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MPL115A1, Miniature SPI digital barometer, 50 kPa to 115 kPa - data sheet

Document overview

Manufacturer or author: NXP B.V.
PDF pages: 23

Technical content

Datasheet sections

1 General description
2 Features
3 Applications
4 Ordering information
4.1 Ordering options
5 Block diagram
6 Pinning information
6.1 Pinning
6.2 Pin description
7 Handling and board mount
7.1 Methods of handling
7.2 Board mount recommendations
8 Functional description
8.1 Pressure, temperature, and coefficient bit-
8.2 Compensation
8.3 Evaluation sequence, arithmetic circuits
8.4 SPI device read/write operations
8.5 SPI timing
8.6 Example of SPI reading of coefficients
8.7 Example of pressure compensated
9 Maximum ratings
10 Mechanical and electrical characteristics
11 Package outline
12 Packing information
13 Soldering
14 Soldering/landing pad information
15 Revision history

Miniature SPI digital barometer, 50 kPa to 115 kPa Rev. 8.1 — 17 May 2024 Product data sheet

1 General description

The MPL115A1 is an absolute pressure sensor with a digital SPI output targeting low-cost applications. A miniature 5 x 3 x 1.2 mm LGA package is ideally suited for the space constrained requirements of portable electronic devices. Low current consumptions of 5 μA during Active mode and 1 μA during Shutdown (Sleep) mode are essential when focusing on low-power applications. The wide operating temperature range spans from –40 °C to +105 °C to fit demanding environment conditions. The MPL115A1 employs a MEMS pressure sensor with a conditioning IC to provide accurate pressure measurements from 50 kPa to 115 kPa. An integrated ADC converts pressure and temperature sensor readings to digitized outputs via a SPI port. Factory calibration data is stored internally in an onboard ROM. Utilizing the raw sensor output and calibration data, the host microcontroller executes a compensation algorithm to render Compensated Absolute Pressure with ±1 kPa accuracy. The MPL115A1 pressure sensor’s small form factor, low-power capability, precision, and digital output optimize it for barometric measurement applications.

2 Features

Digitized pressure and temperature information together with programmed calibration coefficients for host micro use.
Factory calibrated
50 kPa to 115 kPa absolute pressure
±1 kPa accuracy
2.375 V to 5.5 V supply
Integrated ADC
SPI Interface
Monotonic pressure and temperature data outputs
Surface mount RoHS compliant package

3 Applications

Barometry (portable and desktop)
Altimeters
Weather stations
Hard-disk drives (HDD)
Industrial equipment
Health monitoring
Air control systems

4 Ordering information

Table 1. Ordering information

4.1 Ordering options

Table 2. Ordering options

5 Block diagram

6 Pinning information

6.1 Pinning

Figure 2. Pin configuration

6.2 Pin description

1 VDD Power Supply Connection. VDD range is 2.375 V to 5.5 V. ceramic capacitor to ground.

3 GND Ground

4 SHDN

impedance. Connect to VDD for normal operation.

6 DOUT Serial data output

7 DIN Serial data input

Table 3. Pin description

7 Handling and board mount recommendations

accuracy of pressure measurement. Avoid such exposure to the port during normal operation.

7.1 Methods of handling

NXP Semiconductors MPL115A1 Miniature SPI digital barometer, 50 kPa to 115 kPa configurations to suit a variety of component geometries. To select the nozzle best suited for the specific application, NXP recommends that the customer consult their pick and place equipment supplier to determine the correct nozzle. In some cases, it may be necessary to fabricate a special nozzle depending on the equipment and speed of operation. Tweezers or other mechanical forms of handling that have a sharp point are not recommended since they can inadvertently be inserted into the vent hole of the device. These handling methods can lead to a puncture of the MEMS element that renders the device inoperable.

7.2 Board mount recommendations

Components can be mounted using solder paste stencil, screen printed or dispensed onto the PCB pads prior to placement of the component. The volume of solder paste applied to the PCB is normally sufficient to secure the component during transport to the subsequent reflow soldering process. Use of adhesives to secure the component is not recommended, but where necessary can be applied to the underside of the device. Solder pastes are available in variety of metal compositions, particle size, and flux types. The solder paste consists of metals and flux required for a reliable connection between the component lead and the PCB pad. Flux aids the removal of oxides that may be present on PCB pads and prevents further oxidation from occurring during the solder process. The use of a No-Clean (NC) flux is recommended for exposed cavity components. Using pressure spray, wire brush, or other methods of cleaning is not recommended since it can puncture the MEMS device and render it unusable. If cleaning of the PCB is performed, Water Soluble (WS) flux can be used. NXP recommends protecting the component cavity using adhesive Kapton tape, vinyl cap, or other means prior to the cleaning process. This covering prevents damage to the MEMS device, contamination, and foreign materials from being introduced into device cavity as result of cleaning processes. Ultrasonic cleaning is not recommended as the frequencies can damage wire bond interconnections and the MEMS device. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 8.1 — 17 May 2024

8 Functional description

Figure 3. Sequence flowchart device then enters Standby mode. memory but can be re-read at any time. necessary to read this multiple times because the coefficients within a device are constant and do not change. However, note that the coefficients are different from device to device, and cannot be used for another part. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

pressure reading or it may go to the Shutdown step. state, the Pressure and Temperature registers are reset, losing any previous ADC output values. Table 11), after which another pressure reading can be taken by transitioning to the data Conversion step. Table 4. Device memory map [1] This register is set to 00h. It is reserved, and was previously utilized as Coefficient values, c11 and c22, which were always 00h. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

8.1 Pressure, temperature, and coefficient bit-width specifications

specifications for Pressure and Temperature ADC values. Table 5. Pressure, temperature, and compensation coefficient specifications Note: Negative coefficients are coded in two’s complement notation.

8.2 Compensation

NXP Semiconductors MPL115A1 Miniature SPI digital barometer, 50 kPa to 115 kPa

8.3 Evaluation sequence, arithmetic circuits

The following is an example of the calculation for Pcomp, the compensated pressure output. Input values are in bold. c12x2 = c12 * Tadc a1 = b1 + c12x2 a1x1 = a1 * Padc y1 = a0 + a1x1 a2x2 = b2 * Tadc Pcomp = y1 + a2x2 This can be calculated as a succession of Multiply Accumulates (MACs) operations of the form y = a + b * x: aaa-044109 a y+ b X x The polynomial can be evaluated (Equation 1) as a sequence of 3 MACs: c12 Tadc Padc b2 PComp Tadc y aaa-044110 Refer to NXP application note AN3785 for more detailed notes on implementation.

8.4 SPI device read/write operations

All device read/write operations are memory mapped. Device actions, for example, "Start Conversions" are controlled by writing to the appropriate memory address location. All memory address locations are 6-bit (see Table 2). The 8-bit command word comprises: MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 8.1 — 17 May 2024

the most significant bit which is the Read/Write identifier which is '1' for read operations and '0' for write operations.
the 6-bit address (from Table 4);
the least significant bit which is not used and is don't care (X). The device write commands are shown in Table 6. Legend: X = don't care Command Binary HEX[1] Start Conversions 0010010X 24h

Table 6. SPI write command [1] The command byte must be paired with a 00h as part of the SPI exchange to complete the passing of Start Conversions. registers with the result. Shut down main circuits and clock. Table 7. SPI Write command description operations require that each byte be addressed individually. All data is transmitted most significant bit first. Table 8. Example SPI Read Commands [1] The command byte must be paired with a 00h as part of the SPI exchange to complete the passing of stated command.

8.5 SPI timing

Table 9 and Figure 4 describe the timing requirements for the SPI system.

1 Of Operating Frequency — 8 MHz

Table 9. SPI timing...continued Figure 4. SPI timing diagram

8.6 Example of SPI reading of coefficients

Pressure reading is given in floating point notation. Note: Extra [00h] at the end of each sequence to output the last data byte on the client side of the SPI. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Figure 7. SPI read results datagram

8.7 Example of pressure compensated calculation in floating-point notation

9 Maximum ratings

Table 10. Maximum ratings

10 Mechanical and electrical characteristics

2 Supply Current IDD

3 Range 50 — 115 kPa

5 Accuracy –20 ºC to 85 ºC — — ±1 kPa

6 Conversion Time

7 Wake-up Time tw Time between leaving Shutdown

issue a command or read data. Table 11. Mechanical and electrical characteristics MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

8 SCLK Clock Frequency fSCLK

12 High-level Output Voltage VOH1 At 3 mA source current VDD

Table 11. Mechanical and electrical characteristics...continued [1] Nominal maximum SPI clock frequency. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

12 Packing information

(lV) Other material available. Dimensions are in millimeters. Figure 10. LGA (3 x 5) embossed carrier tape dimensions Figure 11. Device orientation in chip carrier MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

13 Soldering

Use SAC solder alloy, Sn-Ag-Cu, with a melting point of about 217 °C. NXP recommends using SAC305,

Ramp up rate: 2 °C/s to 3 °C/s.
Preheat flat (soak): 110 s to 130 s.
Reflow peak temperature: 250 °C to 260 °C (depends on exact SAC alloy composition).
Time above 217°C: 40 s to 90 s (depends on board type, thermal mass of the board/quantities in the reflow).
Ramp down: 5 °C/s to 6 °C/s.
Using an inert reflow environment (with O2 level about 5 ppm to 15 ppm). Note: The stress level and signal offset of the device also depends on the board type, board core material, board thickness, and metal finishing of the board.

14 Soldering/landing pad information

Revised cover page image.
MPL115A1 v.8.1 is a product data sheet, updated the document status terminology from the former "Technical data" status to "Product data sheet" status.
Performed minor grammatical and typographical corrections throughout.
Updated the document formatting, revision history and legal information sections to comply with new NXP documentation guidelines.
Updated all images to conform to NXP image standards and assigned graphic iddentifiers to each image.
Changed all references of "slave" to "client" to conform to the NXP inclusive language intiative.
Section 11, split the package outline images into separate figures. MPL115A1 v.8 10 Ocotber 2017 • MPL115A1 v.8 supercedes MPL115A1 v.7.
MPL115A1 v.8 is a product data sheet.
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Removed the first paragraph of Section 7.
Added Section 7.1 and Section 7.2 in Section 7 "Handling and board mount recommendations"
Updated Figure 8. No technical changes. MPL115A1 v.7 February 2013 • MPL115A1 v.7 supercedes prior version of MPL115A1.
MPL115A1 v.7 is a product data sheet.
Changed Example Binary format definitions b1 signed from 7 to 13, added F11 to Coeff b1, b2, and c12 on page 6.
Removed MPL115A1T2 from ordering table.

NXP Semiconductors MPL115A1 Miniature SPI digital barometer, 50 kPa to 115 kPa Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 8.1 — 17 May 2024

NXP Semiconductors MPL115A1 Miniature SPI digital barometer, 50 kPa to 115 kPa Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. Suitability for use in industrial applications (functional safety) — This NXP product has been qualified for use in industrial applications. It has been developed in accordance with IEC 61508, and has been SIL-classified accordingly. If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 8.1 — 17 May 2024

NXP Semiconductors MPL115A1 Miniature SPI digital barometer, 50 kPa to 115 kPa Tables Tab. 5. Pressure, temperature, and compensation Figures Fig. 9. Package outline notes SOT1769-1 Fig. 10. LGA (3 x 5) embossed carrier tape MPL115A1 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 8.1 — 17 May 2024

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Miniature SPI digital barometer, 50 kPa to 115 kPa Rev. 8.1 - 17 May 2024

Description

Miniature SPI digital barometer, 50 kPa to 115 kPa Rev. 8.1 - 17 May 2024

Source title MPL115A1_V01 Datasheet(PDF) - NXP Semiconductors

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