PDV-C173SM ETC2

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 1

Technical content

FEATURES DESCRIPTION APPLICATIONS

  • Surface mount
  • Photoconductive
  • Low cost
  • High speed SYMBOL PARAMETER MIN MAX UNITS VBR Reverse Voltage 60 V TSTG Storage Temperature -55 +100 °C TO Operating Temperature -40 +80 °C TS Soldering Temperature* +260 °C SYMBOL CHARACTERISTIC TEST CONDITIONS MIN TYP MAX UNITS ISC Short Circuit Current H = 100 fc, 2850 K 90 μA ID Dark Current VR = 10 V 4 30 nA RSH Shunt Resistance VR = 10 mV 400 MW CJ Junction Capacitance VR = 10 V, f = 1 MHz 15 pF lrange Spectral Application Range Spot Scan 600 1050 nm VBR Breakdown Voltage I = 10 μA 60 V NEP Noise Equivalent Power VR = 10V @ l=Peak 4x10 -14 W/ √ Hz tr Response Time RL = 1KΩ,VR = 10 V 20 nS SPECTRAL RESPONSE 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 250 350 450 550 650 750 850 950 1050 1150 Wavelength (nM) Responsivity (A/W) PACKAGE DIMENSIONS INCH [mm] SURFACE MOUNT PACKAGE The PDV-C173SM is a blue enhanced PIN silicon photodiode ideal for high speed photoconductive or photovoltaic applications packaged in a red plastic surface mount package.
  • Photointerrupters
  • Oximeter sensors
  • Barcode
  • Glucometers * 1/16 inch from case for 3 seconds max. ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED **Response time of 10% to 90% is specified at 660nm wavelength light. Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice. ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED CHIP DIMENSIONS INCH [mm] PACKAGE DIMENSIONS INCH [mm] CHIP DIMENSIONS INCH [mm] SURFACE MOUNT PACKAGE .118 [3.00] SQUARE .109 [2.77] SQUARE ACTIVE AREA .079 [2.00] .158 [4.00] .085 [2.15] .197 [5.00] 130° VIEWING ANGLE .173 [4.40] .012 [0.30] .019 [0.48] .043 [1.10] .158 [4.00] 2X .020 [0.51] ANODE CATHODE CATHODE MARK SUGGESTED PAD LAYOUT FOR REFLOW SOLDERING 2X .158 [4.00] 2X .047 [1.19] .142 [3.61] Photodiode in Plastic Surface Mount Package PDV-C173SM www.lasercomponents.com Issue: 08/06 / V1 / HW / api/si-pin/plastic-encap-sm/ pdv-c173sm.pdf Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, info@lasercomponents.com Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk