MMZ09312BT1 400-1000 MHz, 31.7 dB, 29.6 dBm InGaP HBT Linear Amplifier Data Sheet
Document overview
- Manufacturer or author: Freescale Semiconductor
- PDF pages: 28
Technical content
Features
Frequency: 400- -1000 MHz P1dB: 29.6 dBm @ 900 MHz Power Gain: 31.7 dB @ 900 MHz OIP3: 42 dBm @ 900 MHz Active Bias Control (adjustable externally) Single 3 to 5 V Supply Performs Well with Digital Predistortion Systems Single- -ended Power Detector Cost- -effective 12- -pin, 3 mm QFN Surface Mount Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. Table 1. Typical Performance(1)
- VCC1 =V CC2 =V BIAS =5V d c ,TA =2 5C, 50 ohm system, CW
Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2011- -2012, 2014.All rights reserved.
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VCC1 =V CC2 =V BIAS = 5 Vdc, 900 MHz, TA =2 5C, 50 ohm system, in Freescale CW Table 5. ESD Protection Characteristics Table 6. Moisture Sensitivity Level Figure 1. Functional Block Diagram Figure 2. Pin Connections
Freescale Semiconductor, Inc. Figure 3. MMZ09312B Test Circuit Schematic — CDMA IS- -95, 900 MHz, 5.0 V Table 7. MMZ09312B Test Circuit Component Designations and Values — CDMA IS- -95, 900 MHz, 5.0 V Note: Component numbers C6, C7, C8, C9 and R3 are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 4. MMZ09312B Test Circuit ComponentLayout — CDMA IS- -95, 900 MHz, 5.0 V (1) VBIAS [Board] supplies VBA1,V BA2 and VBIAS [Device]. Note: Component numbers C6*, C7*, C8*, C9* and R3* are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 12. MMZ09312B Test Circuit Schematic — UMTS/LTE, 900 MHz, 5.0 V Table 8. MMZ09312B Test Circuit Component Designations and Values — UMTS/LTE, 900 MHz, 5.0 V Note: Component numbers C6, C7, C8, C9 and R3 are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 13. MMZ09312B Test Circuit Component Layout — UMTS/LTE, 900 MHz, 5.0 V (1) VBIAS [Board] supplies VBA1,V BA2 and VBIAS [Device]. Note: Component numbers C6*, C7*, C8*, C9* and R3* are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 17. Power Gain and Power Added Figure 18. ACPR versus Output Power Figure 19. Power Detector Output versus
1.75 VCC1 =V CC2 =V BIAS =5V d c
Freescale Semiconductor, Inc. Figure 20. MMZ09312B Test Circuit Schematic — CDMA IS- -95, 900 MHz, 3.3 V Table 9. MMZ09312B Test Circuit Component Designations and Values — CDMA IS- -95, 900 MHz, 3.3 V Note: Component numbers C6, C7, C8, C9 and R3 are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 21. MMZ09312B Test Circuit ComponentLayout — CDMA IS- -95, 900 MHz, 3.3 V (1) VBIAS [Board] supplies VBA1,V BA2 and VBIAS [Device]. Note: Component numbers C6*, C7*, C8*, C9* and R3* are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 29. MMZ09312B Test Circuit Schematic — UMTS/LTE, 900 MHz, 3.3 V Table 10. MMZ09312B Test Circuit Component Designations and Values — UMTS/LTE, 900 MHz, 3.3 V Note: Component numbers C6, C7, C8, C9 and R3 are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 30. MMZ09312B Test Circuit Component Layout — UMTS/LTE, 900 MHz, 3.3 V (1) VBIAS [Board] supplies VBA1,V BA2 and VBIAS [Device]. Note: Component numbers C6*, C7*, C8*, C9* and R3* are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 37. MMZ09312B Test Circuit Schematic — ZigBee, 450 MHz, 5.0 V Table 11. MMZ09312B Test Circuit Component Designations and Values — ZigBee, 450 MHz, 5.0 V Note: Component numbers C6, C7, C8, C9 and R3 are labeled on board but not placed.
Freescale Semiconductor, Inc. Figure 38. MMZ09312B Test Circuit Component Layout — ZigBee, 450 MHz, 5.0 V (1) VBIAS [Board] supplies VBA1,V BA2 and VBIAS [Device]. Note: Component numbers C6*, C7*, C8*, C9* and R3* are labeled on board but not placed.
Freescale Semiconductor, Inc. MMZ09312BT1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMZ09312BT1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2011 Initial Release of Data Sheet 1 Feb. 2012 Typical Performance table: changed Pout at 750 MHz from 19.5 to 17.5 dBm to reflect recent performance measurements, p. 1 Figs. 3, 12 and 21, MMZ09312B Test Circuit Schematic: corrected L1 inductor label in test circuit schematics, pp. 3, 7 and 11 2 Dec. 2014 Typical Performance table: added 900 MHz, 1C W- -CDMA TM1 and 900 MHz, 10 MHz LTE TM1.1, p. 1 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Added application circuit for UMTS/LTE, 900 MHz,5.0 V as follows: schematic, component designations and values, component layout, and typical characteristic performance graphs, pp. 7- -10 Added application circuit for UMTS/LTE, 900 MHz,3.3 V as follows: schematic, component designations and values, component layout, and typical characteristic performance graphs, pp. 15- -18 Fig. 46, Product Marking: updated date code line to reflect improved traceability information, p. 23 Added Failure Analysis information, p. 27
Freescale Semiconductor, Inc. MMZ09312BT1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2011- -2012, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMZ09312B Rev. 2, 12/2014