MK3200

MK3200 RENESAS

Document overview

• Manufacturer or author: mamiller
• PDF pages: 9

Technical content

Features

• Packaged in 8-pin SOIC or 8-pin MSOP (3.00 mm body)
• Pb (lead) free package
• Operates from 2.5 V to 5 V
• Consumes only 3.5 µA in normal operation
• Accepts an inexpensive 32.768 kHz crystal input
• Offers power down mode
• Includes an Output Enable pin to tri-state the output for in-c ircuit testing
• Advanced, low power, sub-micron CMOS process
• For other 32.768 kHz-based clocks with MHz outputs, plea se consult IDT
• Industrial temperature version available Block Diagram Crystal Oscillator 32.768 kHz Clock OE VDD GND 32.768 kHz Crystal Power Down

32.768 KHZ CLOCK OSCILLATOR 32 KHZ OSCILLATOR

IDT® 32.768 KHZ CLOCK OSCILLATOR 2 MK3200 REV H 073012 Pin Assignment Power Down Select Table Output Enable Select Table 0 = connect directly to GND. 1 = connect directly to VDD. Pin Descriptions VDD GND GND 32.768k PD OE X21 8-pin (150 mil) SOIC or 8-pin MSOP (3.00 mm body) PD 32.768k Oscillator 0 On On 1L o w O f f OE 32.768k Oscillator

0 Tri state (Hi-Z) On

1 X1 Input Crystal connection. Connect to a 32.768 kHz crystal. 2 VDD Power Connect to +3.3 V. 3 GND Power Connect to ground. 4 32.768k Input 32.768 kHz clock output. 5 OE Output Output Enable. 6 PD Input Power down pin. Turns off entire chip when high. 7 GND Input Connect to ground. 8 X2 Output Crystal connection. Connect to a 32.768 kHz crystal.

IDT® 32.768 KHZ CLOCK OSCILLATOR 3 MK3200 REV H 073012 External Components Series Termination Resistor Clock output traces over one inch should use series termination. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. Decoupling Capacitor As with any high-performance mixed-signal IC, the MK3200 must be isolated from system power supply noise to perform optimally. A decoupling capacitor of 0.01µF must be connected between VDD and the PCB ground plane. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. Th e 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to th e g round via. Distance of the ferrite bead and bulk decoupling from the device is less critical. 2) T o minimize EMI, the 33Ω series termination resistor (if needed) should be placed close to the clock output. An op timum layout is one with all components on the sam e side of the board, minimizing vias through other signal la yers. Other signal traces should be routed away from the MK3 200. This includes signal traces just underneath the d evice, or on layers adjacent to the ground plane layer used b y the device. 4) T he input crystal must be connected as close to the chip as possible. The input crystal should be a parallel mode cr ystal with a 12 pF load capacitance.

IDT® 32.768 KHZ CLOCK OSCILLATOR 4 MK3200 REV H 073012 Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK3200. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Recommended Operation Conditions Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C Parameter Condition Min. Typ. Max. Units Supply Voltage, VDD Referenced to GND 7 V Inputs Referenced to GND -0.5 VDD+ 0.5 V Clock Outputs Referenced to GND -0.5 VDD+ 0.5 V Storage Temperature -65 150 ° C Soldering Temperature Max 10 seconds 260 ° C Junction Temperature 125 ° C Parameter Min. Typ. Max. Units Ambient Operating Temperature -40 +85 ° C Power Supply Voltage (measured in respect to GND) +3.15 +3.3 +3.45 V Parameter Symbol Conditions Min. Typ. Max. Units Operating Voltage VDD 2.375 5.250 V Supply Current IDD No load, OE=1 3.5 μA PD = 0 3.5 μA Output High Voltage (CMOS level) VOH IOH = -1.5 mA VDD-0.4 V Output High Voltage V OH IOH = -3 mA 2.4 V Output Low Voltage V OL IOL = 3mA 0.4 V Short Circuit Current I OS ±6 mA

IDT® 32.768 KHZ CLOCK OSCILLATOR 5 MK3200 REV H 073012 Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C Thermal Characteristics (8SOIC) Thermal Characteristics (8MSOP) Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency FIN 32.768 kHz Output Rise Time t OR 20% to 80%, Note 1 8 ns Output Fall Time tOF 80% to 20%, Note 1 8 ns Duty Cycle at VDD/2 40 50 60 % Input Crystal Accuracy 0 ±30 ppm Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 135 ° C/W θJA 1 m/s air flow 93 ° C/W θJA 3 m/s air flow 78 ° C/W Thermal Resistance Junction to Case θJC 60 ° C/W Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θ JA Still air 95 ° C/W Thermal Resistance Junction to Case θJC 48 ° C/W

IDT® 32.768 KHZ CLOCK OSCILLATOR 6 MK3200 REV H 073012 Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body) Package dimensions are kept current with JEDEC Publication No. 95 INDEX AREA 1 2 D E1 E SEATING PLANE A AA e - C - b aaa C c L *For reference only. Controlling dimensions in mm. Millimeters Inches* Symbol Min Max Min Max A- - 1 . 1 0 - - 0 . 0 4 3 A1 0 0.15 0 0.006 A2 0.79 0.97 0.031 0.038 b 0.22 0.38 0.008 0.015 C 0.08 0.23 0.003 0.009 D 3.00 BASIC 0.118 BASIC E 4.90 BASIC 0.193 BASIC E1 3.00 BASIC 0.118 BASIC e 0.65 Basic 0.0256 Basic L 0.40 0.80 0.016 0.032 α 0° 8° 0° 8° aaa - 0.10 - 0.004

IDT® 32.768 KHZ CLOCK OSCILLATOR 7 MK3200 REV H 073012 Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Part / Order Number Marking Shipping Packaging Package Temperature MK3200SLF MK3200SL Tubes 8-pin SOIC 0 to +70 ° C MK3200SLFTR MK3200SL Tape and Reel 8-pin SOIC 0 to +70 ° C MK3200SILF MK3200IL Tubes 8-pin SOIC -40 to +85° C MK3200SILFTR MK3200IL Tape and Reel 8-pin SOIC -40 to +85 ° C MK3200GLF 3200GL Tubes 8-pin MSOP 0 to +70 ° C MK3200GLFT 3200GL Tape and Reel 8-pin MSOP 0 to +70 ° C INDEX AREA 1 2 D E SEATING PLANE A e - C - B .10 (.004) C C L H h x 45 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0 . 3 30 . 5 1. 0 1 3. 0 2 0 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0 . 2 50 . 5 0. 0 1 0. 0 2 0 L 0 . 4 0 1 . 2 7. 0. 0 5 0 α 0° 8° 0° 8°

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