MC306 ETC
Document overview
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Technical content
Specifications (characteristics) Recommended soldering patternExternal dimensions (Unit: mm) Do not connect #2 and #3 to external device. Internal connection (Unit: mm) #4 #4 #3 #1 #2 0.5 5.5 (0.9) (0.9) 1.9 3.22.38 2.54 max. 3.8 max. 8.0 max. 32.768k 571E 1.3 1.9 1.31.9 1.3 4.2 Series resistance MC-306
- High-density mounting-type SMD. Photolithography finished allows uniform and stable performance.
- Excellent reliability and environmental capability.
- 2.54mm thickness is equal to SMD-type IC. Item Nominal frequency Temperature range Maximum drive level Soldering condition Frequency tolerance (standard) Peak temperature (frequency) Temperature coefficient (frequency) Load capacitance Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging Shock resistance Symbol f TSTG TOPR GL TSOL Df/f qT a CL IR fa S.R. Specifications 32.768 kHz 20.000 kHz to 165.000 kHz -55˚C to +125˚C -40˚C to +85˚C 1.0µW max. Twice at under 260˚C within 10 sec. or under 230˚C within 3 min. ±20ppm, ±50ppm ±50ppm, ±100ppm 25˚C ±5˚C -0.04ppm/˚C2 max. 6pF to ∞ 50 kΩ max. 55 k Ω to 10 kΩ 1.8fF typ. 4.0fF to 0.6fF 0.9pF typ. 2.0pF to 0.6pF 500 MΩ min. ±3ppm/Y max. ±5ppm/Y max. ±5ppm max. Remarks Stored as bare product after unpacking Ta=25˚C, DL=0.1µW Please specify As per below table Ta=25˚C ±3˚C, first year Three drops on a hard board from 75 cm or excitation test with 3000G x 0.3ms x 1/2 sine wave x 3 directions Storage temperature Operating temperature Actual size Frequency (kHz) Series resonance resistance (Ω ) 20 ≤ f < 30 55K Ω max. 30 ≤ f < 40 45K Ω max. 40 ≤ f < 60 20K Ω max. 60 ≤ f < 70 15K Ω max. 70 ≤ f < 120 12K Ω max. 120 ≤ f < 165 10K Ω max. SMALL SMD LOW / MEDIUM-FREQUENCY CRYSTAL UNIT There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material. http://www.spezial.cz - - - spezial@ spezial.cz - - - Hotlines: Tel (02) 2434 2200 - - - Fax (02) 2434 3200