PESD0603MS12 LEIDITECH

Document overview

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Technical content

6 General Characteristics

7 Electrical Characteristics(TA =25°C)

Notes: Trigger and clamping voltage are measured per IEC 61000-4-2, 8KV contact discharge method. Model Package Size PESD0603MS12 0603-2 1.60 mm × 0.80 mm × 0.30 mm Parameter Value Unit Contact Discharge Voltage Per IEC61000-4-2 8K V Air Discharge Voltage Per IEC61000-4-2 15K V Operating Temperature -55 to +125 ℃ Storage Temperature -40 to +85 ℃ Parameter Symbol Conditions Min. Typ. Max. Units Continuous Operating Voltage VDC --- --- --- 12 V Trigger Voltage VT IEC61000-4-2 8KV contact discharge --- 450 --- V Clamping Voltage VC IEC61000-4-2 8KV contact discharge --- 40 --- V Leakage Current IL DC 12V shall be applied on component --- --- 10 nA Capacitance CP Measured at 10MHz --- 0.05 --- pF ESD Pulse Withstand Pulses IEC61000-4-2 8KV contact discharge 1000 --- --- ---

1 Feature

 Ultra-low capacitance,0.05pF(typ.)  Low leakage current(<10nA)  Fast response time(<1ns)  Bi-directional, single line protection

2 Description

PESD0603MS12 polymeric ESD suppressor help protect sensitive electronic equipment against electrostatic discharge (ESD) without distorting data signals. This protection is a result of its ultra -low capacitance of only 0.05 pF (I/O to GND), and it can be used to help equipment to pass IEC61000 -4-2 level 4 test (15KV air, 8KV contact discharge).

3 Application

 Smart phone/Mobile internet device  Laptop/Desktop computer  Antennas (Cell Phones, GPS…)  USB 3.0, USB 3.1 and high speed interface

4 Device Information

o n PESD0603MS12 PESD0603MS12 Single-Channel ESD Protection Device in 0603 Package Rev : www.leiditech.com 01.06.2015 1/7

8 Typical ESD Response(IEC 61000-4-2, 8KV contact discharge)

9 Typical ESD Response(IEC 61000-4-2, 8KV contact discharge)

-50 100 150 200 250 300 350 400 450 0 10 20 30 40 50 60 70 80 90 Voltage ( V ) Time(ns) PESD0603MS12 Rev : www.leiditech.com 01.06.2015 2/7

10 Typical Device Capacitance VS. Frequency

11 Eye Diagram Measurement

0.01 0.02 0.03 0.04 0.05 0.06 Capacitance(pF) Frequency(Hz) HDMI Mask at 3.4 Gbps USB3.0 Mask at 5.0 Gbps PESD0603MS12 Rev : www.leiditech.com 01.06.2015 3/7

12 Soldering Parameters

Profile Feature Pb-Free Assembly Pre Heat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) 150 °C 200 °C 60-120 seconds Ramp-up Rate (TL to Tp) 3 °C/second max. Liquidus temperature (TL) Time (tL) maintained above TL 217 °C 60-150 seconds Peak package body temperature (Tp) 260+0/-5 °C Time (t p)* within 5 °C of the specified classification temperature (Tc) 30* seconds Ramp-down Rate (Tp to TL) 6 °C/second max. Time 25 °C to peak temperature 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. PESD0603MS12 Rev : www.leiditech.com 01.06.2015 4/7

Notes: This solder pad layout is for reference purposes only. L W P H Dimension Unit: Millimeters Min. Typ. Max. L 1.45 1.60 1.75 W 0.70 0.83 0.95 P 0.20 0.35 0.50 H 0.26 0.36 0.46 0.95 0.65 1.35 Recommended Solder Pad Footprint *Sizes in mm PESD0603MS12 Rev : www.leiditech.com 01.06.2015 5/7

14 Taping Specification

A B W F E P1 P2 P0 ΦD0 K T PESD0603MS12 Rev : www.leiditech.com 01.06.2015 6/7

Device Package Net Weight Carrier Quantity PESD0603MS12 0603-2L 0.12 mg Tape & Reel 15,000pcs/reel PESD0603MS12 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2015 7/7