MMG3005NT1 800-2200 MHz, 15 dB, 30 dBm InGaP HBT GPA Data Sheet
Document overview
- Manufacturer or author: Freescale Semiconductor
- PDF pages: 20
Technical content
Features
Frequency: 800- -2200 MHz P1dB: 30 dBm @ 2140 MHz Small- -Signal Gain: 15 dB @ 2140 MHz Third Order Output Intercept Point: 47 dBm @ 2140 MHz Single 5 V Supply Internally Prematched to 50 Ohms In Tape and Reel. T1 Suffix = 1,000 Units, 16 mm Tape Width, 13- -inch Reel. 800- -2200 MHz, 15 dB 30 dBm InGaP HBT GPA PQFN 5 5 Table 1. Typical Performance(1)
- VDC =5V d c ,TA =2 5C, 50 ohm system, application circuit
tuned for specified frequency. Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2005- -2011, 2014.All rights reserved.
Table 4. Electrical Characteristics(VDC = 5 Vdc, 2140 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. Functional Pin Description requires a DC- -blocking series capacitor. and requires a DC- -blocking series capacitor. VCC 14 Collector voltage supply. Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Pin Connections
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Collector Current versus Bias Voltage Figure 3. Third Order Output Intercept Point Figure 4. MTTF versus Junction Temperature
50 OHM APPLICATION CIRCUIT: 900 MHz
Figure 5. 50 Ohm Test Circuit Schematic Table 8. 50 Ohm Test Circuit Component Designations and Values
Figure 6. 50 Ohm Test Circuit Component Layout
50 OHM TYPICAL CHARACTERISTICS: 900 MHz
Figure 7. Small- -Signal Gain (S21) versus Figure 8. Input Return Loss (S11) versus Figure 9. Output Return Loss (S22) versus Figure 10. P1dB versus Frequency Figure 11. Third Order Output Intercept
1 MHz Tone Spacing
Figure 12. Noise Figure versus Frequency
Figure 13. IS- -95 Adjacent Channel Power Ratio Figure 14. IS- -95 Adjacent Channel Power Ratio
50 OHM APPLICATION CIRCUIT: 1800- -2200 MHz
Figure 15. 50 Ohm Test Circuit Schematic Table 9. 50 Ohm Test Circuit Component Designations and Values
Figure 16. 50 Ohm Test Circuit Component Layout
50 OHM TYPICAL CHARACTERISTICS: 1800- -2200 MHz
Figure 17. Small- -Signal Gain (S21) versus Figure 18. Input Return Loss (S11) versus Figure 19. Output Return Loss (S22) versus Figure 20. P1dB versus Frequency Figure 21. Third Order Output Intercept Figure 22. Noise Figure versus Frequency
Figure 23. IS- -95 Adjacent Channel Power Ratio Figure 24. IS- -95 Adjacent Channel Power Ratio Figure 25. Single- -Carrier W- -CDMA Adjacent
Table 10. Common Emitter S- -Parameters(VDC =5V d c ,TA =2 5C, 50 Ohm System)
Table 10. Common Emitter S- -Parameters(VDC =5V d c ,TA =2 5C, 50 Ohm System)(continued)
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier Biasing AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 3 Mar. 2007 Replaced Case Outline 1543- -02 with updated 1543- -03, Issue C, pp. 1, 16- -18 Added VCC callout to Pin Connections 10, 11, and12 in Fig. 1, Pin Connections, p. 3 Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part numbers, p. 5 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 5, 50 Ohm Test Circuit Component Layout, 900 MHz, p. 6 Removed IDC value due to its variability over temperature, Figs. 12- -13, IS- -95 Adjacent Channel Power Ratio versus Output Power, 900 MHz, p. 8 Updated Part Numbers in Table 9, Component Designations and Values, 1800- -2200 MHz, to RoHS compliant part numbers, p. 9 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 15, 50 Ohm Test Circuit Component Layout, 1800- -2200 MHz, p. 10 Removed IDC value due to its variability over temperature, Figs. 22- -23, IS- -95 Adjacent Channel Power Ratio versus Output Power, 1800- -2200 MHz, and Fig. 24, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power, 1800- -2200 MHz, p. 12 Added Product Documentation and Revision History, p. 19 4 Feb. 2008 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Changed Table 4, Electrical Characteristics Supply Current Min value from 455 mA to 420 mA, p. 2 Corrected S- -Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 13, 14 5 Apr. 2008 Corrected Tape and Reel information from 12 mm, 7- -inch Reel to 16 mm, 13- -inch Reel, p. 1 Corrected Fig. 24, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power y- -axis (ACPR) unit of measure to dBc, p. 12 6 June 2009 Replaced Case Outline 1543- -03, Issue C, with 1543- -04, Issue D, pp. 1, 16- -18. Corrected I/O dimension Corrected temperature at which ThetaJC is measured from 25C to 100C, Thermal Characteristics table, p. 1 7 May 2010 Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current, p. 4 Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation, Application Notes, p. 19 Added .s2p File availability to Product Software, p. 19
REVISION HISTORY (continued) Revision Date Description 8 Jan. 2011 Corrected temperature at which ThetaJC is measured from 25C to 100C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Removed IDC bias callout from Table 10, Common SourceS- -Parameters heading as bias is not a controlled value, pp. 13- -14 Added Printed Circuit Boards availability to Development Tools, p. 19 9 Oct. 2014 Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 2 Added Fig. 27, Product Marking, p. 14 Added Failure Analysis information, p. 18
Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2005- -2011, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMG3005NT1 Rev. 9, 10/2014