PKFC36C ETC

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

PKFC3.3C* thru PKFC36C* 105180.R1 3/05 www.protekdevices.com P ACKAGED FLIP CHIP ARRAY Only One Name Means ProT ek’Tion™ *P A TENT PENDING”

APPLICATIONS

✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMP ATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV

FEATURES

✔ ✔ ✔ ✔ ✔ CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm) ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Encapsulated 0502 Chip ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Pure-Tin - Sn, 100: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel 05180 PIN CONFIGURATION

3 www.protekdevices.com05180.R1 3/05 PKFC3.3C* thru PKFC36C* *P A TENT PENDING GRAPHS 0 25 50 75 100 125 150 TL - Lead Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C

5 Volts per Division

VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C IPP - Peak Pulse Current - Amps

4 www.protekdevices.com05180.R1 3/05 PKFC3.3C* thru PKFC36C* *P A TENT PENDING APPLICA TION INFORMA TION Ramp-up Ramp-down Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down TS - Preheat TSMAX TSMIN TL t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm

60 Seconds

270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.

5 www.protekdevices.com05180.R1 3/05 PKFC3.3C* thru PKFC36C* *P A TENT PENDING P ACKAGE OUTLINE & DIMENSIONS COPYRIGHT © ProTek Devices 2005 SPECIFICA TIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProT ek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com NOTES 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad : ± 0.003” (± 0.08mm). 3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm). 4. All dimensions ±0.003” on package outline. P ACKAGE OUTLINE MOUNTING P AD DIM MILLIMETERS INCHES P ACKAGE DIMENSIONS A B C D E F G H J K 0.838 1.245 0.762 0.533 0.228 0.533 0.305 0.432 0.432 0.355 0.033 0.049 0.030 0.021 0.009 0.021 0.012 0.017 0.017 0.014 A TOP BOTTOM SIDE H C G J D F EB K DIM MILLIMETERS INCHES P AD DIMENSIONS A B C E F G J 1.016 0.635 1.473 0.203 0.508 0.343 0.343 0.040 0.025 0.058 0.008 0.020 0.0135 0.0135 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 4. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-2. Outline & Dimensions: Rev 1 - 8/03, 06040 T APE & REEL ORIENT ATION NOTE 1. Top view of tape. Solder P ADS face down in tape package. A F G Solder Print Diameter 0.010” - 0.012” J B CE Package Contact Pads Package Outline