PC311_15 RENESAS

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT µPC311 PRECISION VOLTAGE COMPARATOR DATA SHEET Document No. G15945EJ4V0DS00 (4th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. 1987

DESCRIPTION

The µPC311 is a voltage comparator that has input currents more than a hundred times lower than devices like conventional standard type of 710. It is also designed to operate over a wide range of supply voltages; from ±15 V op amp supplies down to the single 5 V supply used for IC logic. Its output is compatible with HNIL, DTL and TTL as well as MOS circuits.

FEATURES

  • Operate from single 5 V supply
  • Maximum input current: 250 nA
  • Maximum offset current: 50 nA
  • Fast transient response: 200 ns TYP.

ORDERING INFORMATION

µPC311C 8-pin plastic DIP (7.62 mm (300)) µPC311G2 8-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/2 Circuit) BALANCE R 1 300 R 3 1.3 k R 4 1.3 k R 5 100 D 1 3.7 k R 6 3.7 k R 8 780 R 11 340 R 14 1.3 k D 2 R 15 1.3 k R 13 250 R 18 5.4 k R 17 800 R 16 900 IN II Q 5 Q 12 Q 13 Q 23 D 3 V OUT GND V Q 21Q 14 Q 10 Q 16 Q 17 Q 9 Q 4 Q 7Q 6 Q 2 Q 8 Q 11 Q 15 Q 20 Q 19 Q 18 Q 22 Q 24 Q 1 Q 3 R 9 800 R 10 800 R 12 3.0 k R 20 5.0 k R 21 200 R 19 300 R 22 600 R 23 300 R 2 BALANCE/ STROBE PIN CONFIGURATION (Top View) PC311C, 311G2 GND I N II OUTPUT BALANCE/ STROBE BALANCE µ

Data Sheet G15945EJ4V0DS 2 µPC311 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Symbol Ratings Unit Voltage between V and V – Note 1 V − V –0.3 to +36 V Differential Input Voltage V ID ±30 V Input Voltage Note 2 V I V –0.3 to V +0.3 V Output to Negative Supply Voltage Note 3 V O − V –0.3 to +40 V Ground to Negative Supply Voltage Note 3 V GND − V –0.3 to +30 V C Package Note 4 350 mW Power Dissipation Note 5 PT 440 mW Output Short Circuit Duration Note 6 10 sec Operating Ambient Temperature T A –20 to +80 °C Storage Temperature T stg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this s pecification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output and GND terminal from external without damage or destruction. Even during t he transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –5.0 mW/°C when operat ing ambient temperature is higher than 55°C. 5. Thermal derating factor is –4.4 mW/°C when operat ing ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (Split) V ± ±4 ±16 V Supply Voltage (V = GND) V +5 +32 V TYPICAL CONNECTIONS OFFSET VOLTAGE NULL CIRCUIT STROBING CIRCUIT FAST RESPONSE CIRCUIT (INCREASING INPUT STAGE CURRENT) 3 kΩ 3 kΩ − 6 TTL, CMOS 1 kΩ

Data Sheet G15945EJ4V0DS 3 µPC311 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage V IO V − V = 5 to 30 V, RS ≤ 50 kΩ ±2.0 ±7.5 mV Input Offset Current I IO V − V = 5 to 30 V ±6.0 ±50 nA Input Bias Current I B V − V = 5 to 30 V 100 250 nA Voltage Gain A V R L = 1.0 kΩ 200,000 Response Time Input step 100 mV, Overdrive 5 mV 200 ns Output Saturation Voltage V OL V I ≤ 10 mV, IO = 50 mA 0.75 1.5 V Strobe ON Current 3.0 mA Output Leakage Current I OLEAK V I ≥ 10 mV, VO = 35 V 0.2 50 nA Positive Supply Current I I O = 0 A 5.1 7.5 mA Negative Supply Current I I O = 0 A 4.1 5.0 mA Input Offset Voltage VIO V − V = 5 to 30 V, RS ≤ 50 kΩ, TA = 0 to 70°C ±10 mV Input Offset Current I IO V − V = 5 to 30 V, TA = 0 to 70°C ±70 nA Input Bias Current I B V − V = 5 to 30 V, TA = 0 to 70°C 300 nA Common Mode Input Voltage Range VICM ±13.0 −14.5 ±13.8 −14.7 V Output Saturation Voltage V OL V ≥ 4.5 V, V = 0 V, VI ≤ −10 mV, IO = 8 mA 0.23 0.4 V TYPICAL APPLICATION CIRCUIT OPEN COLLECTOR OUTPUT EMITTER FOLLOWER OUTPUT COMPARATOR with HYSTERESIS CIRCUIT RL VO VO RL VREF GND RL VI(+) VI(−) − 4 V+ VRL OUTPUT INPUT Input polarity is reversed when 1pin (GND) is used as an output V N > VI → VO : Low Threshold Voltage VTH (High) .=. VREF + (VRL – VREF) VTH (Low) .=. VREF – (VREF – VOL) (VRL > VREF > VOL) RL + R2 + R1 R1 + R2

Data Sheet G15945EJ4V0DS 4 µPC311 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) VICM− VICM+ VICM - Common Mode Input Voltage Range - V +0.4 +0.2 −1.5 −1.0 −0.5 10 30 5020 40 70 60 TA - Operating Ambient Temperature - C COMMON MODE INPUT VOLTAGE PT - Total Power Dissipation - mW 100 200 300 400 500 600 20 40 60 TA - Operating Ambient Temperature - C POWER DISIPATION 80 100 IB - Input Bias Current - nA 100 200 300 400 500 20 40 60 TA - Operating Ambient Temperature - C INPUT BIAS CURRENT PC311G2 PC311C V= ±15 V 5, 6-8 Pin Short IIO - Input Offset Current - nA 20 40 60 TA - Operating Ambient Temperature - C INPUT OFFSET CURRENT 80 10 k VOS - Equivalent Input Offset Voltage - mV 100 100 k 1 M RS - Input Resistance - Ω OFFSET ERROR 10 M V= ±15 V 5, 6-8 Pin Short IB - Input Bias Current - nA 100 125 150 200 175 225 −16 −12 −8 −4 VID - Differential Input Voltage - V INPUT CURRENT 048 1 2 1 6 V= ±15 V REFERERED TO SUPPLY VOLTAGES VOS = VIO +RS IIO TYP. MAX.

200 C/W

227 C/W

µ µ NORMAL NORMAL

Data Sheet G15945EJ4V0DS 5 µPC311 VI - Input Voltage - mV Vo - Output Voltage - V1 100 −20 −10 0.2 0.4 0.6 t - Time - s RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES −1.0 VO - Output Volgate - V −0.5 0 0.5 V ID - Differential Input Voltage - mV TRANSFERFUNCTION 1.0 EMITTER FOLLOWER OUTPUT R L = 600 Ω NORMAL OUTPUT R L = 1 kΩ 0.2 0.4 0.6 +5 VV = ±15 V VO 500 ΩVI −10 −15 12 3 4 20 mV 2 mV 5 mV 20 mV 2 mV 5 mV 20 mV 2 mV 5 mV −10 −10 −100 −10 −100 −15 −10 −20 100 1234 VOL - Saturation Voltage - V 0.4 0.3 0.1 0.2 0.5 0.6 0.7 0.8 20 30 40 5 0 IO - Output Current - mA OUTPUT SATURATION VOLTAGE 20 mV 2 mV 5 mV V = ±15 V 2 kΩ VO VI V = ±15 V V − 2 kΩ VO VI RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES VI - Input Voltage - mVVo - Output Voltage - V t - Time - s µ µ t - Time - s µ V = 40 V+ VCC = 30 V RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES VI - Input Voltage - mVVo - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES VI - Input Voltage - mV Vo - Output Voltage - V t - Time - s µ +5 VV= ±15 V VO 500 ΩVI Overdrive = 2 mV Overdrive = 20 mV Overdrive = 20 mV 5 mV 20 mV Overdrive = 2 mV 20 mV 5 mV 5 mV 2 mV 5 mV 2 mV

Data Sheet G15945EJ4V0DS 6 µPC311 IOshort - Short Circuit Current - mA 100 120 140 51 0 1 5 VO - Output Voltage - V OUTPUT LIMITING CHARACTERISTICS

0 I - Supply Current - mA

TA - Operating Ambient Temperature - C SUPPLY CURRENT 25 35 IOLEAK - Leakage Current - A 10−8 10−9 10−10 10−11 45 55 65 75 TA - Operating Ambient Temperature - C LEAKAGE CURRENTS OUTPUT VO = 40 V INPUT V I = 15 V V = ±15 V V = ±15 V SHORT CIRCUIT CURRENT POSITIVE AND NEGATIVE SUPPLY OUTPUT HIGH POWER CONSUMPTION POSITIVE SUPPLY OUTPUT LOW POSITIVE SUPPLY OUTPUT LOW POSITIVE SUPPLY OUTPUT LOWPOSITIVE AND NEGATIVE SUPPLY OUTPUT HIGH+ 20 25 30 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Power Consumption - W

Data Sheet G15945EJ4V0DS 7 µPC311 PACKAGE DRAWINGS (Unit : mm) ITEM MILLIMETERSNOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. P8C-100-300B,C-2 N 0.25 P 0.9 MIN. R0 ∼15° A 10.16 MAX. B 1.27 MAX. F 1.4 MIN. G 3.2 ±0.3 J 5.08 MAX. K 7.62 (T.P.) C 2.54 (T.P.) D 0.50 ±0.10 H 0.51 MIN. I 4.31 MAX. L 6.4 M 0.25 +0.10 −0.05 2. ltem "K" to center of leads when formed parallel. M A RM PI J H G F DN C B 8-PIN PLASTIC DIP (7.62mm(300)) L K

Data Sheet G15945EJ4V0DS 8 µPC311 ITEM B C I 8-PIN PLASTIC SOP (5.72 mm (225)) D E F G H J P MILLIMETERS 1.27 (T.P.) 0.78 MAX. 4.4 ±0.15 0.1 ±0.1 0.42 1.59 ±0.21 6.5 ±0.3 1.49 +0.08 −0.07 1.1 ±0.2 3°+7° −3° NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. A 5.2 +0.17 −0.20 K L M N 0.6 ±0.2 0.17 0.12 0.10 +0.08 −0.07 S8GM-50-225B-6 1 4 S M C detail of lead end A M SN F G B E D P H I J K L

Data Sheet G15945EJ4V0DS 9 µPC311 RECOMMENDED SOLDERING CONDITIONS The µPC311 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC311G2: 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 230°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC311C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.

µPC311 The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1