PV100 ETC1
Document overview
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Technical content
SINGLE-PHASE FULL WAVE BRIDGE BRIDGE u 2.0 AMPERES FOR P.C. BOARD MOUNTING
3.0 AMPERES HEAT SINK MOUNTING
[vies [Sov _[ soo [ aoov [oor [sony | coov_[ so00v | [Tete [eves [pvr | pvao | pvao | pveo | pveo | pvi00 ELECTRICAL CHARACTERISTICS PER LEG (at Ta=25 T Unless Oth erwise Spe cified) [Max Forward vatege Dron Ve=tove i= | 19 | Ame War oc Reesecinen @Pevensaecie |e |_| fue Paisioe Gael ubame) | | NOTE: Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250°C EDI reserves the right tochange these specifications at any time without notice.
a Figure 1 PV SERIES CURRENT DERATING — 4 § LTT TTT TTT TT tT tt yy pA tt TY bce ouretr ae tT TN . CoS EN 2 tty TTT | PENNE TT # TTT t tt ttt tt SST fof LTTITTT TTT | I RS o 20 42 60 80 100 20 «4140 16 i TEMPERATURE ( °C) A= CASE TEMPERATURE, HEAT SINK MOUNTED 8 = AMBIENT TEMPERATURE Figure 2 Figure 3 NON-REPETITIVE SURGE CURRENT POWER DISSIPATION o.1sec 10SEC Fy E ™s "N rot [| | ANELITME TTT ge w Ps] PN rit tA a K 6 42 bed =I 5 W 3 pel = h Ww 30 4 z PTS 3 7 ‘LU TTI ery ee ro 7 aa 1 2.3 46678910 20 30 40 660 Pa CYCLES{60 Hz) a ° 1 2 3 4 IFAM, AVERAGE FORWARD CURRENT (AMP) PV SERIES MECH. OUTLINE D + fA Ac ge es Ja | attaas | t0.44-11.20 | B | 8 | .137.16701A_ | 3.484 24014 L A} —(@) es | © | .75omn | 19.05MIN LF [ s00max [762MAx | ek—o—y- LI it NOTE: 1. Athin film of silicone thermal compound is recommended between the bridge case and mounting surface for improved thermal conduction. ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951,
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