MTP30X NELLSEMI
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Technical content
FEATURES
UL recognition file number E320098 Small volume, light weight Typical IR less than 2.0 µA TYPICAL APPLICATIONS General purpose use in AC/DC bridge full wave Epoxy meets UL 94 V-O flammability rating PRIMARY CHARACTERRISTICS IF(AV) Weight: 120g (4.2 ozs) 30A VRRM 800V to 1800V 1.1V 5 µA 150ºC IFSM IR VF SEMICONDUCTOR RoHS RoHS Page 1 of 3 Glass Passivated Three-Phase Bridge Rectifier, 30A Nell High Power Products Compliant to RoHS High surge current capability Low thermal resistance Small thermal resistance rectification for big power supply, field supply for DC motor, industrial automation applications. ADVANTAGE TJ max. 500A MTP30X MTP3008X Thru MTP3016X Isolation voltage up to 2500V International standard package All dimensions in millimeters Φ6.529 15.5 6.3 1 16.5 2.5
MAJOR RATINGS AND CHARACTERISTICS (T = 25°C unless otherwise noted)A PARAMETER V V SYMBOL MTP30..X UNIT 1900 900 1100 1300 1800800 1000 1200 1600 181210 16 1700 1800800 1000 1200 1600 V Maximum repetitive peak reverse voltage Peak reverse non-repetitive voltage Maximum DC blocking voltage Maximum average forward rectified output current Peak forward surge current single sine-wave superimposed on rated load Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms) for fusing RMS isolation voltage from case to leads Operating junction storage temperature range VRRM VRSM IFSM VDC IF(AV) VISO 2I t 2500 1200 -40 to 150 500 2A s A A V ºC ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)A PARAMETER V µA SYMBOL MTP30..X UNIT 08 181210 16 Maximum instantaneous forward drop per diode Maximum reverse DC current at rated DC blocking VF IR 2000 1.1 voltage per diod TEST CONDITIONS I =30AF T = 25°CA T = 150°CA THERMAL AND MECHANICAC (T = 25°C unless otherwise noted)A PARAMETER °C/W SYMBOL MTP30..X UNIT 08 181210 16 Typical thermal resistance (1) With heatsink, single side heat dissipation, half sine wave. (1)RθJC 0.44 (2) M6 screw. Notes Storage temperature range TSTG -40 to 125 ºC TJ TEST CONDITIONS junction to case Single-side heat dissipation, sine half wave Mounting ± 10 % to heatsink M6 A mounting compound is recommended and the torque should be rechecked after a for the spread period of 3 hours to allow of the compound. Nm Approximate weight 120 torque g MTP30X Device code 30 16 XMTP - Package outline: X type package - Module type: ”MTP” for 3Ø Brıdge RRM - Voltage code: code x 100 = V I rating: "30" for 30AF(AV)
Fig.1 Forward characteristic Fig.2 Thermal lmpedance (junction to case) Fig.3 Power dissipation vs. output current Fig.4 Case temperature vs output current Fig.5 Forward surge current vs. cycle 2Fig.6 I t characteristic Case Temperature (°C) Output current (A) Forward current (A) Time (s) Time (ms) Cycle @ 50Hz Forward surge current (KA) Forward voltage drop (V) Transient thermal impedance (°C/W) Power dissipation (W) Output Current (A) 2 3 2I t (10 A S) Tj=150°C 3.5 2.5 1.5 0.5 10 100 1000 0.5 0.4 0.3 0.2 0.1 0.001 0.01 0.1 1 10 0 5 10 15 20 25 30 35 0 20 40 60 80 100 120 140 160 0.6 0.5 0.4 0.3 0.2 0.1 1 10 100 1.4 1.2 0.8 0.6 0.4 0.2 1 10 MTP30X