MTP150D NELLSEMI

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UL recognition file number E320098 Small volume, light weight Typical IR less than 2.0 µA TYPICAL APPLICATIONS General purpose use in AC/DC bridge full wave Epoxy meets UL 94 V-O flammability rating PRIMARY CHARACTERRISTICS IF(AV) Weight : 300g (10.6 ozs) 150A VRRM 800V to 1800V 1.2V 20 µA 150ºC IFSM IR VF RoHS RoHS Three-Phase Bridge Rectifier, 150A Nell High Power Products Compliant to RoHS High surge current capability Low thermal resistance Small thermal resistance rectification for big power supply, field supply for DC motor, industrial automation applications. ADVANTAGE TJ max. 1500A MTP150D Series MTP15008D Thru MTP15018D Isolation voltage up to 2500V International standard package ( MTP150-08 Thru MTP150-18 ) www.nellsemi.com Page 1 of 3 80.00 25.00 26.00 26 .00 ~~~ 94.0 72.0 5-M6 Screw 30.0 3.0 All dimensions in millimeters Ø6.5 6.5 18.0

MAJOR RATINGS AND CHARACTERISTICS (T = 25°C unless otherwise noted)A PARAMETER V V SYMBOL MTP150..D UNIT 1900 900 1100 1300 1800800 1000 1200 1600 181210 16 1700 1800800 1000 1200 1600 V Maximum repetitive peak reverse voltage Peak reverse non-repetitive voltage Maximum DC blocking voltage Maximum average forward rectified output current Peak forward surge current single sine-wave superimposed on rated load Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms) for fusing RMS isolation voltage from case to leads Operating junction storage temperature range VRRM VRSM IFSM VDC IF(AV) VISO 2I t 2500 11250 150 -40 to 150 1500 2A s A A V ºC ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)A PARAMETER V µA SYMBOL MTP150..D UNIT 08 18 1210 16 Maximum instantaneous forward drop per diode Maximum reverse DC current at rated DC blocking VF IR 6000 1.20 voltage per diod TEST CONDITIONS I = 150AF T = 25°CA T = 150 °CA THERMAL AND MECHANICAC (T = 25°C unless otherwise noted)A PARAMETER °C/W SYMBOL MTP150..D UNIT 08 18 1210 16 Typical thermal resistance (1) With heatsink, single side heat dissipation, half sine wave. (1)RθJC 0.14 Notes Storage temperature range TSTG -40 to 125 ºC TJ TEST CONDITIONS junction to case Single-side heat dissipation, sine half wave Mounting ± 10 % to heatsink M6 A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound. Nmto terminal M6 5 Approximate weight 300 torque g - 1 - Package Outline: D type package RRM Device code 150 16 D 3 4 MTP - Voltage code: code x 100 = V I rating: "150" for 150AF(AV) (MTP15016D=MTP150-16) MTP150D Series Module type: “MTP” for 3 BridgeΦ www.nellsemi.com Page 2 of 3

Fig.1 Forward current vs. Forward voltage Fig.2 Thermal lmpedance (junction to case) Fig.3 Power consumption vs. Avergage current Fig.4 Case temperature vs On-state average Fig.5 Forward surge current vs. cycle 2Fig.6 I t characteristic Case temperature (°C) On-state average currentt (A) Peak on-state current (A) Time (s) Time (ms) Cycle @ 50Hz Forward surge current (KA) peak on-state voltage (V) Transient thermal impedance (°C/W) On-state power consumption (W) On-state average current (A) 2 2I t (KA S) 3.5 2.5 1.5 0.5 10 100 1000 0.15 0.12 0.09 0.06 0.03 0.001 0.01 0.1 1 10 600 500 400 300 200 100 0 50 100 150 200 160 140 120 100 0 25 50 75 100 125 150 175 1.6 1.4 1.2 0.8 0.6 0.4 1 10 100 1 10 current www.nellsemi.com Page 3 of 3