MCL4154_12 VISHAY

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
  • PDF pages: 4

Technical content

www.vishay.com Vishay Semiconductors Rev. 1.9, 01-Aug-12 1 Document Number: 85568 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Small Signal Fast Switching Diode MECHANICAL DATA Case: MicroMELF Weight: approx. 12 mg Cathode band color: black Packaging codes/options: TR3/10K per 13" reel (8 mm tape), 10K/box TR/2.5K per 7" reel (8 mm tape), 12.5K/box

FEATURES

  • Silicon epitaxial planar diode
  • Electrical data identical with the device 1N4154
  • MicroMELF package
  • AEC-Q101 qualified
  • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Extreme fast switches PARTS TABLE PART TYPE DIFFERENTIATION ORDERING CODE INTERNAL CONSTRUCTION REMARKS MCL4154 V RRM = 35 V MCL4154-TR3 or MCL4154-TR Single diode Tape and reel ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Repetitive peak reverse voltage V RRM 35 V Reverse voltage V R 25 V Peak forward surge current t p = 1 μs I FSM 2A Repetitive peak forward current I FRM 450 mA Forward continuous current I F 200 mA Average forward current V R = 0 I FAV 150 mA Power dissipation P tot 500 mW THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Thermal resistance junction to ambient air Mounted on epoxy-glass hard tissue, Fig. 4, 35 μm copper clad, 0.9 mm copper area per electrode RthJA 500 K/W Junction temperature T j 175 °C Storage temperature range T stg - 65 to + 175 °C

www.vishay.com Vishay Semiconductors Rev. 1.9, 01-Aug-12 2 Document Number: 85568 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 1 - Reverse Current vs. Junction Temperature Fig. 2 - Forward Current vs. Forward Voltage Fig. 3 - Diode Capacitance vs. Reverse Voltage Fig. 4 - Board for RthJA definition (in mm) ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Forward voltage I F = 30 mA V F 1000 mV Reverse current VR = 25 V I R 100 nA VR = 25 V, Tj = 150 °C I R 100 μA Breakdown voltage IR = 5 μA, tp/T = 0.01, tp = 0.3 ms V(BR) 35 V Diode capacitance VR = 0 V, f = 1 MHz, VHF = 50 mV CD 4p F Reverse recovery time IF = IR = 10 mA, iR = 1 mA trr nsIF = 10 mA, VR = 6 V, iR = 0.1 x IR, RL = 100  2 0 40 80 120 160 0.01 0.1 100 I- R e verse Current (µA)R Tj - Junction Temperature (°C) 200 94 9154 VR = 25 V Scattering Limit 0 0.4 0.8 1.2 1.6 0.1 100 1000 I- F o rward Current (mA)F V - Forward Voltage (V) 2.0 94 9152 F T = 25 °Cj T = 100 °Cj 0.1 1 10 0.5 1.0 1.5 2.0 3.0 C - Diode Capacitance (pF)D VR - Reverse Voltage (V) 100 94 9156 2.5 f = 1 MHz Tj = 25 °C 2.5 0.71 1.3 1.27 9.9 0.152 0.355 95 10329

www.vishay.com Vishay Semiconductors Rev. 1.9, 01-Aug-12 3 Document Number: 85568 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters (inches): MicroMELF Cathode indification surface plan1 (0.039) glass glass surface plan 2 (0.079) 1.8 (0.071) 0.25 (0.010) 0.15 (0.006) 1.2 (0.047) 1.1 (0.043) > R2.5 (0.098) < 1.35 ( 0.053) 0.6 (0.024 Foot print recommendation: Reflow soldering Wa ve soldering 1.2 (0.047) 0.8 (0.031) 1.4 (0.055) 1 (0.039) Document no.:6.560-5007.01-4 Rev. 13 - Date: 07.June.2006 96 12072 Created - Date: 26.July.1996 The gap between plug and glass can be either on cathode or anode side

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