TFS757 POWERINT
Document overview
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Technical content
www.powerint.com February 2011 Combined Two-Switch Forward and Flyback Power Supply Controllers with Integrated High Voltage MOSFETs HD DC Input Main Output Auxiliary/Standby Output RTN G S HiperTFS VDDH L FB FB EN EN BP DSB EN FB Control, Gate Drivers, Level Shift R D HS PI-6200-102910 Two-Switch Forward Transformer Flyback Transformer Figure 1. Simplified Schematic of Two-Switch Forward and Flyback Converter.
- Single chip solution for two-switch forward main and flyback standby
- High integration allows smaller form factor and higher power density designs
- Incorporates control, gate drivers, and three power MOSFETS
- Level shift technology eliminates need for pulse transformer
- Protection features include: UV, OV, OTP , OCP , and SCP
- Transformer reset control
- Prevents transformer saturation under all conditions
- Allows >50% duty cycle operation
- Reduces primary side RMS currents and conduction losses
- Standby supply provides built-in overload power compensation
- Up to 434 W total output power in a highly compact package
- Up to 550 W peak
- High efficiency solution easily enables design to meet stringent efficiency specifications
- >90% efficiency at full load
- No-load regulation and low losses at light-load
- Simple clip mounting to heat sink without need for insulation pad
- Halogen free and RoHS compliant
Applications
- PC
- Printer
- LCD TV
- Video game consoles
- High-power adapters
- Industrial and appliance high-power adapters Output Power Table Product Two-Switched Forward 380 V Flyback
100 V - 400 V
(25 °C) Continuous (50 °C) Peak (50 °C) 50 °C TFS757HG 193 W 163 W 228 W 20 W TFS758HG 236 W 200 W 278 W 20 W TFS759HG 280 W 235 W 309 W 20 W TFS760HG 305 W 258 W 358 W 20 W TFS761HG 326 W 276 W 383 W 20 W TFS762HG 360 W 304 W 407 W 20 W TFS763HG 388 W 327 W 455 W 20 W TFS764HG 414 W 344 W 530 W 20 W Table 1. Output Power Table (See Notes on page 13).
Rev. C 02/11 TFS757-764HG www.powerint.com Section List
Rev. C 02/11 TFS757-764HG www.powerint.com
Description
The HiperTFS device family members incorporate both a high-power two-switch-forward converter and a mid-power flyback (standby) converter into a single, low-profile eSIP™ power package. The single chip solution provides the controllers for the two-switch-forward and flyback converters, high- and low-side drivers, all three of the high-voltage power MOSFETs, and eliminates the converter’s need for costly external pulse transformers. The device is ideal for high power applications that require both a main power converter (two-switch forward) up to 414 W, and standby converter (flyback) up to 20 W. HiperTFS includes Power Integrations’ standard set of comprehen- sive protection features, such as integrated soft-start, fault and over-load protection, and hysteretic thermal shutdown. HiperTFS utilizes advanced power packaging technology that simplifies the complexity of two-switch forward layout, mounting and thermal management, while providing very high power capabilities in a single compact package. The devices operate over a wide input voltage range, and can be used following a power-factor correction stage such as HiperPFS. Two-switch-forward power converters are often selected for applications demanding cost-effective efficiency, fast transient response, and accurate tolerance to line voltage fluctuation. The two-switch-forward controller incorporated into HiperTFS devices improves on the classic topology by allowing operation considerably above 60% duty cycle. This improvement reduces RMS currents conduction losses, minimizes the size and cost of the bulk capacitor, and minimizes output diode voltage ratings. The advanced design also includes transformer flux reset control (saturation protection) and charge-recovery switching of the high-side MOSFET, which reduces switching losses. This combination of innovations yields an extremely efficient power supply with smaller MOSFETs, fewer passives and discrete components, and a lower-cost transformer. HiperTFS’s flyback standby controller and MOSFET solution is based on the highly popular TinySwitch™ technology used in billions of power converter ICs due to its simplicity of operation, light load efficiency, and rugged, reliable, performance. This flyback converter can provide up to 20 W of output power and the built in overload power compensation reduces component design margin. Product Highlights Protected Two-Switch Forward and Flyback Combination Solution
- Incorporates three high-voltage power MOSFETs, main and standby controllers, and gate drivers
- Level shift technology eliminates need for pulse transformer
- Programmable line undervoltage (UV) detection prevents turn-off glitches
- Programmable line overvoltage (OV) detection; latching and non-latching
- Accurate hysteretic thermal shutdown (OTP)
- Accurate selectable current limit (main and standby)
- Output over-current protection (OCP)
- Fully integrated soft-start for minimum start-up stress
- Simple fast AC reset
- Reduced EMI
- Synchronized 66 kHz forward and 132 kHz flyback converters
- Frequency jitter
- Eliminates up to 30 discrete components for higher reliability and lower cost Asymmetrical Two-Switch Forward Reduces Losses
- Allows >50% duty cycle operation
- Reduces primary side RMS currents and conduction losses
- Minimizes the size and cost of the bulk capacitor
- Allows reduced capacitance or longer hold-up time
- Allows lower voltage output diodes
- Transformer reset control
- Prevents transformer saturation under all conditions
- Extends duty cycle to satisfy AC cycle drop out ride through
- Duty cycle soft-start with 115% current limit boost
- Satisfies 2 ms ~ 20 ms start-up with large capacitance at output
- Output short circuit protection (SCP) with auto-restart
- Remote ON/OFF function
- Voltage mode controller with current limit
20 W Flyback with Selectable Power Limit
- TinySwitch-III based converter
- Selectable power limit (10 W, 12.5 W, 15 W, or 20 W)
- Built-in overload power compensation
- Flat overload power vs. input voltage
- Reduces component stress during overload conditions
- Reduces required design margin for transformer and output diode
- Output overvoltage (OV) protection with fast AC reset
- Latching, non-latching, or auto-restart
- Auto-restart Advanced Package for High Power Applications
- 434 W output power capability in a highly compact package
- Up to 550 W peak
- Simple clip mounting to heat sink
- Can be directly connected to heat sink without insulation pad
- Provides thermal impedance equivalent to a TO-220
- Heat slug connected to ground potential for low EMI
- Staggered pin arrangement for simple routing of board traces and high-voltage creepage requirements
- Single power package for two power converters reduces assembly costs layout size
Table 2. Summary of Differences Between HiperTFS and Other Typical High Power Supplies. Nominal Duty Cycle 33% 45% Wider duty cycle reduces RMS switch currents by 17%. Component Count Higher Lower Saves up to 50 components, depending on specification.
1 Package No SIL (insulation) pad required
Drain of the low-side MOSFET transistor forward converter. Drain of the MOSFET of standby power supply. voltage-reference connection only. bypass to signal remote ON/OFF of the main converter only. detected to select one of several internal current limits. response as a function of input voltage. also used to implement remote ON/OFF for the main controller. low-side standby bias supply. SOURCE pin of the high-side MOSFET. with respect to low-side source and ground. Figure 2. Pin Configuration.
3 V+VT
Figure 3. Functional Block Diagram for Two-Switch Forward Converter.
Figure 4. Functional Block Diagram for Flyback/Standby Converter.
1.0 V + VTENABLE (EN)
nominal selected current limit. pin is used to provide duty cycle control for the main converter. 12 kHz, in order to facilitate optimal control loop response. LINE-SENSE pin and RESET pin. high-side operating voltage has an internal 12 V shunt-regulator. provided from a floating winding on the standby supply. undesirable from a standby light-load efficiency point of view. converts the reset voltage into an RESET pin current signal. duty cycle limit is trimmed during production. (see Applications section layout guidelines for details). Figure 7. PWM Duty Cycle vs. Control Current.
current limit according to the following table. approximately 40 V (IL(SB-UVON) ). Figure 9. Current Limit Selection. Table 3. FEEDBACK Pin Main Current Limit Selection.
6.0 V after
Figure 8. Duty Cycle Limit vs. Ratio of R Pin Current Over L Pin Current.
leaving the Standby in operation. typically a PFC boost converter).
- There are 4 current limits that are selected via the ENABLE
- Secondary OVP latching shutdown. This is triggered via a
threshold (IBP(SD) = 15 mA).
- Dedicated LINE-SENSE pin for line-voltage detection providing
which detects input voltage only during restart).
- Current limit is compensated as a function of input voltage
to maintain a flat overload characteristic versus input voltage.
4.7 V is achieved), and before the main or standby MOSFETs
start switching. This is done to minimize noise interference. Figure 10. Main and Standby Start-Up. Table 4. ENABLE Pin Standby Current Limit Selection. Figure 11. L and R Pin Duty Limit Mode.
according to the above table. float to it’s nominal voltage of 3.5 V. power capability of the device is more tightly managed. provides a much safer design. shutdown if regulation is lost when input voltage is below 100 V. voltage drops below approximately 40 V (as defined by IL(SB-UVOFF)). main converter operates at exactly half that frequency at 66 kHz. peak and average EMI emissions. switching, versus the linear control loop of the main converter. the device to automatically recover from any thermal fault event. safety feature to protect against abnormal or fault conditions. selection (FEEDBACK pin and ENABLE pin resistors respectively). point the standby power supply is ready to begin operation. continue to charge the BYPASS pin if it droops below 5.7 V.
- First, for a 4 mA threshold (IBP(ON)) for main remote-on. When
Figure 12. Shows Output Overload Power for Both Compensated and Uncompensated Standby Current Limits.
Table 5. Output Power Table.
- Maximum practical continuous power in an open frame design with adequate
ambient temperature (see Key Applications Considerations for more information).
- Package: eSIP16/12. (Note: Direct attach to heat sink, does not require
- Second a 15 mA threshold (IBP(SD))for standby secondary OVP
threshold, the standby and main converters are latched-off. Applications section for details). connected to the heat sink without need for electrical insulation. isolation and thus also allows direct connection to the heat sink.
- Typical multi-output PC main with the following outputs +12 V,
- A boost regulated DC input for Main 300 VDC to 385 VDC
- HiperTFS total efficiency at least 85% at full load.
- Schottky high-efficiency output diodes.
- DC input for Standby 130 VDC to 385 VDC.
- Sufficient heat sinking and fan cooling to keep device
- Transformer designed with nominal duty factor of 45%.
clamp voltage for rest of Main transformer are also essential. values or refer to formula in AN-51. 12 V bias required for the high-side driver is maintained. from 30% duty factor to max duty factor in approximately 15 ms. loads and meet less than 20 ms output rise time requirement. Figure 14. Full Range EMI Scan (132 kHz with Jitter) With Identical Circuitry and Conditions. Figure 15. Typical Primary Winding Clamp-to-Rail.
150 V+VBUS
Figure 13. Fixed Frequency Operation Without Jitter.
on output ripple (rejected by control loop). which increases efficiency and reducers no-load consumption. Figure 16. HiperTFS Layout Considerations. Figure 17. HiperTFS Heat Sink Mounting. package between the GROUND pin and the BYPASS pin. very close to the pin. This will minimize the pick-up of noise. capacitor negative or positive terminal.
Figure 26. L and R Pin Duty Limit With RL = 4 MW and RR = 4 MW. universal input of 90 VAC to 265 VAC. BYPASS pin capacitor via internal high-voltage current source.
Figure 27. Schematic of High-Efficiency +12 V, 25 A Main Output and +5 V, 2.5 A Standby Power Supply. both switches at 66 kHz and the main output voltage will rise. when the input voltage is below 215 V. of 30 CFM airflow at full load. fault into bypass pin to cause latching shut-off of both converters.
5 V12 V
380 VDC
Figure 28. Layout of High-Efficiency +12 V, 25 A Main Output and +5 V, 2.5 A Standby Power Supply.
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units Control Functions Switching Frequency - PC Main fS(MA) TJ = 25 °C Average 62 66 70 kHzPeak-to-Peak Jitter 4 Frequency Jitter Modulation Rate fM(MA) 250 Hz Remote-ON Main BYPASS Pin Remote-ON Current IBP(ON) VEN = Open 3.2 3.8 4.4 mA BYPASS Pin Remote- OFF Current Hysteresis IBP(OFF) 1.1 mA BYPASS Pin Latching Shutdown Threshold IBP(SD) 13 15.5 17.5 mA Main/Standby Remote- ON Delay tR(ON) 2.5 ms Main/Standby Remote- OFF Delay tR(OFF) 2.5 ms Main/Standby Remote- OFF Long Time Period tR(PERIOD) 80 ms Absolute Maximum Ratings(1,5) Notes: 1. All voltages referenced to SOURCE, TJ = 25 °C. 2. Normally limited by internal circuitry. 3. 1/16 in. (1.59 mm) from case for 5 seconds. 4. The higher peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 5. Maximum ratings specified may be applied one at a time, without causing permanent damage to the product. Exposure to Absolute Rating conditions for extended periods of time may affect product reliability. Thermal Resistance Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. Soft-Start High-Side Start-Up Charge Time tD(CH) 14 ms Main Current Limit at Start-Up ILIM(SS) See Note A 115 % Soft-Start Period 12 ms
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units FEEDBACK Pin PWM Gain DCREG(MA) -1800 mA < IFB < -1500 mA, IL = 60 mA, IR = 160 mA -70 %/mA PWM Gain Temperature Drift TCDCREG 0.05 %/°C FEEDBACK Pin Feed- back Onset current IFB(ON) IL = 60 mA, IR = 170 mA TJ = 25 °C -1.1 mA FEEDBACK Pin Current at Zero Duty Cycle IFB(OFF) -2.1 mA FEEDBACK Pin Internal Filter Pole PFB 12 kHz FEEDBACK Pin Voltage VFB IFB (OFF), IFB = IFB(ON) 3.56 V LINE-SENSE Pin (Line Voltage) Line Undervoltage Threshold – Standby IL(SB-UVON) TJ = 25 °C Threshold 25 mA IL(SB-UVOFF) 10 Line Undervoltage Threshold – Main IL(MA-UVON) TJ = 25 °C Threshold 76 80 84 mA IL(MA-UVOFF) Threshold 47 53 58 Line Overvoltage Threshold – Main and Standby IL(MA-OVON) TJ = 25 °C Threshold 119 135 146 mA IL(MA-OVOFF) Threshold 135 146 164 LINE-SENSE Pin Voltage VL IL = 79 mA 2.4 VIL = 149 mA 2.5 LINE-SENSE Pin Short Circuit IL(SC) VL = VBP 375 mA RESET Pin (Duty Limit/Main Only Remote-OFF) Reset Overvoltage Threshold IR(MA-OVON) TJ = 25 °C Threshold 165 205 245 mA IR(MA-OVOFF) Threshold 175 215 255 RESET Pin Voltage VR IR = 155 mA 2.5 V RESET Pin Short Circuit Current IR(SC) VR = VBP 375 mA Duty Cycle – Programmable Limit DCLIMIT(MA) IL = 100 mA, IR = 110 mA 50.5 %IL = 115 mA, IR = 140 mA 47.5 DCMAX(MA) IL = 100 mA, IR = 170 mA 63 Current Limit Programming FEEDBACK Pin Current Limit Detection Range #1 ILIM(1)(MA) Start-up See Note C 0-5 mA FEEDBACK Pin Current Limit Detection Range #2 ILIM(2)(MA) Start-up See Note C 5-12 mA FEEDBACK Pin Current Limit Detection Range #3 ILIM(3)(MA) Start-up See Note C 12-24 mA
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units Maximum Current Limit Current Limit ILIM(1)(MA) TFS757 TJ = 25 °C di/dt = 175 mA/ms 1.02 A ILIM(2)(MA) di/dt = 233 mA/ms 1.36 ILIM(3)(MA) di/dt = 291 mA/ms 1.58 1.70 1.82 ILIM(1)(MA) TFS758 TJ = 25 °C di/dt = 250 mA/ms 1.45 ILIM(2)(MA) di/dt = 335 mA/ms 1.95 ILIM(3)(MA) di/dt = 420 mA/ms 2.28 2.45 2.62 ILIM(1)(MA) TFS759 TJ = 25 °C di/dt = 258 mA/ms 1.62 ILIM(2)(MA) di/dt = 344 mA/ms 2.16 ILIM(3)(MA) di/dt = 430 mA/ms 2.55 2.70 2.94 ILIM(1)(MA) TFS760 TJ = 25 °C di/dt = 324 mA/ms 1.86 ILIM(2)(MA) di/dt = 432 mA/ms 2.48 ILIM(3)(MA) di/dt = 540 mA/ms 2.88 3.10 3.30 ILIM(1)(MA) TFS761 TJ = 25 °C di/dt = 338 mA/ms 1.95 ILIM(2)(MA) di/dt = 450 mA/ms 2.65 ILIM(3)(MA) di/dt = 564 mA/ms 3.07 3.30 3.53 ILIM(1)(MA) TFS762 TJ = 25 °C di/dt = 360 mA/ms 2.10 ILIM(2)(MA) di/dt = 480 mA/ms 2.80 ILIM(3)(MA) di/dt = 600 mA/ms 3.25 3.50 3.75 ILIM(1)(MA) TFS763 TJ = 25 °C di/dt = 402 mA/ms 2.35 ILIM(2)(MA) di/dt = 402 mA/ms 3.10 ILIM(3)(MA) di/dt = 670 mA/ms 3.60 3.90 4.16 ILIM(1)(MA) TFS764 TJ = 25 °C di/dt = 468 mA/ms 2.70 ILIM(2)(MA) di/dt = 624 mA/ms 3.60 ILIM(3)(MA) di/dt = 780 mA/ms 4.18 4.50 4.81 Low-Side Main MOSFET ON-State Resistance RDS(ON) TFS757 ID = ILIM(3)(MA) TJ = 25 °C 4.87 5.60 W TJ = 100 °C 7.69 9.05 TFS758 ID = ILIM(3)(MA) TJ = 25 °C 3.25 3.73 TJ = 100 °C 4.90 5.83 TFS759 ID = ILIM(3)(MA) TJ = 25 °C 2.35 2.70 TJ = 100 °C 3.60 4.21 TFS760 ID = ILIM(3)(MA) TJ = 25 °C 1.96 2.24 TJ = 100 °C 2.80 3.29 TFS761 ID = ILIM(3)(MA) TJ = 25 °C 1.60 1.85 TJ = 100 °C 2.30 2.75 TFS762 ID = ILIM(3)(MA) TJ = 25 °C 1.40 1.60 TJ = 100 °C 2.00 2.35 TFS763 ID = ILIM(3)(MA) TJ = 25 °C 1.20 1.40 TJ = 100 °C 1.70 2.05 TFS764 ID = ILIM(3)(MA) TJ = 25 °C 1.10 1.26 TJ = 100 °C 1.53 1.80 OFF-State Drain Leakage Current IDSS(D) TFS757 VL, VR = 0 V, IBP = 6 mA, VDS = 560 V, TJ = 100 °C 150 mA TFS758 150 TFS759 150 TFS760 150 TFS761 470 TFS762 470
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units Low-Side Main MOSFET (cont.) OFF-State Drain Leakage Current IDSS(D) TFS763 VL, VR = 0 V, IBP = 6 mA, VDS = 560 V, TJ = 100 °C 470 mATFS764 470 Breakdown Voltage BVDSS(D) VL, VR = 0 V, IBP = 6 mA, TJ = 25 °C 725 V Rise Time tR(D) 100 ns Fall Time tF(D) 50 ns High-Side Main MOSFET ON-State Resistance RDS(ON)(HD) TFS757 ID = ILIM(3)(MA) TJ = 25 °C 1.76 W TJ = 100 °C 2.12 TFS758 ID = ILIM(3)(MA) TJ = 25 °C 1.15 TJ = 100 °C 1.40 TFS759 ID = ILIM(3)(MA) TJ = 25 °C 0.88 TJ = 100 °C 1.06 TFS760 ID = ILIM(3)(MA) TJ = 25 °C 0.88 TJ = 100 °C 1.06 TFS761 ID = ILIM(3)(MA) TJ = 25 °C 0.69 TJ = 100 °C 0.84 TFS762 ID = ILIM(3)(MA) TJ = 25 °C 0.58 TJ = 100 °C 0.7 TFS763 ID = ILIM(3)(MA) TJ = 25 °C 0.46 TJ = 100 °C 0.56 TFS764 ID = ILIM(3)(MA) TJ = 25 °C 0.46 TJ = 100 °C 0.56 Effective Output Capacitance COSS(EFF)(HD) TFS757 TJ = 25 °C, VGS = 0 V VDS = 0 V to 80% VDSS(HD) pF TFS758 82 TFS759 110 TFS760 110 TFS761 140 TFS762 165 TFS763 205 TFS764 205 Breakdown Voltage BVDSS(HD) TJ = 25 °C 530 V OFF-State Drain Current Leakage IDSS(HD) TFS757 VD = 424 V, TJ = 100 °C mA TFS758 60 TFS759 60 TFS760 60 TFS761 65 TFS762 80 TFS763 110 TFS764 110 Turn-on Voltage Rise Time tR(HD) 30 ns Turn-off Voltage Fall Time tF(HD) 25 ns
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units High-Side Main MOSFET (cont.) High-Side Bias Shunt Voltage VDDH(SHUNT) See Note B IDDH = 2 mA 11.4 12.1 12.8 V High-Side Undervoltage ON-Threshold VDDH(UVON) See Note B 10.7 11.1 11.5 V High-Side Undervoltage OFF-Threshold VDDH(UVOFF) See Note B 9.5 9.9 10.3 V High-Side Shunt Hysteresis Voltage VDDH(HYST) See Note B 0.7 1.2 1.5 V Standby MOSFET ON-State Resistance RDS(ON)(DS) IDSB = ILIM(3)(DSB) TJ = 25 °C 3.7 4.37 W TJ = 100 °C 5.5 6.25 OFF-State Drain Leakage Current IDSS1(DS) VBP = 6.2 V VEN = 0 V VDS = 560 V TJ = 100 °C 200 mA IDSS2(DS) VBP = 6.2 V VEN = 0 V VDS = 375 V, TJ = 50 °C 15 Breakdown Voltage BVDSS(DS) VBP = 6.2 V, VEN = 0 V, TJ = 25 °C 725 V DRAIN Supply Voltage VDSB(START) 50 V Standby Controller Output Frequency in Standard Mode fS(SB) TJ = 25 °C Average 124 132 140 kHz Peak-to-peak Jitter 8 Maximum Duty Cycle DCMAX(DSB) IL = 40 mA 67 70 73 % ENABLE Pin Upper Turnoff Threshold Current IDIS -150 -115 -80 mA ENABLE Pin Voltage VEN IEN = 25 mA 2.0 2.4 2.8 V IEN = -25 mA 0.8 1.2 1.6 BYPASS Pin Charge Current ICH1 VBP = 0 V, mA ICH2 VBP = 4 V, TJ = 25 °C -4 -1.5 0 BYPASS Pin Voltage VBP VDS = 50 V 5.50 5.70 5.90 V BYPASS Pin Voltage Hysteresis VBP(HYST) 0.80 1.0 1.20 V BYPASS Pin Shunt Voltage VBP(SHUNT) IBP = 2 mA 5.8 6.0 6.2 V Standby Circuit Protection ENABLE Pin Current Limit Selection Range #1 ILIM(1)(DSB) Start-up 0-8.5 mA
Rev. C 02/11 TFS757-764HG www.powerint.com Parameter Symbol Conditions SOURCE = 0 V; TJ = 0 °C to 100 °C (Unless Otherwise Specified) Min Typ Max Units Standby Circuit Protection (cont.) ENABLE Pin Current Limit Selection Range #2 ILIM(2)(DSB) Start-up 8.5-18 mA ENABLE Pin Current Limit Selection Range #3 ILIM(3)(DSB) Start-up 18-33 mA ENABLE Pin Current Limit Selection Range #4 ILIM(4)(DSB) Start-up 33-60 mA Standby Current Limit ILIM(1)(DSB) IL = 20 mA, di/dt = 95 mA/ms, TJ = 25 °C 450 500 550 mA ILIM(2)(DSB) IL = 20 mA, di/dt = 125 mA/ms, TJ = 25 °C 600 650 700 ILIM(3)(DSB) IL = 20 mA, di/dt = 143 mA/ms, TJ = 25 °C 675 750 825 ILIM(4)(DSB) IL = 20 mA, di/dt = 105 mA/ms, TJ = 25 °C 495 550 605 Δ ILIM ILIM (IL = 100 mA) / ILIM (IL = 20 mA) di/dt = 125 mA/ms 80 % General Circuit Protection Power Coefficient I2f I2f = ILIM(2)(DSB)(TYP)× fS(SB)(OSC)(TYP) TJ = 25 °C 0.9 × I2f I2f 1.12 × I2f A2Hz Initial Current Limit IINIT TJ = 25 °C 0.75 × ILIM(MIN) Leading Edge Blanking Time (Main) tLEB(D) TJ = 25 °C 170 215 ns Leading Edge Blanking Time (Standby) tLEB(DSB) TJ = 25 °C 170 215 ns Current Limit Delay (Main) tILD(D) TJ = 25 °C 150 ns Current Limit Delay (Standby) tILD(DSB) TJ = 25 °C 150 ns Thermal Shutdown Temperature TSD 118 °C Thermal Shutdown Hysteresis TSD(HYST) 55 °C Auto-Restart ON-Time at fOSC Standby tAR TJ = 25 °C 64 ms Auto-Restart Duty Cycle Standby DCAR TJ = 25 °C 2.2 % Supply Current DRAIN Supply Current IS1 EN Current > IDIS (No MOSFETs Switching) 400 750 1000 mA IS2 EN Open (Standby MOSFET Switching at fOSC) 600 950 1200 NOTES: A. The current limit is boosted for the first 34 ms of main supply switching and returns to normal level after this period. B. VDDH(SHUNT) minus VDDH(UV_ON) is equal to 250 mV minimum. C. Level 1 RFB = open, Level 2 RFB = 511 kW, Level 3 RFB = 232 kW. D. Level 1 REN = open, Level 2 REN = 280 kW, Level 3 REN = 137 kW, Level 4 REN = 63.4 kW.
Figure 53. High-Side MOSFET Power vs. Drain Voltage.
Rev. C 02/11 TFS757-764HG www.powerint.com Pin 1 0.235 (5.96) Ref. 0.010 (0.25) Typ. 0.101 (2.57) Ref. 0.012 (0.30) Typ. 0.020 (0.51) Ref. 0.035 (0.89) Ref. TOP-END VIEW B-B Location of Exposed Metal Tie-Bars PI-5300-021411 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions noted are determined at the outermost extremesof the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and inter- lead flash, but including any mismatch between the top and bottom of the plastic body. Maximum mold protrusion is 0.007 (0.18) per side. 3. Dimensions noted are inclusive of plating thickness. 4. Does not include inter-lead flash or protrusions. 5. Pin #6 is the only straight (unformed) lead. 6. Controlling dimensions in inches (mm). 7 8. Tied to SOURCE (pin 6). 9. Tied to HS (pin 14). 10 11. Tied to HD (pin 16). eSIP-16B (H Package) 0.381 (9.68) Ref. 0.519 (13.18) Ref. 0.012 (0.30) Ref. 0.628 (15.95) Ref. 0.019 (0.48) Ref. 0.027 (0.70) 0.023 (0.58) 0.020 (0.50) All Around 0.016 (0.41) Ref. 0.290 (7.37) Ref. Detail A 0.076 (1.93) 0.118 (3.00) 1613 1411109 9875 631 Pin 1 I.D. 0.118 (3.00) 0.201 (5.11) Ref. FRONT VIEW SIDE VIEW BACK VIEW Detail A (N.T.S) BOTTOM-END VIEW 0.207 (5.26) 0.120 (3.05) 0.081 (2.06) 0.077 (1.96) 12×0.024 (0.61) 0.019 (0.48) 0.010 M 0.25 M C A B 4312×0.016 (0.41) 0.011 (0.28) 0.020 M 0.51 M C 0.653 (16.59) 0.647 (16.43) 0.021 (0.53) 0.046 (1.17) 0.325 (8.25) 0.320 (8.13) C A B B B MOUNTING HOLE PATTERN (N.T.S) All dimensions in inches (mm) 0.152 (3.88) 5 1 0.164 (4.18) 0.114 (2.91) 791114 0.114 (2.91) 0.114 (2.91)0.076 (1.94) 0.076 (1.94) 0.076 (1.94) 0.114 (2.91) 381016 13 16 1314 11 10 8 7 56 3 1
Rev. C 02/11 TFS757-764HG www.powerint.com Part Marking Information
- HiperTFS Product Family
- TFS Series Number
- Package Identifier H Plastic eSIP-16B
- Pin Finish G Halogen Free and RoHS Compliant TFS 757 H G Part Ordering Information Part Number Option Quantity PFS757HG Tube 30 PFS758HG Tube 30 PFS759HG Tube 30 PFS760HG Tube 30 PFS761HG Tube 30 PFS762HG Tube 30 PFS763HG Tube 30 PFS764HG Tube 30
B Initial Release. 11/09/10 C Updated Absolute Maximum Ratings section. Updated TFS759 ILIMIT, Figures 3, 25, 41, and Package drawing. 02/11 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or Power Integrationslly by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2011, Power Integrations, Inc. Power Integrations Worldwide Sales Support Locations World Headquarters
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