PESD0201MV05 LEIDITECH

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RoHS Compliant Halogen Free Halogen Free Materials Information Equivalent Circuit PESD0201MV05 Surface Mount Polymeric ESD Suppressor Rev : www.leiditech.com 01.06.2015 1/8

Parameter Symbol Test Conditions Min. Typ. Max. Units Continuous Operating Voltage VDC --- --- --- 5 V Trigger Voltage VT IEC61000-4-2 8KV contact discharge --- 450 --- V Clamping Voltage VC IEC61000-4-2 8KV contact discharge --- 40 --- V Leakage Current IL DC 5V shall be applied on component --- --- 10 nA Capacitance CP Measured at 10MHz --- 0.05 --- pF ESD Pulse Withstand Pulses IEC61000-4-2 8KV contact discharge 1000 --- --- --- Notes: Trigger and clamping voltage are measured per IEC 61000-4-2, 8KV contact discharge method. Parameter Value Unit Contact Discharge Voltage Per IEC61000-4-2 8K V Air Discharge Voltage Per IEC61000-4-2 15K V Operating Temperature -55 to +125 ℃ Storage Temperature -40 to +85 ℃ General Characteristics Electrical Characteristics（TA =25° C） Rev : www.leiditech.com 01.06.2015 2/8 PESD0201MV05

Solder Heat Solderability Preconditioning Thermal Shock Bias Humidity Test Test Conditions 1. 150℃, 4H; 2. 260℃,10s,1 Times 245℃, 5s 1. 125℃, 24H; 3. 260℃ Reflow,3 Times -55℃—125℃, 30min dwell, 1000cycles 85℃, 85%RH, VDC, 1000H Pass/Fail Criteria 90% Coverage 95% Coverage IL≤10nA IL≤10nA IL≤10nA Bias Heat Test Bias Low Temp Test Vibration Mechanical Shock Solvent Resistance Test Conditions 125℃, VDC, 1000H -55℃, VDC, 1000H 10Hz-50Hz-10HZ, 2hrs each in X-Y-Z axis 1500G, 0.5ms, X-Y-Z axis 3 times IPA, ultrasonic 300s Pass/Fail Criteria IL≤10nA IL≤10nA No Physical Damage IL≤10nA No Physical Damage IL≤10nA No Physical Damage IL≤10nA Typical ESD Response （IEC 61000-4-2, 8KV contact discharge Environmental Specifications Rev : www.leiditech.com 01.06.2015 3/8 PESD0201MV05

-50 100 150 200 250 300 350 400 450 0 10 20 30 40 50 60 70 80 90 Voltage ( V ) Time（ns） 0.01 0.02 0.03 0.04 0.05 0.06 Capacitance(pF) Frequency(Hz) Typical Device Capacitance VS. Frequency Rev : www.leiditech.com 01.06.2015 4/8 PESD0201MV05

The PESD is designed for the protection of one bidirectional data line from ESD damage.  Place the PESD as close to the input terminal or connector as possible.  Minimize the path length between the PESD and the protected signal line.  Use ground planes whenever possible. GND Signal line to be protected PESD0201MV05 S USB 3.0 Host/Controller Vbus GND RX- RX+ GND TX- TX+ USB Port ESD Protection for Signal Line Eye Diagram Measurement USB3.0 Mask at 5.0 Gbps HDMI Mask at 3.4 Gbps Rev : www.leiditech.com 01.06.2015 5/8 PESD0201MV05

*Sizes in mm D b e A E L W Package outline 0.30 0.25 0.60 Dimension Unit: Millimeters Min. Max. A 0.25 0.40 b 0.15 0.20 D 0.50 0.70 E 0.25 0.35 e 0.45BSC L1 0.20 0.30 L2 0.00 0.05 Recommended Solder Pad Footprint Package Dimension Rev : www.leiditech.com 01.06.2015 6/8 PESD0201MV05

Device Package Net Weight Carrier Quantity PESD0201MV05 0201 0.12 mg Tape & Reel 15,000pcs/reel Taping Specification Order Information Rev : www.leiditech.com 01.06.2015 7/8 PESD0201MV05

Profile Feature Pb-Free Assembly Pre Heat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) 150 ° C 200 ° C 60-120 seconds Ramp-up Rate (TL to Tp) 3 ° C/second max. Liquidus temperature (TL) Time (tL) maintained above TL 217 ° C 60-150 seconds Peak package body temperature (Tp) 260+0/-5 °C Time (tp)* within 5 ° C of the specified classification temperature (Tc) 30* seconds Ramp-down Rate (Tp to TL) 6 ° C/second max. Time 25 ° C to peak temperature 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Soldering Parameters Rev : www.leiditech.com 01.06.2015 8/8 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 PESD0201MV05