MR2A16A ETC
Document overview
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- PDF pages: 16
Technical content
Features
- Single 3.3-V power supply Commercial temperature range (0°C to 70°C) Symmetrical high-speed read and write with fast access time (25 ns) Flexible data bus control — 8 bit or 16 bit access Equal address and chip-enable access times Automatic data protection with low-voltage inhibit circuitry to prevent writes on power loss All inputs and outputs are transistor-transistor logic (TTL) compatible Fully static operation Full nonvolatile operation with 10 years minimum data retention
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Figure 1. Block Diagram Figure 2. MR2A16A in 44-Pin TSOP Type II Package Table 1. Pin Functions
greater than maximum rated voltages to these high-impedance (Hi-Z) circuits. Table 2. Operating Modes
- H = high, L = low, X = don’t care
Table 3. Absolute Maximum Ratings
- Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation
could affect device reliability.
- All voltages are referenced to V
- Power dissipation capability depends on package characteristics and use environment.
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Table 4. Operating Conditions
- After power up or if V DD falls below VWI, a waiting period of 1 µs must be observed.
Memory is designed to prevent writing for all input pin conditions if V DD falls below minimum VWI. Table 5. dc Characteristics Table 6. Power Supply Characteristics
20 I DDR TBD TBD mA
25 I DDR TBD TBD mA
35 I DDR TBD TBD mA
20 I DDW TBD TBD mA
25 I DDW TBD TBD mA
35 I DDW TBD TBD mA
20 I SB1 TBD TBD mA
25 I SB1 TBD TBD mA
35 I SB1 TBD TBD mA
Figure 3. Output Load for ac Test Table 7. Capacitance
- (f = 1.0 MHz, dV = 3.0 V, T A = 25°C, periodically sampled rather than 100% tested)
Table 8. ac Measurement Conditions
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Table 9. Read Cycle Timing (See Notes 1 and 2)
- W is high for read cycle.
- Due to product sensitivities to noise, power supplies must be properly grounded and decoupled and bus contention
conditions must be minimized or eliminated during read and write cycles.
- Addresses valid before or at the same time E goes low.
- This parameter is sampled and not 100% tested.
- Transition is measured ±200 mV from steady-state voltage.
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Table 10. Write Cycle Timing 1 (W Controlled; See Notes 1, 2, 3, and 4)
- A write occurs during the overlap of E low and W low.
- Due to product sensitivities to noise, power supplies must be properly grounded and decoupled and bus contention
conditions must be minimized or eliminated during read and write cycles.
- If G goes low at the same time or after W goes low, the output will remain in a high-impedance state.
- After W , E, or UB/LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns.
- This parameter is sampled and not 100% tested.
- Transition is measured ±200 mV from steady-state voltage.
- At any given voltage or temperature, t
- All write cycle timings are referenced from the last valid address to the first transition address.
Figure 6. Write Cycle 1 (W Controlled)
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Table 11. Write Cycle Timing 2 (E Controlled; See Notes 1,2,3, and 4)
- A write occurs during the overlap of E low and W low.
- Due to product sensitivities to noise, power supplies must be properly grounded and decoupled and bus contention
conditions must be minimized or eliminated during read and write cycles.
- If G goes low at the same time or after W goes low, the output will remain in a high-impedance state.
- After W , E, or UB/LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns.
- If E goes low at the same time or after W goes low, the output will remain in a high-impedance state.
- If E goes high at the same time or before W goes high, the output will remain in a high-impedance state.
- All write cycle timings are referenced from the last valid address to the first transition address.
Figure 7. Write Cycle 2 (E Controlled)
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Table 12. Write Cycle Timing 3 (LB /UB Controlled; See Notes 1, 2, 3, 4, and 5)
- A write occurs during the overlap of E low and W low.
- Due to product sensitivities to noise, power supplies must be properly grounded and decoupled and bus contention
conditions must be minimized or eliminated during read and write cycles.
- If G goes low at the same time or after W goes low, the output will remain in a high-impedance state.
- After W , E, or UB/LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns.
- If both byte control signals are asserted, the two signals must have no more than 2 ns skew between them.
- All write cycle timings are referenced from the last valid address to the first transition address.
Figure 8. Write Cycle 3 (LB /UB Controlled)
MR2A16A/D, Rev. 0.1
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Ordering Information
(Order by Full Part Number) MR 2 A 16 A TS 25 C Freescale MRAM Memory Prefix Density Code (2 = 4 Mb, 4 = 16 Mb) Memory Type (A = Asynch, S = Sync) Timing Set Package Type (TS = TSOP) Revision (A = rev 1) I/O Configuration (08 = 8 bits, 16 = 16 bits) Commercial Device Numbers — MR2A16ATS25C Operating Temperature Range (C = 0 ° C to 70° C) MR2A16ATS35C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSIONS DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.15 PER SIDE. 4. DIMENSIONS DO NOT INCLUDE DAMBAR PROTRUSIONS. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.58. ÉÉÉÉÉ É ÉÉÉ É ÉÉÉÉÉ BM0.2 C B A C 44 23 12 2 1.05 EE 10.29 18.54 42X 44X 0.1 C SEATING PLANE 22X 11.96
1.20 MAX
0.15 0.60 0.45 ROTATED 90 CLOCKWISE VIEW D
40 PLACES
SECTION E–E /C0095 0.21 AM0.2 C 0.8 10.03 3 18.28 0.95 11.56 0.8 0.30 0.12 0.05 /C0095 /C00955 0.40
MR2A16A/D, Rev. 0.1 Freescale Semiconductor 15 This page is intentionally blank
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