DATASHEET SEARCH SITE

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

MOS FET Power Amplifier Module for E-TACS Handy Phone @ FEATURES @ OUTLINE DRAWING (Unit: mm) ‘* Surface Mounted Small Package saa “ St Beexef S @ ABSOLUTE MAXIMUM RATINGS (Tc = 25°C) SS od | Ratoy oo + 1 Supply Voltage v Bs a wy) Sf 0251. Supp Gurest_| typ |? | A kd ld ARC Yolag v 1a Ieal76 ae al & TopatPower [Pa [29 [aw i- ‘Operating Case Tefop) —3~ +10 *c — a ‘Temperature 245th. sft Storage Tug =30~ +100 °c ‘Temperature west 1. Pin 2. Vapc 3. Vpp

4 Pout

  1. G: GND @@ ELECTRICAL CHARACTERISTICS (Tc = 25°C) Peanaer | Syabsi__| Mm | Max_[ Unt Tes Condos ‘Total Eficieney a 2nd HamenicDivrion | anata [| — | —w [am] pr 272m =12W Tg VSWR | vswncsy [= Pn a arco Vpp 5 8V,f = 87210905 MHz, Load VSWR No Pin = 2mW, Rg = 509, Vapc s 4V, Tolerance Degradation t = 20sec, Load VSWR s 20 All Phase Angles f = 872 t0 905 MHz, Pi, = 2mW, " ‘No Parasitic Vpp = 5.2 ~ 7.5V, Pout S 1.6W, Stability Oscillation Zg = 500, oe Load VSWR = 3 All Phases Angles HITACHI Hitachi America, Ltd. Hitachi Plaza + 2000 Sierra Point Pkwy. » Brisbane, CA 94005-1819 « (415) 589-8300 59

R007, 6 s 50 3 60 CoA oe 5 5 2st a a 5 25 — Py PyeeEeer | | 1a | NfeT | | [ot es

4 Vepe = 2V

gg a1 II, es ei |, ‘860 870 880 890 900 910 oo 1 1S 2 Frequency ¢ (uiHz) Input Power Fig (mW) oo cass Figure 1 Figure 2 T .LLE. TT je sy Es J ,t 50 iad |_|. | so 3.1 3.L PEN. | PT. E44 3 ot 40 & 2 40% Sst © ssl yy eee <x £ fs SS: 30 § 3 haar vswi 7) $ | {= 905 MHz 2 1 Rin, 20 eo. Yoo = 6¥ 20 Nera ae 1 05 = 10 Os 10 ‘860 870 880 890 900 910 005 tS Frequency (MHz) Input Power Pig (mW) Figure 3 Figure 4 HITACHI 60 Hitachi America, Ltd «Hitachi Plaza» 2000 Sierra Point Pkwy. «Brisbane, CA 94005-1819 » (415) 589-8300

@ TEST SYSTEM DIAGRAM Vp 7 On rT Meter Analyzer LP.F 308 ATT = 7 fest ir Aha EI =) hr onl Fare | Directional Directional Coupler Coupler Figure 13 @ TEST FIXTURE PATTERN Unit; mm 2.88,5> 27.2.8

32.97 Ss 4 5 882 __}

fe} —— | 37- et} [ry wl wy 3 “zs Hes 1 os Vape 1 Vdd vs) 100 Grass Epoxy Double Sided P.C.B (t = 1.6 mm, and r = 4.8) Figure 14 HITACHI Hitachi America, Ltd. * Hitachi Plaza * 2000 Sierra Point Pkwy. * Brisbane, CA 94005-1819 + (415) 589-8300 63

@ NOTE FOR USE 7. Recommendation to decrease the thermal resistance is 1. Don't apply the retlow soldering process. shown below. 1 ir ‘a, Arrangement of through holes under as many as pos- 2, Don't apply the dipping solder process to the lead pins. sible under PFOOZ?, 3. To avoid the stress against the lead pins, lead pins it i should be soldered after the soldering of ground flange. b. Addon of external heatsink on the motal casa of 4, Soldering temperature and time should be less than . ‘ 200°C, 10 290 per sach pin 8. Dont nash OORT exer ed Dan ound Fae 9. It should be recommended to apply @ non-chlorine sol 5. To protect devices from electro-static damage, soldering ‘ iron, measuring equipment and human body etc. should rymodules: For example, KR19 by Ninpn Almit Co. be grounded. , 6. To avoid the degradation of ‘and output power, 10. When the external parts (Isorator, Duplexer, etc.) of the avoid officioncy Power. module are changed, the electrical characteristics lead pins should not be float from PCB, and connected should be evahusion enough just on the RF signal line. (Refer to Figure 17.) nougl 11. When Vapc is increased more than 3V, output power is saturated, however, drain current is increased still more. So Vapc should be limitted less than 3V. RF signal line ‘WORSE BETTER ; module module \\ PCB / All of the lead pins should be connected just on the AF signal line. oars-18 Figure 17 HITACHI Hitachi America, Ltd. + Hitachi Plaza 2000 Sierra Point Pkwy, « Brisbane, CA 94005-1819 » (415) 589-8300 65