MPX5010 Datasheet | DigiCamel IC Datasheet

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Online Datasheet

Read the NXP Semiconductors document online.

Integrated silicon pressure sensor on-chip signal conditioned,

Document overview

Manufacturer or author: NXP B.V.
PDF pages: 32

Technical content

Datasheet sections

1 General description
2 Features and benefits
3 Applications
4 Ordering information
4.1 Ordering options
5 Block diagram
6 Pinning information
6.1 Pinning - Unibody packages
6.2 Pin description - Unibody packages
6.3 Pinning - Small Outline packages
6.4 Pin description - Small Outline packages
7 Limiting values
8 Recommended operating conditions
9 On-chip temperature compensation and
10 Pressure (P1) / Vacuum (P2) side
11 Minimum recommended footprint for
12 Package outline
13 Revision history

Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Rev. 14 — 17 May 2024 Product data sheet

1 General description

The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing.

2 Features and benefits

5.0% maximum error over 0° to 85° C
Ideally suited for microprocessor or microcontroller-based systems
Durable epoxy unibody and thermoplastic (PPS) surface mount package
Temperature compensated over –40° to +125° C
Patented silicon shear stress strain gauge
Available in differential and gauge configurations
Available in surface mount (SMT) or through-hole (DIP) configurations

3 Applications

Hospital beds
HVAC
Respiratory systems
Process control
Washing machine water level measurement (Reference AN1950)
Ideally suited for microprocessor or microcontroller-based systems
Appliance liquid level and pressure measurement

NXP Semiconductors MPX5010-MPXV5010-MPVZ5010 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated

4 Ordering information

Unibody package (MPX5010 series) MPX5010DP SENSOR4F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.48 mm x 10.67 body SOT1756-1 MPX5010GP SENSOR6F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.47 mm x 8.01 mm body SOT1852-1 Small outline package (MPXV5010 series) MPXV5010DP S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x 12.06 mm x 7.62 mm body SOT1693-1 MPXV5010GC6T1 S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x 10.67 mm x 12.96 mm body SOT1854-1 MPXV5010GC7U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x 10.67 mm x 12.96 mm body SOT1863-1 MPXV5010GP S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x 12.06 mm x 7.62 mm body SOT1693-3 Small outline package (Media resistant gel) (MPVZ5010 series) MPVZ5010GW6U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 mm x 1.99 mm body SOT1691-2 MPVZ5010GW7U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 mm x 1.99 mm body SOT1691-1 Table 1. Ordering information

4.1 Ordering options

ORDERING INFORMATION

# of Ports Pressure Type Device Name Case No. None Single Dual Gauge Differential Absolute Device Marking Unibody Package (MPX5010 Series) MPX5010DP 867C • • MPX5010DP MPX5010GP 867B • • MPX5010GP Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • • MPXV5010DP MPXV5010GC6T1 482A • • MPXV5010G MPXV5010GC7U 482C • • MPXV5010G MPXV5010GP 1369 • • MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010GW6U 1735 • • MZ5010GW MPVZ5010GW7U 1560 • • MZ5010GW Table 2. Ordering options MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

5 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully Integrated Pressure Sensor Schematic

6 Pinning information

6.1 Pinning - Unibody packages

Figure 2. MPX5010DP - SOT1756-1 - Case 867C-05 Figure 3. MPX5010GP - SOT1852-1 - Case 867B-04 MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

6.2 Pin description - Unibody packages

This table defines the pin configuration for the Unibody packages indentified in Table 1. Table 3. Pin descriptions - Unibody pacakages

6.3 Pinning - Small Outline packages

Figure 4. MPXV5010DP - SOT1693-1 - Case 1351-01 Figure 5. MPXV5010GC6T1 - SOT1854-1 - Case 482A-01 Figure 6. MPXV5010GC7U - SOT1863-1 - Case 482C-03 MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Figure 7. MPXV5010GP - SOT1693-3 - Case 1369-01 Figure 8. MPVZ5010GW6U - SOT1691-2 - Case 1735-01 Figure 9. MPVZ5010GW7U - SOT1691-1 - Case 1560-02

6.4 Pin description - Small Outline packages

This table defines the pin configuration for the Small Outline packages indentified in Table 1. Table 4. Pin descriptions - Small Outline packages MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

7 Limiting values

Table 5. Limiting values[1] [1] Exposure beyond the specified limits may cause permanent damage or degradation to the device.

8 Recommended operating conditions

Table 6. Recommended operating conditions [1] Device is ratiometric within this specified excitation range. [2] Offset (Voff) is defined as the output voltage at the minimum rated pressure. [3] Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

[7] Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. [8] Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

9 On-chip temperature compensation and calibration

compensation, calibration and signal conditioning circuitry onto a single monolithic chip. transmitted to the sensor diaphragm. microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 11. The output will saturate outside of the specified pressure range. Figure 10. Cross-sectional diagram SOP (not to scale) Figure 11. Recommended power supply decoupling and output filtering Note: For additional output filtering, please refer to Application Note AN1646. MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Figure 14. Pressure error band

10 Pressure (P1) / Vacuum (P2) side identification table

pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 7. Table 7. Pressure (P1) side identification MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

11 Minimum recommended footprint for surface mounted applications

must be the correct size to ensure proper solder connection interface between the board and the package. recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.

0.100 TYP 8X

0.060 TYP 8X

company name where appropriate.

Section 4, Table 1 and Section 4.1 Table 2, removed devices MPX5010GS, MPX5010GSX, MPXV5010G6U, MPXV5010GC6U, MPVZ5010G7U, and MPVZ5010 G6U.
Section 8, Table 6, Sensitivity Unit: Revised "mV/mm" to "mV/kPa". MPX5010 v.13 October 2012 • Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and MPVZ5010G6U/6T1 throughout the document.

NXP Semiconductors MPX5010-MPXV5010-MPVZ5010 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 14 — 17 May 2024

NXP Semiconductors MPX5010-MPXV5010-MPVZ5010 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 14 — 17 May 2024

NXP Semiconductors MPX5010-MPXV5010-MPVZ5010 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Tables Figures Fig. 1. Fully Integrated Pressure Sensor Fig. 4. MPXV5010DP - SOT1693-1 - Case Fig. 5. MPXV5010GC6T1 - SOT1854-1 - Case Fig. 6. MPXV5010GC7U - SOT1863-1 - Case Fig. 7. MPXV5010GP - SOT1693-3 - Case Fig. 8. MPVZ5010GW6U - SOT1691-2 - Case Fig. 9. MPVZ5010GW7U - SOT1691-1 - Case Fig. 11. Recommended power supply decoupling MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 14 — 17 May 2024

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Summary

Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Rev. 14 - 17 May 2024

Description

Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Rev. 14 - 17 May 2024

Source title MPX5010_V01 Datasheet(PDF) - NXP Semiconductors

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