MTP2N50 ISC

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 IscN-ChannelMOSFETTransistor MTP2N50

  • FEATURES
  • Withlowgatedrive requirements
  • Easytodrive
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 500 V VGSS Gate-SourceVoltage ±20 V ID DrainCurrent-Continuous@TC=100℃ 2 A IDM DrainCurrent-SinglePulsed 10 A PD TotalDissipation 75 W Tj OperatingJunctionTemperature -55~150 ℃ Tstg StorageTemperature -55~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 1.36 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 62.5 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 IscN-ChannelMOSFETTransistor MTP2N50 ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=0.25mA 500 V VGS(th) GateThresholdVoltage VDS=±20V;ID=0.25mA 2.0 4.5 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=1.0A 4.0 Ω IGSS Gate-SourceLeakageCurrent VGS= ±20V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=500V;VGS=0V;TJ=25℃ VDS=400V;VGS=0V;TJ=25℃ 250 1000 μA VSDF Diodeforwardvoltage ISD=2.0A,VGS =0V 1.3 V