applications
- Low Insertion Loss
- Excellent Selectivity
- Hermetic 13.3 X 6.5 mm Surface-mount Case
- Unbalanced Input and Output
- Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating Value Units Maximum Incident Power in Passband +10 dBm Maximum DC Voltage Between any 2 terminals 30 VDC Storage Temperature Range -40 to +85 °C Suitable for Lead-free Soldering - Maximum Soldering Profile 260 °C for 30 s
86.85 MHz
- Unless noted otherwise, all specifications apply over the operating tem- perature range with filter soldered to the specified demonstration board with impedance matching to 50 and measured with 50 network analyzer. 2. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. 3. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. 4. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." 5. The design, manufacturing process, and specifications of this filter are subject to change. 6. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. 7. US and international patents may apply. 8. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. Caution: Electrostatic Sensitive Device. Observe precautions for handling. Notes: Electrical Connections Connection Terminals Port 1Hot 2 Port 1 Gnd Return 3 Port 2 Hot 8 Port 2 Gnd Return 9 Case Ground All Others Pb
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www.RFM.com E-mail: info@rfm.com Page 4 of 5 © 2009-2011 by RF Monolithics, Inc. PX1002 - 11/11/11 USER DIRECTION OF FEED COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao 7.0 mm Bo 13.8 mm Ko 2.0 mm Pitch 12.0 mm W 24.0 mm PIN #1 /G32 /G30 /G2E /G32 /G31 /G33 /G2E /G30 /G32 /G2E /G30 /G31 /G30 /G30 /G20 /G52 /G45 /G46 /G2E /G22 /G42 /G22 /G20 /G52 /G45 /G46 /G2E /G48 /G75 /G62 /G20 /G44 /G65 /G74 /G61 /G69 /G6C /G31 /G32 /G2E /G30 /G44 /G69 /G6D /G65 /G6E /G73 /G69 /G6F /G6E /G73 /G20 /G69 /G6E /G20 /G6D /G6D “B” Quantity Per ReelInches millimeters 7 178 500 13 330 3000 Tape and Reel Specifications 24.4
www.RFM.com E-mail: info@rfm.com Page 5 of 5 © 2009-2011 by RF Monolithics, Inc. PX1002 - 11/11/11 SM13365-12 Case Case Dimensions Dimension mm Inches Min Nom Max Min Nom Max C 1.91 2.00 0.075 0.079 D 1.50 0.059 E 0.79 0.031 H 1.0 0.039 P 2.54 0.100 Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free 12-Terminal Ceramic Surface-Mount Case 13.3 x 6.5 mm Nominal Footprint 0.034 TYP. 0.100 TYP. (0.86) (2.54) 0.077 TYP. (1.96) 0.555 (14.10) 0.287 (7.29) 0.334 REF. (8.48) C H P (8 Places) E (10 Places) DB A 9 8 TOP VIEW BOTTOM VIEW 8 9