P1N4148CS LEIDITECH
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ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) Parameter Symbol Limits Unit Peak reverse voltage V RM 90 V DC reverse voltage V R 80 V Peak forward current I FM 225 mA Mean rectifying current I O 100 mA Surge current (1s) I surge 500 mA Junction temperature Tj 125 °C Storage temperature T stg – 55 ~ +125 °C Switching diode Applications High speed switching Features 1) Extremely small surface mounting type. 2) High Speed. 3) High reliability. Construction Silicon epitaxial planar ELECTRICAL CHARACTERISTICS (Ta = 25°C) Parameter Symbol Min. Typ. Max. Unit Conditions Forward voltage V F – – 1.2 V I F =100mA Reverse current I R – – 0.1 µ AV R =80V Capacitance between terminals C T – 0.72 3.0 pF V R =0.5V , f=1MHz Reverse recovery time t rr – – 4 n s V R =6V , I F =10mA , R L =100 We declare that the material of product compliance with RoHS requirements. Device Marking Shipping 8000/Tape&Reel P1N4148CS 3 ORDRING INFORMATION S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. Rev : 01.06.2016 l/3 www.leiditech.com
100µ 10µ FORWARD VOLTAGE : V F (V) Fig.1 Forward characteristics 0.5 0.2 0.1 ELECTRICAL CHARACTERISTIC CURVES (Ta = 25°C) FORWARD CURRENT : I F (A) 0.1m 10µ 100n 10n 0 20 40 60 80 100 120 REVERSE VOLTAGE : V R (V) Fig.3 Capacitance between terminals REVERSE VOLTAGE : V R (V) Fig.2 Reverse characteristics REVERSE CURRENT : I R (A) 02 46 81 01 21 4 0.1 1 10 100 1000 10,000 CAPACITANCE BETWEEN TERMINALS : C T (pF) REVERSE RECOVERY TIME : t rr (ns) FORWARD CURRENT : I F (mA) Fig.4 Reverse recovery time characteristics 100 01 02 0 3 0 SURGE CURRENT : I surge (A) PULSE WIDTH : T W (ms) Fig.5 Surge current characteristics PULSE GENERATOR OUTPUT 50 Ω SAMPLING OSCILLOSCOPE 50Ω Fig.6 Reverse recovery time (t rr measurement circuit 5kΩ 0.01µF D.U.T. P1N4148CS Rev : 01.06.2016 2/3 www.leiditech.com
SOD−923 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM MIN NOM MAX MILLIMETERS A 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 D 0.75 0.80 0.85 E 0.55 0.60 0.65 0.95 1.00 1.05 L 0.05 0.10 0.15 H E 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.002 0.004 0.006 MIN NOM MAX INCHES D E b c A L −Y− −X− 0.08 (0.0032) XY H E 0.40 0.30 0.90 DIMENSIONS: MILLIMETERS SOLDERING FOOTPRINT* P1N4148CS Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2016 3/3 www.leiditech.com