MMG3001NT1 40-3600 MHz, 20 dB, 18.5 dBm InGaP HBT Data Sheet

Document overview

  • Manufacturer or author: Freescale Semiconductor
  • PDF pages: 14

Technical content

Features

 Frequency: 40- -3600 MHz  P1dB: 18.5 dBm @ 900 MHz  Small- -Signal Gain: 20 dB @ 900 MHz  Third Order Output Intercept Point: 32 dBm @ 900 MHz  Single Voltage Supply  Internally Matched to 50 Ohms  Cost- -effective SOT- -89 Surface Mount Plastic Package  In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. SOT- -89 1 2 3 Table 1. Typical Performance(1) Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955.  Freescale Semiconductor, Inc., 2004- -2008, 2012, 2014.All rights reserved.

Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VCC = 5.6 Vdc, 900 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. Functional Pin Description

1 RFin

2 Ground

3 RFout/DC Supply

Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Functional Diagram

Freescale Semiconductor, Inc.

50 OHM TYPICAL CHARACTERISTICS

Figure 2. Small- -Signal Gain (S21) versus Figure 3. Input/Output Return Loss versus Figure 4. Small- -Signal Gain versus Output

1960 MHz

900 MHz

3500 MHz

2140 MHz

Figure 5. P1dB versus Frequency Figure 6. Collector Current versus Collector Figure 7. Third Order Output Intercept Point

2600 MHz

Freescale Semiconductor, Inc. Figure 8. Third Order Output Intercept Point Figure 9. Third Order Output Intercept Point Figure 10. Third Order Intermodulation Distortion Figure 11. MTTF versus Junction Temperature Figure 12. Noise Figure versus Frequency Figure 13. Single- -Carrier W- -CDMA Adjacent

8 Vdc Supply with 43ΩDropping Resistor

Freescale Semiconductor, Inc.

50 OHM APPLICATION CIRCUIT: 40- -800 MHz

Figure 14. 50 Ohm Test Circuit Schematic Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values Table 9. Supply Voltage versus R1 Values Note: To provide VCC = 5.6 Vdc and ICC = 58 mA at the device.

Freescale Semiconductor, Inc.

50 OHM APPLICATION CIRCUIT: 800- -3600 MHz

Figure 17. 50 Ohm Test Circuit Schematic Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 10. 50 Ohm Test Circuit Component Designations and Values

Freescale Semiconductor, Inc. Table 11. Common Emitter S- -Parameters(VCC =5 . 6V d c ,TA =2 5C, 50 Ohm System)

Freescale Semiconductor, Inc. Table 11. Common Emitter S- -Parameters(VCC =5 . 6V d c ,TA =2 5C, 50 Ohm System)(continued)

Freescale Semiconductor, Inc. MMG3001NT1 PACKAGE DIMENSIONS

Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MMG3001NT1

Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following resources to aid your design process. Application Notes  AN1955: Thermal Measurement Methodology of RF Power Amplifiers  AN3100: General Purpose Amplifier and MMIC Biasing Software  .s2p File For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 5 Mar. 2007  Corrected and updated Part Numbers in Tables 8 and 10, Component Designations and Values, to RoHS compliant part numbers, pp. 6, 7 6 July 2007  Replaced Case Outline 1514- -01 with 1514- -02, Issue D, pp. 1, 11- -13. Case updated to add missing dimension for Pin 1 and Pin 3. 7 Mar. 2008  Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1  Corrected Fig. 13, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power y- -axis (ACPR) unit of measure to dBc, p. 5  Corrected S- -Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 8, 9 8 Feb. 2012  Corrected temperature at which ThetaJC is measured from 25C to 123C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1  Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 3  Removed ICC bias callout from applicable graphs and Table 11, Common Emitter S- -Parameters heading as bias is not a controlled value, pp. 4- -9  Added .s2p File availability to Product Software, p. 14 9 Oct. 2014  Added Fig. 21, Product Marking, p. 9  Added Failure Analysis information, p. 13 LIFETIME BUY LAST ORDER 24 MAY 14LAST SHIP 24 MAY 15

Freescale Semiconductor, Inc. MMG3001NT1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arising outof the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2004- -2008, 2012, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMG3001NT1 Rev. 9, 10/2014