MPX5999D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated - Data sheet
Document overview
- Manufacturer or author: Freescale Semiconductor, Inc.
- PDF pages: 8
Technical content
Features
- Temperature Compensated Over 0 to 85 C
- Ideally Suited for Microprocessor or Microcontroller-Based Systems
- Patented Silicon Shear Stress Strain Gauge
- Durable Epoxy Unibody Element
ORDERING INFORMATION
No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package MPX5999D 867 • • MPX5999D MPX5999D 0 to 1000 kPa (0 to 150 psi) 0.2 to 4.7 V Output Unibody package Case 867 123 456 Top view VCC VOUT GND Pinout N/C N/C N/C
2 Freescale Semiconductor, Inc.
1 Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in 1.1.0 kPa (kiloPascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. specified step change in pressure.
- Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
2 Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. Figure 1. Fully Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1) 1.Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2.This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
4 Freescale Semiconductor, Inc.
3 On-Chip Temperature Comp ensation and Calibration
of the specified pressure range. calibration and signal conditioning circuitry onto a single monolithic chip. surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 2. Output vs. Pressure Differential Figure 3. Cross-Sectional Diagrams (not to scale) Figure 4. Recommended Power Supply Decoupling and Output Filtering
Freescale Semiconductor, Inc. 5
4 Pressure (P1)/Vacuum (P2) Side Identification Table
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number Case Type Pressure (P1) Side Identifier MPX5999D 867 Stainless Steel Cap
6 Freescale Semiconductor, Inc.
5 Package Dimensions
Style 1, Style 2, and Style 3 pinouts listed in the figure above do not apply to the MPXV5999D. For the correct pinout, see the pin connection diagram located on Page 1. PIN 1 F G N L R 123456
6 PLD
MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
6 Revision History
Table 1. Revision History 7 01/2015 • Updated data sheet format.
- Added Pinout.
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