NA556DG4

NA556 TI

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NA556...D OR N PACKAGE NE556...D, N, OR NS PACKAGE SA556...D OR N PACKAGE SE556...J PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 Two Precision Timing Circuits Per Package Astable or Monostable Operation TTL-Compatible Output Can Sink or Source up to 150 mA Active Pullup or Pulldown Designed to Be Interchangeable With Signetics NE556, SA556, and SE556 Precision Timers From Microseconds to Hours Pulse-Shaping Circuits Missing-Pulse Detectors Tone-Burst Generators Pulse-Width Modulators Pulse-Position Modulators Sequential Timers Pulse Generators Frequency Dividers Application Timers Industrial Controls Touch-Tone Encoders These devices provide two independent timing circuits of the NA555, NE555, SA555, or SE555 type in each package. These circuits can be operated in the astable or the monostable mode with external resistor-capacitor (RC) timing control. The basic timing provided by the RC time constant can be controlled actively by modulating the bias of the control-voltage input. The threshold (THRES) and trigger (TRIG) levels normally are two-thirds and one-third, respectively, of V CC These levels can be altered by using the control voltage (CONT) terminal. When the trigger input falls below trigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and the threshold input is above the threshold level, the flip-flop is reset, and the output is low. The reset (RESET) input can override all other inputs and can be used to initiate a new timing cycle. When RESET goes low, the flip-flop is reset and the output goes low. When the output is low, a low-impedance path is provided between the discharge (DISCH) terminal and ground (GND). Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 1978 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas On products compliant to MIL-PRF-38535, all parameters are Instruments standard warranty. Production processing does not tested unless otherwise noted. On all other products, production necessarily include testing of all parameters. processing does not necessarily include testing of all parameters.

www.ti.com OUT RESETVCC CONT GND DISCH THRES TRIG RESET can override TRIG, which can override THRES. NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 ORDERING INFORMATION V T (MAX) T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING V CC V PDIP N Tube of NE556N NE556N Tube of NE556D C to C 11.2 V SOIC D NE556 Reel of 2500 NE556DR SOP NS Reel of 2000 NE556NSR NE556 C to C 11.2 V PDIP N Tube of SA556N SA556N PDIP N Tube of NA556N NA556N C to 105 C 11.2 V Tube of NA556D SOIC D NA556 Reel of 2500 NA556DR SE556J SE556J C to 125 C 10.6 V CDIP J Tube of SE556JB SE556JB (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each timer) TRIGGER THRESHOLD DISCHARGE RESET OUTPUT VOLTAGE (1) VOLTAGE (1) SWITCH Low Irrelevant Irrelevant Low On High <1/3 V DD Irrelevant High Off High >1/3 V DD >2/3 V DD Low On High >1/3 V DD <2/3 V DD As previously established (1) Voltage levels shown are nominal. FUNCTIONAL BLOCK DIAGRAM, EACH TIMER Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage (2) V V I Input voltage CONT, RESET, THRES, and TRIG V CC V I O Output current 225 mA D package θ JA Package thermal impedance (3) (4) N package C/W NS package θ JC Package thermal impedance (5) (6) J package 15.05 C/W T J Operating virtual junction temperature 150 C Lead temperature 1,6 mm (1/16 in) from case for s J package 300 C Lead temperature 1,6 mm (1/16 in) from case for s or NS package 260 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. (5) Maximum power dissipation is a function of T J (max), θ JC and T C The maximum allowable power dissipation at any allowable case temperature is P D J (max) T C θ JC Operating at the absolute maximum T J of 150 C can affect reliability. (6) The package thermal impedance is calculated in accordance with MIL-STD-883. MIN MAX UNIT NA556, NE556, SA556 4.5 V CC Supply voltage V SE556 4.5 V I Input voltage CONT, RESET, THRES, and TRIG V CC V I O Output current 200 mA NA556 105 NE556 T A Operating free-air temperature C SA556 SE556 125 Submit Documentation Feedback

www.ti.com Electrical Characteristics NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 V CC V to T A C (unless otherwise noted) NA556 NE556 SE556 PARAMETER TEST CONDITIONS UNIT SA556 MIN TYP MAX MIN TYP MAX V CC V 8.8 11.2 9.4 10.6 Threshold voltage V T V level V CC V 2.4 3.3 4.2 2.7 3.3 I T Threshold current (1) 250 250 nA 4.5 5.6 4.8 5.2 V CC V T A C to 125 C V TRIG Trigger voltage level V 1.1 1.67 2.2 1.45 1.67 1.9 V CC V T A C to 125 C 1.9 I TRIG Trigger current TRIG at V 0.5 0.5 0.9 µ A 0.3 0.7 0.3 0.7 V RESET Reset voltage level V T A C to 125 C 1.1 RESET at V CC 0.1 0.4 0.1 0.4 I RESET Reset current mA RESET at V 0.4 1.5 0.4 Discharge switch I DISCH 100 100 nA off-state current 9.6 10.4 V CC V T A C to 125 C 9.6 10.4 Control voltage V CONT V (open circuit) 2.6 3.3 2.9 3.3 3.8 V CC V T A C to 125 C 2.9 3.8 0.1 0.25 0.1 0.15 V CC I OL mA T A C to 125 C 0.2 0.4 0.75 0.4 0.5 V CC I OL mA T A C to 125 C 2.5 2.2 V CC I OL 100 mA Low-level T A C to 125 C 2.7 V OL V output voltage V CC I OL 200 mA 2.5 2.5 V CC T A C to 125 C 0.35 I OL 3.5 mA 0.1 0.25 0.1 0.15 V CC I OL mA T A C to 125 C 0.8 V CC I OL mA 0.15 0.3 0.15 0.25 12.75 13.3 13.3 V CC I OH 100 mA T A C to 125 C High-level V OH V CC I OH 200 mA 12.5 12.5 V output voltage 2.75 3.3 3.3 V CC I OH 100 mA T A C to 125 C V CC V Output low, No load V CC V I CC Supply current mA V CC V Output high, No load V CC V (1) This parameter influences the maximum value of the timing resistors R and R B in the circuit of Figure For example, when V CC the maximum value is R R A R B 3.4 M Ω and for V CC the maximum value is M Ω Submit Documentation Feedback

www.ti.com Operating Characteristics NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 V CC V and V NA556 NE556 SE556 TEST PARAMETER UNIT SA556 CONDITIONS (1) MIN TYP MAX MIN TYP MAX Each timer, 0.5 1.5 (4) monostable (3) Initial error of timing T A C interval (2) Each timer, astable (5) 2.25% 1.5% Timer Timer 0.5 Each timer, 100 (4) Temperature monostable (3) coefficient of timing T A MIN to MAX ppm/ C Each timer, astable (5) 150 interval Timer Timer Each timer, 0.1 0.5 0.05 0.2 (4) Supply voltage monostable (3) sensitivity of timing T A C %/V Each timer, astable (5) 0.3 0.15 interval Timer Timer 0.2 0.1 C L pF, Output-pulse rise time 100 300 100 200 (4) ns T A C C L pF, Output-pulse fall time 100 300 100 200 (4) ns T A C (1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. (2) Timing-interval error is defined as the difference between the measured value and the average value of a random sample from each process run. (3) Values specified are for a device in a monostable circuit similar to Figure with the following component values: R A k Ω to 100 k Ω C 0.1 µ (4) On products compliant to MIL-PRF-38535, this parameter is not production tested. (5) Values specified are for a device in an astable circuit similar to Figure with the following component values: R A k Ω to 100 k Ω C 0.1 µ Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION R A R L OUT VCC (5 V to 15 V) VCCCONT RESET DISCH THRES TRIG GND OUT Input 0.01 µF C R B C R A Open (see Note A) R L OUT VCC (5 V to 15 V) VCCCONT RESET DISCH THRES TRIG GND OUT NOTE A: Bypassing the control-voltage input to ground with a capacitor might improve operation. This should be evaluated for individual applications. NA556 NE556 SA556 SE556 DUAL PRECISION TIMERS SLFS023G APRIL 1978 REVISED JUNE 2006 Figure Circuit for Astable Operation Figure Circuit for Monostable Operation Submit Documentation Feedback

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) JM38510/10902BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type NA556D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NA556DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NA556DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NA556DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NA556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NA556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE556D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE556NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE556NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA556D OBSOLETE SOIC D 14 TBD Call TI Call TI SA556DR OBSOLETE SOIC D 14 TBD Call TI Call TI SA556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SE556FKB OBSOLETE LCCC FK 20 TBD Call TI Call TI SE556J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SE556JB ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2006 Addendum-Page 1

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2006 Addendum-Page 2

MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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