MMG3008NT1 0-6000 MHz, 18.5 dB, 15 dBm InGaP HBT GPA Data Sheet
Document overview
- Manufacturer or author: Freescale Semiconductor
- PDF pages: 14
Technical content
Features
Frequency: 0 to 6000 MHz P1dB: 15 dBm @ 900 MHz Small- -Signal Gain: 18.5 dB @ 900 MHz Third Order Output Intercept Point: 26 dBm @ 900 MHz Single 5 V Supply Internally Matched to 50 Ohms Cost- -effective SOT- -89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. SOT- -89 1 2 3 Table 1. Typical Performance(1) Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2005- -2008, 2012, 2014.All rights reserved.
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VCC = 5 Vdc, 900 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit)
- For reliable operation, the junction temperature should not exceed 150C.
Table 5. Functional Pin Description
1 RFin
2 Ground
3 RFout/DC Supply
Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Functional Diagram
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Small- -Signal Gain (S21) versus Figure 3. Input/Output Return Loss versus Figure 4. Small- -Signal Gain versus Output Figure 5. P1dB versus Frequency Figure 6. Collector Current versus Collector Figure 7. Third Order Output Intercept Point
1 MHz Tone Spacing
900 MHz
2140 MHz
1960 MHz
2600 MHz
3500 MHz
Freescale Semiconductor, Inc. Figure 8. Third Order Output Intercept Point Figure 9. Third Order Output Intercept Point Figure 10. Third Order Intermodulation Distortion Figure 11. MTTF versus Junction Temperature Figure 12. Noise Figure versus Frequency Figure 13. Single- -Carrier W- -CDMA Adjacent
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40- -300 MHz
Figure 14. 50 Ohm Test Circuit Schematic Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 300- -3600 MHz
Figure 17. 50 Ohm Test Circuit Schematic Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Table 10. Common Emitter S- -Parameters(VCC =5V d c ,TA =2 5C, 50 Ohm System)
Freescale Semiconductor, Inc. Table 10. Common Emitter S- -Parameters(VCC =5V d c ,TA =2 5C, 50 Ohm System)(continued)
Freescale Semiconductor, Inc. MMG3008NT1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMG3008NT1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 3 Mar. 2007 Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS compliant part numbers, pp. 6, 7 4 July 2007 Replaced Case Outline 1514- -01 with 1514- -02, Issue D, pp. 1, 11- -13. Case updated to add missing dimension for Pin 1 and Pin 3. 5 Mar. 2008 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 13, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power y- -axis (ACPR) unit of measure to dBc, p. 5 Corrected S- -Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 8, 9 6 Feb. 2012 Corrected temperature at which ThetaJC is measured from 25Ct o8 6C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 3 Removed ICC bias callout from applicable graphs and Table10, Common Emitter S- -Parameters heading as bias is not a controlled value, pp. 4- -9 Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14 7 Sept. 2014 Added Fig. 21, Product Marking, p. 9 LIFETIME BUY LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
Freescale Semiconductor, Inc. MMG3008NT1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2005- -2008, 2012, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMG3008NT1 Rev. 7, 9/2014