PESD1221U005 LEIDITECH

Document overview

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Technical content

  1. Features 2. PinDescription  Ultra-Low capacitance:0.05pF(typ.)  Low leakage current(<100nA)  Fast response time(<1ns)  Bi-directional,single line protection  IEC 61000-4-2 (Air): 15kV IEC 61000-4-2 (Contact): 8kV 3. Applications 4. SchematicDiagram  USB 3.0/3.1  HDMI 1.3/1.4/2.0  RF Antenna  SATA and eSATA Interface 5. OrderInformation Type Package Size(mm) DeliveryForm DeliveryQuantity 0201 0.60x0.30x0.32 7” T&R 15,000 6. Limiting Values(TA = 25°C,unlessotherwisespecified) Symbol Parameter Conditions Min Max Unit VESD Electrostatic Discharge Voltage IEC 61000-4-2; Contact Discharge - 8 kV IEC 61000-4-2; Air Discharge - 15 kV TA Operating Temperature Range - -55 125 ℃ Tstg Storage Temperature Range - -40 85 ℃ 7. Electrical Characteristics(TA = 25°C unlessotherwisespecified) Symbol Parameter Conditions Min Typ. Max Unit VDC Continuous Operating Voltage - - - 12.0 V VT Trigger Voltage IEC61000-4-2 8kV contact discharge - 450 - V VC Clamping Voltage IEC61000-4-2 8kV contact discharge - 40 - V IL Leakage Current DC 12V shall be applied on component - - 100 nA CJ Capacitance Measured at 10MHz - 0.05 - pF Ultal Low Capacitance ESD Protection Diode in 0201 PESD1221U005 PESD1221U005 Rev : www.leiditech.com 01.06.2018 1/6
  1. TypicalCharacteristics Fig.1 Typical ESD Response （IEC 61000-4-2, 8kV contact discharge） Fig.2 Typical Device Capacitance VS. Frequency Fig.5 HDMI 2.0 Mask at 6.0 Gbps Time(ns) PESD1221U005 Rev : www.leiditech.com 01.06.2018 2/6
  1. ESD Protectionfor SignalLine The PESD is designed for the protection of one bidirectional data line from ESD damage.  Place the PESD as close to the input terminal or connector as possible.  Minimize the path length between the PESD and the protected signal line.  Use ground planes whenever possible. PESD1221U005 Rev : www.leiditech.com 01.06.2018 3/6 PESD1221U005
  1. PackageDimension D b e A L2 E RecommendedSolderPadFootprint *Sizesinmm Notes： This solder pad layout is for reference purposes only. Dimension Unit: Millimeters Min. Max. A 0.25 0.40 b 0.15 0.20 D 0.50 0.70 E 0.25 0.35 e 0.45BSC L1 0.20 0.30 L2 0.00 0.05 PESD1221U005 Rev : www.leiditech.com 01.06.2018 4/6
  1. Soldering Parameters FIG.5: Reflow condition Temperature TS(min) TS(max) TL TP tp tL time to peak temperatue Time (t 25℃ to peak) Ramp-up Ramp-down Preheat Critical Zone TL to TP ts ReflowCondition Pb-FreeAssembly Pre-heat -Temperature Min (Ts(min)) +150°C -Temperature Max(Ts(max)) +200°C -Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquid us Temp (TL) to peak) 3°C/sec. Max Ts(max) to TL - Ramp-up Rate 3°C/sec. Max Reflow -Temperature(TL)(Liquid us) +217°C -Temperature(tL) 60-150 secs. Peak Temp (Tp) +260(+0/-5)°C Time within 5°C of actual Peak Temp (tp) 30 secs. Max Ramp-down Rate 6°C/sec. Max xTime 25°C to Peak Temp (TP) 8 min. Max Do not exceed +260°C PESD1221U005 Rev : www.leiditech.com 01.06.2018 5/6
  1. PackageInformation Dimension Typical Unit A0 0.38 mm B0 0.68 K0 0.32 P0 4.00 P1 2.00 P2 2.00 T 0.20 E 1.75 F 3.50 D0 1.55 D1 0.20 W 8.00 PESD1221U005 Sha nghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 6/6